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    BGA PACKAGE TRAY 18 Search Results

    BGA PACKAGE TRAY 18 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    XPH2R106NC
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Datasheet

    BGA PACKAGE TRAY 18 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    JEDEC tray standard

    Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
    Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)


    Original     		BGA45 1849-pin 1752-pin BGA45 SSD-A-H7053-1 JEDEC tray standard JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 BGA4545 PDF

    tray datasheet bga

    Abstract: tray bga
    Contextual Info: 180°C MAX NX BG1422 2.0 0712 8 REV.A A' 18.40 12.75 A 14.2 110.4 135.9 UNIT : mm 22.2 24.40 268.4 23.30 315.0 322.6 SECTION A – A' 5.52 (6.35) 7.62 22.2 Applied Package Quantity (pcs) 119-pin Plastic BGA (14x22) MAX. 84 Tray Material NX BG1422 2.0 Carbon PES


    Original     		BG1422 119-pin tray datasheet bga tray bga PDF

    1152 BGA tray

    Abstract: tray datasheet bga jedec bga tray tray bga 117-pin JEDEC tray standard JEDEC TRAY DIMENSIONS
    Contextual Info: TRAY CONTAINER 135° C MAX. A 10.5 12.80 10.35 FBGA14 x 10 ESP NEC 115.2 135.9 PPE 10 × 18=180 UNIT : mm A' 14.5 17.10 12.15 290.7 315.0 322.6 SECTION A-A' 14.50 (5.97) (5.62) 7.62 14.00 Applied Package 117-pin Plastic BGA (14×10) Quantity (pcs) 180 MAX.


    Original     		FBGA14 117-pin FBGA14 SSD-A-H7531 1152 BGA tray tray datasheet bga jedec bga tray tray bga JEDEC tray standard JEDEC TRAY DIMENSIONS PDF

    BGA 14 TRAY

    Abstract: JEDEC TRAY DIMENSIONS jedec bga tray BGA package tray tray bga JEDEC tray standard
    Contextual Info: TRAY CONTAINER 24.40 23.30 14.35 135°C MAX A' 12.75 A BGA14x22A-1 18.40 NEC 135.9 110.4 PPE 7×12=84 UNIT : mm 22.30 268.4 315.0 322.6 SECTION A – A' 6.12 (6.35) 7.62 22.30 Applied Package Quantity (pcs) 119-pin Plastic BGA (14×22) MAX. 84 BGA14×22A-1


    Original     		BGA14 119-pin SSD-A-H6789-1 BGA 14 TRAY JEDEC TRAY DIMENSIONS jedec bga tray BGA package tray tray bga JEDEC tray standard PDF

    tray datasheet bga

    Contextual Info: UNIT : mm A' 29.26 180°C MAX TBGA 29 x 29 × 1.7mm 31.40 20.85 29.26 31.60 31.10 252.8 315.0 322.6 SECTION A – A' 29.26 5.82 7.62 6.35 135.9 94.2 A Applied Package 272-pin • Plastic BGA ( Quantity (pcs) 29) MAX. 36 Tray Material Heat Proof Temp. Surface resistance


    Original     		272-pin tray datasheet bga PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 PDF

    mask rom

    Contextual Info: DDR Code Information 1/2 Last Updated : November 2008 K7DXXXXXXX - XXXXXXX 1 2 3 4 5 1. Memory (K) 6 7 8 9 10 11 12 13 14 15 16 17 18 13. Temp, Power - COMMON (Temp, Power) 2. Sync(DDR) SRAM : 7 C : Commercial, Normal I : Industrial, Normal 3. Small Classification


    Original     		333MHz 350MHz 375MHz 400MHz mask rom PDF

    mask rom

    Contextual Info: Late Write Code Information 1/2 Last Updated : November 2008 K7PXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory (K) 13. Temp, Power - COMMON (Temp, Power) 2. Sync(Late Write) SRAM : 7 C : Commercial, Normal I : Industrial, Normal


    Original     		250MHz 300MHz mask rom PDF

    tray datasheet bga

    Abstract: 4925 B JEP95
    Contextual Info: BGA Package 35-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1879 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW


    Original     		35-Lead 5M-1994 MS-028 JEP95 tray datasheet bga 4925 B JEP95 PDF

    JEP95

    Abstract: tray datasheet bga MS-028
    Contextual Info: BGA Package 45-Lead 11.25mm x 9.00mm × 4.92mm (Reference LTC DWG# 05-08-1869 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 7 PACKAGE TOP VIEW


    Original     		45-Lead 5M-1994 MS-028 JEP95 JEP95 tray datasheet bga PDF

    4925 B

    Abstract: tray datasheet bga JEP95 4925 B transistor OB35
    Contextual Info: BGA Package 35-Lead 11.25mm x 6.25mm × 3.42mm (Reference LTC DWG# 05-08-1878 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW


    Original     		35-Lead 5M-1994 MS-028 JEP95 4925 B tray datasheet bga JEP95 4925 B transistor OB35 PDF

