BLISTER Search Results

s08b

Contextual Info: Temic S e m i c o n d u c t o r s Tape and Reel Standards Taping of SMT Devices T E M IC 's Transistors in SM D packages are available in an antistatic 8 m m blister tape in accordance w ith DIN IEC 2 6 8 -3 lo r autom atic com ponent insertion. The blister tape is a plastic strip w ith im pressed com ponent

PX0911

Abstract: copper alloy crimp Flex pcb spec UL94V-HB
Contextual Info: Never Beaten by Seasons Buccaneer For Power Frozen Winters! Torrential Springs! Blistering Summers! Dusty Autumns! The Buccaneer range of IP68 waterproof connectors for power applications up to 32A, 600V. elektron components A trading name of the Elektron Components Ltd

WICKMANN FUSE 195

Abstract: code 14 16
Contextual Info: S URFACE MOUNT FUSES WICKMANN SMQ / No. 417/418 UL 248-14, 125V 125V, F Specifications Time-Current Characteristic Packaging Quick Acting F 000: Blister Tape (1000 pcs.) Standard Materials UL 248-14 CSA C22.2 No. 248.14 Housing: Element: Terminals: Approvals

B82432-A1224-K

Abstract: 6690 AS B82432A1224K B82432-A1274-K siemens 90 98
Contextual Info: SMO EMI Suppression Chokes HF choke» for surface mounting Chip inductors SIMID 03 With flame-retardant encapsulation Suitable for all soldering methods Tape packaging in accordance with IEC 2 8 6 -3 ,12-mm blister tape Rated inductance 1 . 1000 ¡j H Bated current

TCN32-8

Abstract: TCN32-4 YCN164 YCN16 YCN15 TCN-32 YCN-16
Contextual Info: Verpackung von SMD-Produkten DIN-IEC 286-3 Packaging of SMD products IEC 286-3 T1 T 2 Papiergurt I Paper Tape Blistergurt I Blister Tape w E ' ! 8.0- 1 .7 5 " 3 .5 ±005 0 .3 max 1 .7 5 t001 3 .5 l0,0s — 0 .4 5 " 1 ,7 5 ±00! ^ 3 .5 1005 — 0 .6 " 1 ,7 5 ±0C!

Siemens ceramic Capacitors

Contextual Info: SMD Multilayer Ceramic Capacitors Chip capacitors Z5U Silver-nickel-tin terminations Tape packaging in acc. with IEC 286-3, up to size 1210 in 8-mm blister lape. sizes 1812 and 2220 in 12-mm blister tape Z5U (Y5U) 25 Vdc, 50 Vdc 30/085/56 + 227-56 % Ceramic material

Contextual Info: SOT538A CDIP2; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 29 November 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning

B78304-B1144-A3

Abstract: B1144 B1145 B78304-B1145-A3 B78304B1144A3
Contextual Info: ISDN Transformers S2M Interface B78304-B1144-A3 B78304-B1145-A3 Construction ● E 6,3 ferrite core ● Plastic case ● 6 gullwing terminals Features ● Complies with CCITT G.703 ● Use in PBX and NT ● Matched to coaxial 75 Ω lines Packing ● 16-mm blister tape

Contextual Info: SIZE CKTS TOOLED | 85510-0003 8 8 00 LU >- 855 10-0020 8 8 00 BLISTER ON LU >REEL 13" 85510-0028 8 8 85510-0005 6 6 85510-0019 6 6 85510-0027 6 6 85510-0013 6 4 o 85510-0018 6 4 o BLISTER ON REEL 13" 85510-0026 6 4 uo BLISTER ON LU >REEL 22" 85510-0007 4 4

E201431

Abstract: SMD1210
Contextual Info: P OL OLYFUSE YFUSE WICKMANN SMD1210 / No. 728 Surface Mount, 6V/13.2V/30V Specifications Approvals Packaging cULus Recognized: File No. E201431 TÜV: File No. R9956421 00: Blister Tape Qty.: see table below Materials Features Terminals: Plating: Low voltage overcurrent protection

smd capacitors marking

Abstract: smd electrolytic capacitors marking polarized smd capacitors
Contextual Info: ALUMINUM CAPACITORS KEY BENEFITS • Solderable under “lead Pb -free” soldering conditions • RoHS compliant • Long useful life: 2000 to 3000 hours at 105 °C • Supplied in blister tape on reel APPLICATIONS w w w. v i s h a y. c o m • Filtering

self tapping screws

Abstract: MATERIAL ABS UL94HB
Contextual Info: Enclosures datasheet:Layout 1 2/9/10 16:00 Page 1 Never Beaten by Seasons BE Enclosures Frozen Winters! Torrential Springs! Blistering Summers! Dusty Autumns! A trading name of the Elektron Components Ltd Enclosures datasheet:Layout 1 2/9/10 16:02 Page 2 SIZE 1 ENCLOSURE

