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    BL2012 Datasheets (1)

    E-tec Interconnect
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    BL2-012-S460-11/1
    		E-tec Interconnect Connector: DIP Socket: F: 12: 1.27: THRU Original PDF 155.06KB 2
    SF Impression Pixel

    BL2012 Price and Stock

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    SSB SBL 20-12I

    Re-battery: acid-lead; 12V; 20Ah; AGM; maintenance-free
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME SBL 20-12I 113 1
    • 1 $40.55
    • 10 $36.65
    • 100 $34.20
    • 1000 $34.20
    • 10000 $34.20
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    TAIYO YUDEN CBL2012T2R2M

    Inductor: wire; SMD; 0805; 2.2uH; R: 390mΩ; ±20%; CB; 440mA; -40÷105°C
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME CBL2012T2R2M 4,000
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    Avnet Americas CBL2012T2R2M Tape & Reel 7 Weeks 4,000
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    • 10000 $0.08
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    Mouser Electronics CBL2012T2R2M 354
    • 1 $0.20
    • 10 $0.17
    • 100 $0.14
    • 1000 $0.11
    • 10000 $0.09
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    Newark CBL2012T2R2M Tape & Reel 4,000
    • 1 -
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    Ameya Holding Limited CBL2012T2R2M 4,000
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    Avnet Abacus CBL2012T2R2M Tape & Reel 17 Weeks 4,000
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    TAIYO YUDEN CBL2012T220M

    Inductor: wire; SMD; 0805; 22uH; R: 2.1Ω; ±20%; CB; 150mA; Rmax: 2.73Ω
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME CBL2012T220M 4,000
    • 1 -
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    Avnet Americas CBL2012T220M Tape & Reel 9 Weeks, 6 Days 4,000
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    • 10000 $0.08
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    Mouser Electronics CBL2012T220M 1,939
    • 1 $0.19
    • 10 $0.16
    • 100 $0.13
    • 1000 $0.11
    • 10000 $0.08
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    Newark () CBL2012T220M Cut Tape 1,966 1
    • 1 $0.20
    • 10 $0.20
    • 100 $0.14
    • 1000 $0.12
    • 10000 $0.10
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    CBL2012T220M Tape & Reel 1,966 10
    • 1 $0.20
    • 10 $0.20
    • 100 $0.14
    • 1000 $0.12
    • 10000 $0.10
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    Avnet Abacus CBL2012T220M Tape & Reel 17 Weeks 4,000
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    TAIYO YUDEN CBL2012T470M

    Inductor: wire; SMD; 0805; 47uH; R: 4.2Ω; ±20%; CB; 100mA; Rmax: 5.46Ω
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME CBL2012T470M 4,000
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    • 10000 $0.07
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    Avnet Americas CBL2012T470M Tape & Reel 10 Weeks 4,000
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    Mouser Electronics CBL2012T470M 5,306
    • 1 $0.20
    • 10 $0.17
    • 100 $0.14
    • 1000 $0.11
    • 10000 $0.08
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    Newark () CBL2012T470M Tape & Reel 4,000
    • 1 -
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    • 10000 $0.10
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    CBL2012T470M Cut Tape 4,000
    • 1 -
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    • 10000 $0.10
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    TTI CBL2012T470M Reel 4,000
    • 1 -
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    • 10000 $0.09
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    Avnet Abacus CBL2012T470M Tape & Reel 17 Weeks 4,000
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    Component Electronics, Inc CBL2012T470M 90
    • 1 $0.31
    • 10 $0.31
    • 100 $0.23
    • 1000 $0.20
    • 10000 $0.20
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    TAIYO YUDEN CBL2012T100M

    - Tape and Reel (Alt: CBL2012T100M)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas CBL2012T100M Tape & Reel 8,000 10 Weeks 4,000
    • 1 -
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    • 10000 $0.08
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    Mouser Electronics CBL2012T100M 6,639
    • 1 $0.19
    • 10 $0.16
    • 100 $0.13
    • 1000 $0.11
    • 10000 $0.09
    		Buy Now
    Newark () CBL2012T100M Tape & Reel 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.10
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    CBL2012T100M Cut Tape 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.10
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    TTI CBL2012T100M Reel 4,000 4,000
    • 1 -
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    • 1000 -
    • 10000 $0.08
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    Bristol Electronics CBL2012T100M 4,170
    • 1 -
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    Find more BL2012 price and stock on Findchips.com

    BL2012 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ACX balun

    Abstract: ACX Multilayer Chip multilayer GHz
    Contextual Info: ACX BL 2012 Series Advanced Ceramic X Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		bl201205b1600_acx balunacx multilayer chipmultilayer ghz PDF

    BL201205B1850

    Abstract: BL2012-05B ACX balun ACX Multilayer Chip multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		bl201205b1850_bl201205b1850bl2012-05bacx balun+2acx multilayer chipmultilayer ghz PDF

    ACX Multilayer Chip

    Abstract: B551-2 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201210b5512_acx multilayer chipb551-2acx balun+1multilayer ghz PDF

    BL201210B1600

    Abstract: ACX balun ACX Multilayer Chip multilayer GHz
    Contextual Info: ACX BL 2012 Series Advanced Ceramic X Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		bl201210b1600_bl201210b1600acx balunacx multilayer chip+1multilayer ghz PDF

    BL2012

    Abstract: BL201205L2450 ACX balun ACX Multilayer Chip multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201205l2450_75icalbl2012bl201205l2450+3acx balunacx multilayer chipmultilayer ghz PDF

    ACX Multilayer Chip

    Abstract: BL2012-05B3700 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201205b3700_acx multilayer chipbl2012-05b3700acx balun+1multilayer ghz PDF

    ACX balun

    Abstract: ACX Multilayer Chip multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201210b5250_acx balunacx multilayer chipmultilayer ghz PDF

    ACX Multilayer Chip

    Abstract: BL2012 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		bl201220a1440_acx multilayer chipbl2012acx balun+1multilayer ghz PDF

    ACX Multilayer Chip

    Abstract: ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.1 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201210h0465_acx multilayer chipacx balunmultilayer ghz PDF

    BL2012-05B2450

    Abstract: AN5000 BL2012 SGN5010 IS11LV5010 QFN48 S0805 uPG158TB 10nf capacitor ISSI38
    Contextual Info: ISSI IS11LV5010 BluetoothTM Transceiver PRELIMINARY INFORMATION JUNE 2003 FEATURES • A component of ISSI’s family of complete hardware and software BluetoothTM Solutions • Complete 2.45GHz radio transceiver in lowest-cost CMOS silicon • Complete Bluetooth GFSK data modem


    Original     		is11lv501045ghz40dbcbl2012-05b2450+8an5000bl2012sgn5010qfn48s0805upg158tb10nf capacitorissi38 PDF

    ACX Multilayer Chip

    Abstract: BL2012-20R0850 BL2012 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc.


    Original     		bl201220r0850_acx multilayer chipbl2012-20r0850bl2012+2acx balunmultilayer ghz PDF

    ACX Multilayer Chip

    Abstract: BL201210 BL2012-10 BL2012-10B5800 BL2012-10B ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201210b5800_acx multilayer chipbl201210bl2012-10+4bl2012-10b5800bl2012-10bacx balunmultilayer ghz PDF

    BL2012-05B2450

    Abstract: ACX Multilayer Chip bl2012 ACX balun multilayer GHz BL201205B2450
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201205b2450_bl2012-05b2450acx multilayer chipbl2012+3acx balunmultilayer ghzbl201205b2450 PDF

    BL201210B1850

    Abstract: ACX balun ACX Multilayer Chip multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201210b1850_bl201210b1850acx balunacx multilayer chip+1multilayer ghz PDF

    BL2012

    Abstract: ACX Multilayer Chip BL2012-10B3301 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201210b3301_bl2012acx multilayer chipbl2012-10b3301+2acx balunmultilayer ghz PDF

    BL201205B0900

    Abstract: 05b0900 ACX balun ACX Multilayer Chip multilayer GHz
    Contextual Info: ACX BL 2012 Series Advanced Ceramic X Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		bl201205b0900_bl201205b090005b0900acx balun+2acx multilayer chipmultilayer ghz PDF

    ACX Multilayer Chip

    Abstract: BL2012-20B3700 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201220b3700_acx multilayer chipbl2012-20b3700acx balun+1multilayer ghz PDF

    ACX Multilayer Chip

    Abstract: BL201210B3700 BL2012-10B3700 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201210b3700_acx multilayer chipbl201210b3700bl2012-10b3700+2acx balunmultilayer ghz PDF

    BL2012-05B2450

    Abstract: JEP106-K Signia Technologies JEP-106K AN5000 D908 HMC190 bl2012 D707 D709
    Contextual Info: SGN5010 Bluetooth Transceiver PRELIMINARY SPECIFICATION Key Features: Product Description: The Signia SGN5010 IC is a low-cost, fully integrated CMOS radio frequency RF transceiver and GFSK data modem optimized for use in Bluetooth™ communications applications


    Original     		sgn5010bl2012-05b2450jep106-ksignia technologies+7jep-106kan5000d908hmc190bl2012d707d709 PDF

    ACX Multilayer Chip

    Abstract: 15B24 BL2012-15B2450 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201215b2450_acx multilayer chip15b24bl2012-15b2450+2acx balunmultilayer ghz PDF

    BL201220B5388

    Abstract: BL2012-20B5388 ACX Multilayer Chip C 5388 equivalent C 5388 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201220b5388_bl201220b5388bl2012-20b5388acx multilayer chip+4c 5388 equivalentc 5388acx balunmultilayer ghz PDF

    BL2012-10

    Abstract: ACX Multilayer Chip BL201210 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201210k2450_bl2012-10acx multilayer chipbl201210+2acx balunmultilayer ghz PDF

    bl2012

    Abstract: BL2012-10B2450 BL201210 BL201210B2450 ACX balun ACX Multilayer Chip multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201210b2450_bl2012bl2012-10b2450bl201210+4bl201210b2450acx balunacx multilayer chipmultilayer ghz PDF

    BL201205K5388

    Abstract: BL2012-05K5388 ACX Multilayer Chip C 5388 ACX balun multilayer GHz
    Contextual Info: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		bl201205k5388_bl201205k5388bl2012-05k5388acx multilayer chip+3c 5388acx balunmultilayer ghz PDF