BGA SOLDER BALL 1MM Search Results

SG-BGA-6118

Contextual Info: GHz BGA Socket - Direct mount, solderless 11.11mm 1mm dia. channel Features Directly mounts to target PCB needs tooling holes with hardware. 6.01mm Top View High speed, reliable Elastomer connection 6.18mm Minimum real estate required 11.11mm Compression plate distributes forces evenly

PBGA 256 reflow profile

Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)

entek Cu-56

Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

AN-1126

Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
Contextual Info: Table of Contents Introduction . 2 Package Overview . 3

9928

Contextual Info: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

Contextual Info: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

Contextual Info: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,

entek Cu-56

Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
Contextual Info: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array

PCB layout guidelines for NXP MCUs in BGA packages

Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,

BGA PROFILING

Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

AN5041

Abstract: AN-5041 MSX532
Contextual Info: Fairchild Semiconductor Application Note July 2002 Revised July 2002 MSX532 Layout Guidelines Introduction The MSX532 is packaged in a 792-ball plastic BGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ data rates of 150Mbps and registered clock frequencies of 75MHz. The 532 I/O buffers

OCX256

Abstract: BGA Solder Ball 1mm LAYOUT GUIDELINES
Contextual Info: Application Note 5039 OCX256 Layout Guidelines 1.0 Introduction The OCX256 is packaged in a 792-ball plastic TBGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 667Mb/s and registered data modes of 333MHz. The 128 Inputs and 128 Outputs are each configured as dedicated differential ports. The

Contextual Info: Application Note 5041 MSX532 Layout Guidelines 1.0 Introduction The MSX532 is packaged in a 792-ball plastic BGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 300Mbps and registered clock frequencies of 200MHz. The 532

BGA reflow guide

Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
Contextual Info: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to

I-CUBE

Abstract: OCX256
Contextual Info: Technical Note OCX256 Layout Guidelines 1.0 Introduction The OCX256 is packaged in a 792-ball plastic TBGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 667Mb/s and registered data modes of 333MHz. The 128 Inputs and 128 Outputs are each configured as dedicated differential ports. The

LAYOUT GUIDELINES

Abstract: LG jtag MSX532 I-CUBE SDYA011
Contextual Info: Technical Note MSX532 Layout Guidelines 1.0 Introduction The MSX532 is packaged in a 792-ball plastic BGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 300Mbps and registered clock frequencies of 200MHz. The 532

sn63pb37 solder wire

Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Contextual Info: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen

Fujitsu

Abstract: mb29LV160 fujitsu reflow profile SnAgCu QFP208 QFP208 SnPb 336H QFP lead pitch 0.3mm PBGA 256 reflow profile QFP-208
Contextual Info: 1 Fujitsu Lead-free Package Semiconductor Group LSI Packaging Division Fujitsu LSI PACKAGING DIVISION All Rights Reserved, Copyright Fujitsu Limited 2 History of Fujitsu Lead-free Package Development Activities Lead-free Package Development to Commence

7929

Abstract: bga PCB footprint
Contextual Info: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

Contextual Info: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

7929

Contextual Info: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

Turn-Key

Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Contextual Info:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25

CBG064-052A

Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
Contextual Info: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability