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    BGA PACKAGE Search Results

    BGA PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    		Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet

    BGA PACKAGE Datasheets (2)

    Select Manufacturer
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    BGA Package
    		Xilinx Chip Scale BGA (CS144/CSG144) Package Original PDF 53.94KB 1
    BGA PACKAGE TOP MARK
    		Altera CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Original PDF 8.71KB 1

    BGA PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    reflow soldering profile BGA

    Abstract: reflow temperature bga BGA PROFILING bga rework
    Contextual Info: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already


    Original     		PDF

    led matrix circuits

    Abstract: 256-pin Plastic BGA BGA-256P-M02
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)


    Original     		BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 led matrix circuits 256-pin Plastic BGA BGA-256P-M02 PDF

    led matrix circuits

    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M01 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M01 480-pin plastic BGA (BGA-480P-M01)


    Original     		BGA-480P-M01 480-pin BGA-480P-M01) BGA480001SC-2-1 led matrix circuits PDF

    led matrix circuits

    Abstract: fujitsu FUJITSU SEMICONDUCTOR
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M02 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M02 480-pin plastic BGA (BGA-480P-M02)


    Original     		BGA-480P-M02 480-pin BGA-480P-M02) BGA480002SC-2-1 led matrix circuits fujitsu FUJITSU SEMICONDUCTOR PDF

    led matrix circuits

    Abstract: BGA-420P
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01)


    Original     		BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 led matrix circuits BGA-420P PDF

    led matrix circuits

    Abstract: BGA-420P
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02)


    Original     		BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 led matrix circuits BGA-420P PDF

    256-pin BGA

    Abstract: 24 pin MATRIX led matrix circuits 256-pin
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)


    Original     		BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 wi256-pin 256-pin BGA 24 pin MATRIX led matrix circuits PDF

    256-pin BGA

    Abstract: led matrix circuits 256-pin
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)


    Original     		BGA-256P-M04 256-pin BGA-256P-M04) B256009SC-1-3 256-pin BGA led matrix circuits PDF

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


    Original     		208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384 PDF

    led matrix circuits

    Abstract: BGA-272P-M01
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC To Top / Package Lineup / Package Index BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50 mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01)


    Original     		BGA-272P-M01 272-pin BGA-272P-M01) B272001SC-1-3 led matrix circuits BGA-272P-M01 PDF

    S 576 B

    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC To Top / Package Lineup / Package Index BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ


    Original     		BGA-576P-M01 576-pin BGA-576P-M01) BGA576001SC-2-1 S 576 B PDF

    416-PIN

    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 416 PIN PLASTIC To Top / Package Lineup / Package Index BGA-416P-M02 416-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.10(1.575±.004)SQ


    Original     		BGA-416P-M02 416-pin BGA-416P-M02) BGA416002SC-2-2 PDF

    led matrix circuits

    Abstract: 352-PIN matrix led
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M02 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ


    Original     		BGA-352P-M02 352-pin BGA-352P-M02) BGA352003SC-1-1 led matrix circuits matrix led PDF

    352-pin

    Abstract: led matrix circuits
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M04 352-pin plastic BGA (BGA-352P-M04) 35.00±0.10(1.378±.004)SQ


    Original     		BGA-352P-M04 352-pin BGA-352P-M04) BGA352005SC-3-1 led matrix circuits PDF

    BGA-35

    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M01 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.10(1.378±.004)SQ


    Original     		BGA-352P-M01 352-pin BGA-352P-M01) BGA352002SC-2-2 BGA-35 PDF

    BGA-35

    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M05 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M05 352-pin plastic BGA (BGA-352P-M05) 35.00±0.10(1.378±.004)SQ


    Original     		BGA-352P-M05 352-pin BGA-352P-M05) BGA352006SC-1-1 BGA-35 PDF

    BGA-672P-M01

    Abstract: 672pin
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 672 PIN PLASTIC To Top / Package Lineup / Package Index BGA-672P-M01 672-pin plastic BGA Lead pitch 50 mil Pin matrix 34 Sealing method Resin seal BGA-672P-M01 672-pin plastic BGA (BGA-672P-M01) 45.00±0.10(1.772±.004)SQ


    Original     		BGA-672P-M01 672-pin BGA-672P-M01) BGA672001SC-3-1 BGA-672P-M01 672pin PDF

    BGA-420P

    Contextual Info: PBALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M03 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-420P-M03 420-pin plastic BGA (BGA-420P-M03) 35.00±0.10(1.378±.004)SQ


    Original     		BGA-420P-M03 420-pin BGA-420P-M03) BGA420003SC-2-1 BGA-420P PDF

    reflow soldering profile BGA

    Abstract: BGA PROFILING solder joint bga warpage bga rework
    Contextual Info: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed


    Original     		PDF

    led matrix circuits

    Abstract: bga48 48-pin
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.


    Original     		BGA-48P-M06 48-pin BGA-48P-M06) BGA48006SC-1-2 ar8P-M06) led matrix circuits bga48 PDF

    PCN0214

    Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic
    Contextual Info: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change:


    Original     		PCN0214 packagesK1500E 1020-Ball EP20K600E 672-Ball EP20K400 EP20K400E PCN0214 Altera bga BGA PACKAGE OUTLINE EP1M120 EP20K1000E EPXA10 amkor flip alsic PDF

    AA23

    Abstract: AD166
    Contextual Info: EP2A15 Pin Outs. 1.1 Table 1 shows all pins for the EP2A15 672-pin FineLine BGA and the 724-pin ball-grid array BGA Packages. Table 1. EP2A15 Device Pin-Outs I/O & VREF Bank Pin Name/Function Dual-Purpose Function 672-Pin HSTL Class II 724-Pin BGA FineLine BGA


    Original     		EP2A15 672-pin 724-pin 672-Pin TX01p TX01n TX02n AA23 AD166 PDF

    W2639A

    Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
    Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		W2637A, W2638A W2639A an120 5990-3892EN W2639A lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer PDF

    Diode 224

    Abstract: fujitsu BGA-224P 224-PIN
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 224 PIN PLASTIC To Top / Package Lineup / Package Index BGA-224P-M01 224-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 18 Sealing method Plastic mold BGA-224P-M01 224-pin plastic FBGA (BGA-224P-M01)


    Original     		BGA-224P-M01 224-pin BGA-224P-M01) B224001S-1C-1 Diode 224 fujitsu BGA-224P PDF