BGA-56 12 Search Results

EPF6024A

Contextual Info: EPF6024A Device Pin-Outs ver. 1.0 Pin Name 1 144-Pin TQFP EPF6024A 208-Pin PQFP EPF6024A 240-Pin PQFP EPF6024A 256-Pin BGA EPF6024A 256-Pin FineLine BGA EPF6024A MSEL (2) 33 46 52 T3 L5 nSTATUS (2) 56 80 92 W11 K8 nCONFIG (2) 53 77 89 Y11 N8 DCLK (2) 128

48 ball VFBGA

Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Contextual Info: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated

CS478

Abstract: bst r16 166 EPF6016A 77n8 C13-C16 j9148 k970 272C9 M15N-3
Contextual Info: EPF6016A Device Pin-Outs ver. 1.0 Pin Name 1 100-Pin TQFP EPF6016A 100-Pin FineLine BGA EPF6016A 144-Pin TQFP EPF6016A 208-Pin PQFP EPF6016A 256-Pin FineLine BGA EPF6016A MSEL (2) 22 H2 33 46 L5 nSTATUS (2) 39 G5 56 80 K8 nCONFIG (2) 36 K5 53 77 N8 DCLK (2)

UA42

Abstract: VFBGA-48 bga rework aa56 yamaichi socket
Contextual Info: Design Summary for 56GQL 48- and 56-pin functions MicroStar Junior TM BGA PCB Design Guidelines Package Via to Board Land Area Configuration Trace Width/Spacing Dimensions (mm [in.]) Non-Solder Mask Defined Pad MicroStar Junior Package Package ball via 0.2±0.05mm

EPF6010A

Abstract: K553
Contextual Info: EPF6010A Device Pin-Outs ver. 1.0 Pin Name 1 100-Pin TQFP EPF6010A 100-Pin FineLine BGA EPF6010A 144-Pin TQFP EPF6010A MSEL (2) 22 H2 33 nSTATUS (2) 39 G5 56 nCONFIG (2) 36 K5 53 DCLK (2) 89 D6 128 CONF_DONE (2) 72 C9 105 INIT_DONE (3) 64 E10 94 nCE (2)

Contextual Info: 240PIN DDR2 400 Registered DIMM 4096MB With 256Mx4 CL3 TS512MQR72V4T Placement Description The TS512MQR72V4T is a 512M x 72bits DDR2-400 Registered DIMM. The TS512MQR72V4T consists of 18 pcs st.512Mx4bits DDR2 SDRAMs in 56 ball BGA package, 2 pcs register in 96 ball uBGA package, 1 pcs

EPF6016

Abstract: 216 C9 T20 ver 2
Contextual Info: EPF6016 Device Pin-Outs ver. 1.0 Pin Name 1 144-Pin TQFP EPF6016 208-Pin PQFP EPF6016 240-Pin PQFP EPF6016 256-Pin BGA EPF6016 MSEL (2) 33 46 52 T3 nSTATUS (2) 56 80 92 W11 nCONFIG (2) 53 77 89 Y11 DCLK (2) 128 184 212 C10 CONF_DONE (2) 105 150 172 E18 INIT_DONE (3)

Contextual Info: Package Diagrams Index of Package Diagrams 100-Pin TQFP . 100-Ball BGA . 120-Pin PQFP .

BLVDS-25

Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
Contextual Info: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)

T25 4 h5

Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
Contextual Info: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –

PQFP ALTERA 160

Abstract: TQFP 132 PACKAGE EPM7256A EPM7256AE EPM7256B EPM7256S EPM7512AE EPM7512B
Contextual Info: EPM7256B Dedicated Pin-Outs ver. 1.1 Dedicated Pin 100-Pin TQFP 144-Pin TQFP 169-Pin Ultra FineLine BGA INPUT/GCLK1 87 125 D8 INPUT/GCLRn 89 127 D6 INPUT/OE1 88 126 D7 INPUT/OE2/GCLK2 90 128 E7 TDI 2 TMS (2) TCK (2) TDO (2) VREFA (3) VREFB (3) GNDINT GNDIO (3)

Contextual Info: EN71NS128B0 EN71NS128B0 Base MCP Stacked Multi-Chip Product MCP Flash Memory and RAM 128 Megabit (8M x 16-bit) CMOS 1.8 Volt-only Simultaneous Operation Burst Mode Flash Memory and 32 Megabit (2M x 16-bit) Pseudo Static RAM Distinctive Characteristics MCP Features

PQFP-144

Abstract: EP20K30E
Contextual Info: EP20K30E I/O Pins ver. 1.1 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 208-Pin PQFP 144-Pin 1 (1) FineLine BGA 324-Pin FineLine BGA 8 8 8 8 8 8 8 8 1 2 3 4 5 6 7 8 9 10 11 12 13 14 8 8 8 8 7 7 15 16 17 18 19 20 21 22 23 24 25 26

AE 2576

Abstract: 272-ball 304-pin dimensions bga
Contextual Info: Package Diagrams Index of Package Diagrams 120-Pin PQFP . 128-Pin PQFP . 128-Pin TQFP .

FF 400 R14

Abstract: 208pin PQFP BB 298 431 A1 aa g15 BB 313 BB 438 BB 444 EPM3512A aa t 224
Contextual Info: EPM3512A Dedicated Pin-Outs ver. 1.0 Dedicated Pin INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI 1 TMS (1) TCK (1) TDO (1) GNDINT GNDIO 208-Pin PQFP 184 182 183 181 176 127 30 189 75, 82, 180, 185 6, 14, 32, 40, 50, 51, 72, 84, 94, 108, 116, 134, 152, 158, 174,

337 BGA

Abstract: BB 313 BB 438 BB 444 bga 208 PACKAGE U-328 EPM7256A EPM7256AE EPM7256B EPM7256S
Contextual Info: EPM7512B Dedicated Pin-Outs ver. 1.1 Dedicated Pin 100-Pin TQFP 144-Pin TQFP 169-Pin Ultra FineLine BGA INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI 2 TMS (2) TCK (2) TDO (2) VREFA (3) VREFB (3) GNDINT 87 89 88 90 4 15 62 73 12 60 38, 86 D8 D6 D7

IS61LPS12832A

Contextual Info: IS61 64 LPS12832A IS61(64)LPS12836A IS61(64)VPS12836A IS61(64)LPS25618A IS61(64)VPS25618A DECEMBER 2013 128K x 32, 128K x 36, 256K x 18 4 Mb SYNCHRONOUS PIPELINED, Single CYCLE DESELECT STATIC RAM FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write

passing H7

Abstract: GS84018A GS84032A GS84036A
Contextual Info: Preliminary GS84018/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features • FT pin for user-configurable flow through or pipelined

IS61LF12832A

Contextual Info: IS61 64 LF12832A IS64VF12832A IS61(64)LF12836A IS61(64)VF12836A IS61(64)LF25618A IS61(64)VF25618A 128K x 32, 128K x 36, 256K x 18 4 Mb SYNCHRONOUS FLOW-THROUGH STATIC RAM FEBRUARY 2014 FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write

Contextual Info: Preliminary GS84018/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features • FT pin for user-configurable flow through or pipelined

TQFN 48 7X7

Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
Contextual Info: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2

GS84018A

Abstract: GS84018AT-190 GS84032A GS84036A
Contextual Info: Preliminary GS84018/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation

GS840E18A

Abstract: GS840E32A GS840E36A
Contextual Info: Preliminary GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

Contextual Info: GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply