BGA THERMAL RESISTANCE Search Results

TR6878

Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
Contextual Info: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution

D1065

Abstract: Chomerics* T-405 BERGQUIST softface Chomerics* T405 Chomerics T710 tape BGA 21x21 ARCLAD 8223 Chomerics T710 D10650-40 D10650-40 datasheet
Contextual Info: Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX BGA Sizes Foot Print mm Heat Sink Height (inches) Series # Solution Page # Attachment Method 21mm 21mm 25mm 27mm 35mm 35mm 37mm 37mm 40mm 40mm 40mm 40mm 45mm 45mm 45mm 45mm 45mm 45mm 21x21

T405R

Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Contextual Info: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink

entek Cu-56

Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

underfill

Abstract: rework reflow hot air BGA Loctite PCB design for very fine pitch csp package thick bga die size Loctite 3567 Intel BGA Solder FDZ202P Fairchild, BGA fbga Substrate design guidelines
Contextual Info: Application Note 7001 March 2004 Guidelines for Using Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in Chip Scale Package BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling

Radian Heatsinks

Abstract: Chomerics T710 heatsink CS2290 IXF1110 Intricast Company
Contextual Info: 25mm Round Pin BGA Heatsink / 5-Pack home > shop > additional heatsinks > cs2290 Submit Query 25mm Round Pin BGA Heatsink / 5-Pack CS2290 Thermal Resistance °C/W Heatsink Size Weight (W x L x H) oz. 200 lfm 400 lfm 600 lfm 25.0 mm x 25.0 mm x 9.8 mm (0.2)

Loctite 3567

Abstract: underfill Kester FDZ202P fbga Substrate design guidelines reflow hot air BGA fine BGA thermal profile reball INTEL underfill SMT
Contextual Info: Application Note 7001 March 2002 Guidelines for Mounting Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling capability, ultra-low profile

BGA 256 PACKAGE power dissipation

Abstract: capacitance in BGA package BGA 256 PACKAGE thermal resistance bga Crack Intel BGA Solder
Contextual Info: Technical Notes December 8, 1997 Revision 1.0 THERMAL, ELECTRICAL AND MECHANICAL CONSIDERATIONS IN APPLYING BGA TECHNOLOGY TO A DESIGN ABSTRACT This document briefly discusses the thermal, mechanical and electrical design considerations associated with using ball-grid array components.

Altera Flip Chip BGA warpage

Abstract: ansys graphite thermal spreader graphite thermal 1998 ansys cfd
Contextual Info: Thermal Interface Material TIM Design Guidance For Flip Chip BGA Package Thermal Performance T.D. Yuan, Hsin-yu Pan Taiwan Semiconductor Manufacturing Company, Ltd. No. 6, Creation Rd. 2, Science-Based Industrial Park Hsin-Chu, Taiwan, 300-77, R.O.C. tdyuan@tsmc.com, hypanb@tsmc.com

Contextual Info: Ultra High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS Part#: ATS-52350G-C1-R0 Description: maxiFLOW Heat Sink, T412, BLUE-ANODIZED Heat Sink Type: maxiFLOW Heat Sink Attachment: THERMAL TAPE Equivalent Part Number: ATS-52350G-C2-R0

Contextual Info: Ultra High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS Part#: ATS-52350P-C1-R0 Description: maxiFLOW Heat Sink, T412, BLUE-ANODIZED Heat Sink Type: maxiFLOW Heat Sink Attachment: THERMAL TAPE Equivalent Part Number: ATS-52350P-C2-R0

elina fan

Abstract: 3dfx heat sink for 304 point BGA 2319B 658-35AB VSC870 VSC880 100C G53034-0 192 BGA PACKAGE thermal resistance
Contextual Info: VITESSE SEMICONDUCTOR CORPORATION Application Note Thermal Management for the VSC870, VSC880 AN-36 Thermal Management The VSC870 and VSC880 backplane devices can use standard heat sinks to keep their junction temperatures within the specified limits. Both devices come in a thermally enhanced BGA package. Several types of

AN0001

Contextual Info: AN0001 White Electronic Designs APPLICATION NOTE THERMAL DESIGN CONSIDERATIONS of Non-BGA products INTRODUCTION Given the above definitions, TJ may be calculated using the following equation: As System operating frequencies increase, electronic components must dissipate more power to accommodate the needed reduction in access time. Thermal considerations become increasingly important in

374324B00035G

Contextual Info: Thermal Solutions for BGAS Home | Contact Us | About Aavid -Useful Links- TAPE Attachment Method Search by part # Part Number: 374324B00035G Vis Number: 037802 Check distributor part inventory Printer Friendly Version Download our BGA Brochure (PDF)

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55230D-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55400W-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55190D-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55230R-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55330K-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55170W-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55270R-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55450R-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55375R-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »

Contextual Info: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55250D-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »