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    BGA256E Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    16x16 bga

    Abstract: 16X16 SF-BGA256E-B-11
    Contextual Info: C Package Code: BGA256E D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]


    Original     		bga256efr4/g1016x16sf-bga256e-b-11+116x16 bga PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		bga16a1atternsbga676bga665bga-1156+7156 qfn 12x12lga240bga-783bga441bga1024bga15217286x PDF

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Contextual Info: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		xc2018xc3020xc3064xc3042+11xc3090fp-x4kpg223-01reflow profile for lga componentsbga96bga165bga292so8aca-so18a-z-j-t-01sf-qfe352sa-l-01bga480bca-plcc44-d-p-t-01 PDF