Contextual Info: 23A T1 SO SOT123A CRFM4; blister pack packing method; standard product orientation 12NC ending 112 Rev. 1 — 11 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label

Contextual Info: SOT171A CDFM6; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 18 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning

wickmann

Abstract: wickmann 370
Contextual Info: OBERFLÄCHENMONTIERBARE SICHERUNGEN SMQ / Nr. 420 WICKMANN UL 248-14, 125V 125V, T Spezifikationen Zeit-Strom Charakteristik Verpackung Träge T 000: Blistergurt (1000 St.) Standard Materialien UL 248-14 CSA C22.2 Nr. 248.14 Gehäuse: Keramik Schmelzleiter: Draht

500mA 2410 FUSE

Abstract: fuse marking
Contextual Info: SURF ACE MOUNT FUSES URFACE WICKMANN 6125 / No. 446 IEC 60127-4, 63V 63V, T Specifications Time-Current Characteristic Packaging Time Lag T 000: Blister Tape (3000 pcs.) Standard Materials IEC 60127-4 (UMF) Housing: Element: Terminals: Approvals VDE: License No. 107794

diode marking code 7-7-7-7

Abstract: smq 450 150
Contextual Info: SURFACE MOUNT FUSES WICKMANN SMQ / No. 420 UL 248-14, 125V 125V, T Specifications Time-Current Characteristic Packaging Time Lag T 000: Blister Tape (1000 pcs.) 010: Blister Tape (5000 pcs.) Standard Materials UL 248-14 CSA C22.2 No. 248.14 Housing: Element:

DTS1005

Contextual Info: D A T A S H E E T CERLED SMD Chip LED High Power Output SR 10 UR-B ultra red Description Features and Benefits The solder pads provide an excellent heat sink. Ideal for sensor applications. Small true Chip - LED to build custom configurations. Available on special order in 8 mm blister

Contextual Info: Wiha Quality Tools Go To Numerical Index Go To Image Index Germany Toll Free: 800 494-6104 78 Wiha Dynamic Series Screwdrivers - Slotted & Phillips Rotating cap prevents user discomfort and blisters - even at high pressure and high torque Allows rapid rotation

toshiba a10 motherboard

Abstract: P16R8 TC59S1608AFT-10 Toshiba Motherboard GAL16LV8D GAL16LV8D-3LJ MC952 MOTOROLA LSC
Contextual Info: Interfacing SDRAMs to Pentium Processors with 3.3V GAL Devices Introduction Design Implementation The blistering speed of today’s leading-edge microprocessors necessitates the use of new memory and logic technologies. To keep up with the operating frequencies

Contextual Info: .100" X . 100" Preassembled Wiremount Socket .050" Pitch Cable Optional Plastic Strain Relief 891 Series • Fiber-free PVC blister packages of 50 • Preassembled, terminates faster than two-piece sockets • “ Sword” with red stripe indicating pin one,

PerkinElmer Optoelectronics

Abstract: diode Sr DTS1005
Contextual Info: D A T A S H E E T CERLED SMD Chip Detector Photo Pin Diode SR 10 DE Description Features and Benefits The solder pads provide an excellent heat sink. On special request also available with daylight filter SR10DE-DLF . Ideal for sensor applications. Available on special order in 8 mm blister

Contextual Info: ISDN Transformers B78504-A1437-A3 S2M Interface B78504-A1438-A3 7,8 max Application • Use in PBX and NT ■ Matched to the following ICs, e.g. PEB/PSB 22554 9,8 13,8 Feature ■ Complies with CCITT G.703 Packing 1 7 2 6 3 5 2,54 8 10,3 max ■ 24-mm blister tape

Contextual Info: ISDN Transformers B78504-A1439-A3 S2M Interface 7,8 max Application • Use in PBX and NT ■ Matched to the following ICs, e.g. PEB/PSB 2254 and 2255 9,8 13,8 Feature ■ Complies with CCITT G.703 Packing 1 7 2 6 3 5 2,54 8 10,3 max ■ 24-mm blister tape