BGA PIN 676 Search Results

AH35

Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
Contextual Info: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8

AA10

Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
Contextual Info: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8

Contextual Info: Product Number: 599-10-676-13-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-000 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

Contextual Info: Product Number: 587-10-676-13-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-005 26 X 26 # Of Pins Mill-Max Part Number 676 587-10-676-13-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737

Contextual Info: Product Number: 599-10-676-13-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-001 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

AG10

Abstract: AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528
Contextual Info: EPXA4 I/O Pins ver. 1.20 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7

B8530

Abstract: OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 672-pin
Contextual Info: EPXA4 I/O Pins ver. 1.21 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7

fg676

Abstract: 676-Pin bga pin 676
Contextual Info: R Package Drawings Ball Fine Pitch Packages - FG676 676-PIN FINE PITCH BGA FG676 11-62 August 12, 1999 (Version 1.4)

676 BGA package tray

Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
Contextual Info: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)

Contextual Info: MEMORY MODULE SDRam 32Mx72-BGA 3D SD2G72VB5489 -pjuspj a HEICO company Synchronous Dynamic Ram MODULE 2Gbit SDRam organized as 32Mx72, based on 32Mx16 Pin Assignment Top View BGA 134 - (9x15 - Pitch : 1.27 mm) (TOP VIEW- VIEWED BY TRANSPARENCY) 9 8 7 6 5

F33 1067

Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
Contextual Info: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6

Recommended land pattern smd-0.5

Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
Contextual Info: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout

Contextual Info: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FEATURES 324 Pin BGA North Bridge Chip Supports the Pentium C om patible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and

9042h

Abstract: DRB102
Contextual Info: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FE A TU R E S 324 Pin BGA North Bridge Chip Supports the Pentium Compatible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and

OT239

Abstract: AF2310 EPXA10F1020 AA10 AC10 AD10
Contextual Info: EPXA10F1020 I/O Pins ver. 1.4 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 1,020-Pin FineLine BGA 1 VCCINT VCCINT 2 GNDINT GND 3 VCCINT VCCINT 4 GNDINT GND 5 VCCINT VCCINT 6 GNDINT GND 7 VCCINT VCCINT 8 GNDINT GND 13 9 I/O E6 13 10 I/O A8 11 VCCINT

676 BGA package tray

Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
Contextual Info: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)

Contextual Info: Product Specifications PART NO: VL53B5263A-K9S-F8S-E7S REV: 1.0 General Information 4GB 512MX72 DDR3 SDRAM ECC 244 PIN Mini-RDIMM Description: The VL53B5263A is a 512Mx72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of eighteen CMOS 256Mx8 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered

DDR3-1066

Abstract: DDR3-1333 PC3-10600 A0222 VL53B5263A-K9S-F8S-E7S A6211
Contextual Info: Product Specifications PART NO: VL53B5263A-K9S-F8S-E7S REV: 1.0 General Information 4GB 512MX72 DDR3 SDRAM ECC 244 PIN Mini-RDIMM Description: The VL53B5263A is a 512Mx72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of eighteen CMOS 256Mx8 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered

Contextual Info: Product Specifications PART NO.: VL33B2K66F-K9S REV: 1.0 General Information 16GB 2Gx72 DDR3 SDRAM ULP ECC REGISTERED DIMM 240-PIN Description The VL33B2K66F is a 2Gx72 DDR3 SDRAM high density RDIMM. This four rank memory module consists of eighteen DDP CMOS 1Gx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages, a 28-bit registered

Contextual Info: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered

rda 1846

Abstract: PC3-10600
Contextual Info: Product Specifications PART NO: REV: 1.0 VL33B1K60A-K9S/F8S/E7S General Information 8GB 1GX72 DDR3 SDRAM ECC 240 PIN RDIMM Description: The VL33B1K60A is a 1Gx72 DDR3 SDRAM high density RDIMM. This memory module consists of thirty-six CMOS 512Mx4 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered buffer/PLL

E1 3005-2

Abstract: rda 1846
Contextual Info: Product Specifications REV: 1.0 VL33B1K60A-K9S/F8S/E7S PART NO: General Information 8GB 1GX72 DDR3 SDRAM ECC 240 PIN RDIMM Description: The VL33B1K60A is a 1Gx72 DDR3 SDRAM high density RDIMM. This memory module consists of thirty-six CMOS 512Mx4 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered buffer/PLL

Contextual Info: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered

DDR3-1066

Abstract: DDR3-1333 PC3-10600 A6211
Contextual Info: Product Specifications PART NO.: VL53B5269E-K9S/F8S/E7S REV: 1.0 General Information 4GB 512M x 72 DDR3 SDRAM VLP ECC Mini-RDIMM 244-PIN Description The VL53B5269E is a 512M x 72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of nine stacked CMOS 512M x 8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered