BORON Search Results

crystal HCJ

Abstract: HCJ crystal si 13003 br crystal hcj 30 motor 42SH power supply for magnetron optical pickup unit iron bh curve hdd motor hitachi hitachi optical pickup
Contextual Info: Neodymium-Iron-Boron Magnets NEOREC series Issue date: December 2008 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

NEOREC55

Contextual Info: 高特性ネオジム磁石 NEOREC55シリーズ High Performance Neodymium-Iron-Boron Magnets NEOREC55 series M-03 製品の小型・軽量化を可能とする高性能磁石 独自の低酸素プロセスと粉体制御技術により磁気特性を大幅にアップした Nd-Fe-B 系焼結磁石です。高い

Contextual Info: Series X57X - Quick-Release Universal Zero Insertion Force DIP Test Socket ORDERING INFORMATION XX-X57X-1X Plating: 0=Tin over Nickel 0TL=Tin/Lead over Nickel 1=Gold over Nickel 6=Nickel Boron Plated Spinodal 8=hi-temp. socket* No. of pins: 24, 28, 32, 36,

Contextual Info: Series X57X - Quick-Release Universal Zero Insertion Force DIP Test Socket ORDERING INFORMATION XX-X57X-1X Plating: 0=Tin over Nickel 0TL=Tin/Lead over Nickel 1=Gold over Nickel 6=Nickel Boron Plated Spinodal 8=hi-temp. socket* No. of pins: 24, 28, 32, 36,

a13514

Abstract: D149 D150 D2240 D257 D412 E595
Contextual Info: TgardTM 200 Series Thermally Conductive Insulators Innovative Technology for a Connected World High Performance Thermal Interface Products The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride composite, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric

Outgassing

Abstract: E180840 ASTM D2240 CVCM 200 SERIES ADHESIVE GAP PAD ASTM-E595 astm D150 Tpli
Contextual Info: Laird Technologies Web site: www.LairdTech.com Item # Tpli 215, Tpli 200 Series Gap Filler Material Tpli™ 200 Series Gap Filler Material Industry Leading Soft Elastomer Gap Filler Tpli 200 Series™ is the premium gap filler. An unique blend of boron nitride and silicone produce Laird Technologies'

Contextual Info: CHEMTRONICS CW7250 Technical Data Sheet CircuitWorks Boron Nitride Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Boron Nitride Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. The material

Contextual Info: Material Declaration BH13-1-XXXLF Total mass of unit = 0.8395g Material Location Matelial Name Substrate Alminum ceramic Substance Name Aluminum oxide Silica Magnesium oxide Thick film Metals and oxides Silver Lead monoxide Ⅱ Silica Boron trioxide Zinc oxide

DP460

Abstract: D1876 epoxy thinner Outgassing 5589H Outgass DP-460 ADHESIVE GAP PAD TC2810+37ML
Contextual Info: Technical Data January, 2010 3M Thermally Conductive Epoxy Adhesive TC-2810 Product Description 3M™ Thermally Conductive Epoxy Adhesive TC-2810 is a boron nitride filled, two-part, thermally conductive epoxy adhesive. Key Features • Improved thermal conductivity.

ASTM D2240, D412

Abstract: A1556 D149 D150 D2240 D257 D412 E595 A15561-00
Contextual Info: T-gardTM 200 Series Thermally Conductive Insulators Innovative Technology for a Connected World High Performance Thermal Interface Products The T-gard 200 is a high performance interface pad. Consisting of silicon/boron composites, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric strength

Contextual Info: TgardTM 200 Series Thermally Conductive Insulators HIGH PERFORMANCE THERMAL INTERFACE PRODUCTS The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride composite, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric

Thermagon

Abstract: WARTH E1808 Orcus ASTM D412 D149 D150 D2240 D257 D412
Contextual Info: T-flex 600 Series T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in

Contextual Info: Series X57X - Quick-Release Universal Zero Insertion Force DIP Test Socket ORDERING INFORMATION XX-X57X-1X Plating: 0=Tin over Nickel 0TL=Tin/Lead over Nickel 1=Gold over Nickel 6=Nickel Boron Plated Spinodal 8=hi-temp. socket* No. of pins: 24, 28, 32, 36,