    4925 B

    Abstract: MS-028 BGA package tray 40 x 40 JEP95 tray datasheet bga JEP95 MS-028
    Contextual Info: BGA Package 40-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1867 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW


    Original     		40-Lead 5M-1994 MS-028 JEP95 4925 B BGA package tray 40 x 40 JEP95 tray datasheet bga JEP95 MS-028 PDF

    tray datasheet bga

    Abstract: JEP95
    Contextual Info: BGA Package 32-Lead 15mm x 11.25mm × 3.42mm (Reference LTC DWG # 05-08-1851 Rev B) A DETAIL A Z 8 A2 aaa Z 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.27 – 0.37 // bbb Z 2.45 – 2.55 H DETAIL B J K


    Original     		32-Lead 5M-1994 MS-028 JEP95 tray datasheet bga JEP95 PDF

    JEP95

    Abstract: tray datasheet bga BGA-32
    Contextual Info: BGA Package 32-Lead 15mm x 11.25mm × 4.98mm (Reference LTC DWG # 05-08-1860 Rev A) A DETAIL A Z 8 A2 aaa Z 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.33 – 0.43 // bbb Z 3.95 – 4.05 H DETAIL B J K


    Original     		32-Lead 5M-1994 MS-028 JEP95 JEP95 tray datasheet bga BGA-32 PDF

    JEP95

    Abstract: BGA144 tray datasheet bga JEP95 MS-028 bga tray
    Contextual Info: BGA Package 144-Lead 15mm x 15mm × 4.92mm (Reference LTC DWG # 05-08-1880 Rev Ø) DETAIL A Z A M A2 aaa Z L K J H G F E D C B PIN 1 A 1 PIN “A1” CORNER 2 b A1 4 ccc Z 3 4 5 b1 MOLD CAP 6 F D SUBSTRATE 7 0.27 – 0.37 8 // bbb Z 3.95 – 4.05 9 DETAIL B


    Original     		144-Lead 5M-1994 MS-028 JEP95 JEP95 BGA144 tray datasheet bga JEP95 MS-028 bga tray PDF

    JEP95

    Contextual Info: BGA Package 133-Lead 15mm x 15mm × 3.42mm (Reference LTC DWG # 05-08-1877 Rev Ø) DETAIL A Z A 12 A2 aaa Z 11 10 9 8 7 6 5 4 3 2 PIN 1 1 A PIN “A1” CORNER B b A1 4 ccc Z C D E b1 MOLD CAP F F D SUBSTRATE G 0.27 – 0.37 H // bbb Z 2.45 – 2.55 J DETAIL B


    Original     		133-Lead 5M-1994 MS-028 JEP95 JEP95 PDF

    JEP95

    Abstract: JEP95 MS-028 BGA 8 x 8 tray
    Contextual Info: BGA Package 221-Lead 15mm x 11.25mm × 2.82mm (Reference LTC DWG# 05-08-1886 Rev Ø) Z A aaa Z E Y A2 X DETAIL A SEE NOTES 13 12 11 10 9 8 7 6 5 4 3 2 1 PIN 1 3 A A1 PIN “A1” CORNER B ccc Z C 4 D b E b1 MOLD CAP F SUBSTRATE // bbb Z H J F Z H2 D G H1


    Original     		221-Lead MS-028 JEP95 JEP95 JEP95 MS-028 BGA 8 x 8 tray PDF

    JEP95

    Contextual Info: BGA Package 71-Lead 15mm x 9.00mm × 3.42mm (Reference LTC DWG# 05-08-1885 Rev Ø) A aaa Z E Y Z DETAIL A A2 X SEE NOTES 7 6 5 4 3 2 1 PIN 1 3 A A1 PIN “A1” CORNER B ccc Z 4 C D b b1 MOLD CAP E SUBSTRATE D G Z // bbb Z F F H1 H2 H DETAIL B J e Øb (71 PLACES)


    Original     		71-Lead 5M-1994 MS-028 JEP95 JEP95 PDF

    JEP95

    Contextual Info: BGA Package 140-Lead 11.25mm x 9.00mm × 2.72mm aaa Z (Reference LTC DWG # 05-08-1849 Rev A) A Y E E1 Z aaa Z DETAIL A e A2 b PIN 1 A B PIN “A1” CORNER C A1 4 b ccc Z D E F b1 MOLD CAP D G D1 H SUBSTRATE J 0.27 – 0.37 // bbb Z 1.95 – 2.05 K L DETAIL B


    Original     		140-Lead 5M-1994 JEP95 PDF

    JEP95

    Abstract: MS-028
    Contextual Info: BGA Package 44-Lead 15mm x 15mm × 5.02mm (Reference LTC DWG # 05-08-1881 Rev Ø) A DETAIL A Z 11 A2 aaa Z 10 9 8 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.37 – 0.47 // bbb Z 3.95 – 4.05 H DETAIL B


    Original     		44-Lead 5M-1994 MS-028 JEP95 JEP95 PDF

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B PDF

    S146

    Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
    Contextual Info: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,


    Original     		15mmH misali6-2-2557-7351 S146 S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3 PDF