Contextual Info: Super Thermal Grease Designed for use with heat sinks to effectively dissipate heat generated by electronic devices and circuitry. Ideally used to cool CPUs when over clocking , chipset and graphics cards. Formulated with Boron Nitride, this grease gives super high thermal conductivity without

Contextual Info: RoHS CS32SP Silicon Diode with Silicon Oxide Passivation in a Copper Pill Package Product Environmental Data Sheet CS32SP Semiconductor Silicon Chip – Oxide Passivated Silicon with Boron Doping CAS 1E-10 Silicon Gold Plated Contact 7400-21-3 Contact CS32SP - Package

NEOREC55

Abstract: NEOREC-50
Contextual Info: M-03 A1 594mm x 841mm 高特性ネオジム磁石 NEOREC55シリーズ High Performance Neodymium-Iron-Boron Magnets NEOREC55 series 新製品 M-03 製品の小型・軽量化を可能とする高性能磁石 独自の低酸素プロセスと粉体制御技術により磁気特性を大幅にアップした Nd-Fe-B 系焼結磁石です。高い残留

Contextual Info: Cylindrical Neodymium Magnet Part Number : M1219-3 Product Data Sheet DIMENSIONS PICTURE 4 0.158 3 (0.118) Drawings not to scale All dimensions in mm nominal SPECIFICATION Gauss strength at surface 3200 Magnet Material Neodymium Iron Boron Operating Temperature

Contextual Info: Series X57X - Quick-Release Universal Zero Insertion Force DIP Test Socket ORDERING INFORMATION XX-X57X-1X Plating: 0=Tin over Nickel 0TL=Tin/Lead over Nickel 1=Gold over Nickel 6=Nickel Boron Plated Spinodal 8=hi-temp. socket* No. of pins: 24, 28, 32, 36,

D149

Abstract: D150 D2240 D257 D412 E595 astm D150
Contextual Info: TpliTM 200 Series Gap Filler Innovative Technology for a Connected World Exceptionally soft, highly compressible gap filler Tpli 200 is a premium gap filler. A unique blend of boron nitride and silicone produce the highest performing interface pad. Tpli™ 200’s exceptional combination of high thermal conductivity and compliancy

D150

Abstract: D2240 D257 D412 E595 D149 TPLITM220
Contextual Info: T-pli 200 Series Gap Filler global solutions : local support ™ T-pliTM 200 Series Gap Filler Features and Benefits: Exceptionally soft, highly compressible gap filler • Thermal performance leader T-pli™ 200 is a premium gap filler. A unique blend of boron

NEOREC-50

Abstract: NEOREC55
Contextual Info: 高特性ネオジム磁石 NEOREC55シリーズ High Performance Neodymium-Iron-Boron Magnets NEOREC55 series 新製品 E&E-06 製品の小型・軽量化を可能とする高性能磁石 独自の低酸素プロセスと粉体制御技術により磁気特性を大幅にアップした Nd-Fe-B 系焼結磁石です。高い残留

"modem applications" -56k 56kbps

Abstract: DFM4100 DFM4200 afe 1000 ATMOS Virata
Contextual Info: Boron Product Profile Data Sheet June 2000 KEY FEATURES Description Single Chip Broadband Access Modem Boron is a single-chip solution for fast Internet access. It extends Virata’s ATOM device technology, delivering a product-on-a-chip, enabling highly-integrated G.992.1 and G.992.2 interoperable and compatible ADSL equipment.

HCJ crystal

Abstract: crystal HCJ NEOREC46HF crystal hcj 30 NEOREC45SH motor 42SH HCJ 33.33 crystal HCJ 33.33 M koe sheet optical pickup unit
Contextual Info: Neodymium-Iron-Boron Magnets NEOREC series Issue date: May 2010 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

neodymium

Abstract: gunther neodymium magnet AE043 M1219-10
Contextual Info: FORM AE043 ISS1 PRODUCT DATA SHEET Comus Group of Companies Supplied by 2.0 .079 22.0 (.866) Drawings not to scale All dimensions in mm (inches) SPECIFICATION Magnet material Surface flux measurement (gauss) Grade/Energy density Operating temperature Neodymium Iron Boron (NdFeB) Nickel plated