BGA CTE Search Results

BGA CTE Result Highlights (5)

Part	Manufacturer	Description	Download
84512-202LF	Amphenol Communications Solutions	100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free	PDF
74221-201LF	Amphenol Communications Solutions	400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free	PDF
84500-002	Amphenol Communications Solutions	300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array	PDF
84500-102	Amphenol Communications Solutions	300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array	PDF
84517-001	Amphenol Communications Solutions	200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array	PDF

BGA CTE Price and Stock

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Microchip Technology Inc


Microchip Technology Inc SM313BG-ACTEL-2 ADAPTER MODULE ANTIFUSE 313BGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SM313BG-ACTEL-2	Bulk				1 - 10 - 100 - 1000 - 10000 -	Buy Now
Microchip Technology Inc	SM313BG-ACTEL-2					1 $2254.68 10 $2254.68 100 $2254.68 1000 $2254.68 10000 $2254.68	Buy Now
NAC	SM313BG-ACTEL-2	Box			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Microchip Technology Inc SMPA-456BG-ACTEL-2 ADAPTER MODULE 456BGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SMPA-456BG-ACTEL-2	Bulk			1	1 $1818.75 10 $1818.75 100 $1818.75 1000 $1818.75 10000 $1818.75	Buy Now
Microchip Technology Inc SMPA-272BG-ACTEL MDL 272 BGA ProASIC - FSMPA272BGACT, Projected EOL:
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	SMPA-272BG-ACTEL		6			1 $2061.20 10 $2061.20 100 $2061.20 1000 $2061.20 10000 $2061.20	Buy Now
NAC	SMPA-272BG-ACTEL	Box			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Microchip Technology Inc SM329BG-ACTEL MDL 329 PIN BGA, Projected EOL:
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	SM329BG-ACTEL		3			1 $2701.14 10 $2701.14 100 $2701.14 1000 $2701.14 10000 $2701.14	Buy Now
NAC	SM329BG-ACTEL	Box			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Microchip Technology Inc SMAX-729BG-ACTEL MDL 729 PIN AX - FSMAX729BGACT, Projected EOL:
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	SMAX-729BG-ACTEL		2			1 $2730.91 10 $2730.91 100 $2730.91 1000 $2730.91 10000 $2730.91	Buy Now
NAC	SMAX-729BG-ACTEL	Box			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote

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BGA CTE Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
12x12 bga thermal resistance Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack Contextual Info: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE	Original	SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack	PDF
entek Cu-56 Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile Contextual Info: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.	Original	20ppm/ 5989-0834EN AV02-0769EN entek Cu-56 bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile	PDF
PCN0712 Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100 Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array	Original	PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100	PDF
Altera Flip Chip BGA warpage Abstract: thick bga die size crack flip chip ajinomoto Flip Chip Substrate DSASW0010612 ansys BGA cte underfill with or without underfill Contextual Info: Accurate Predictions of Flip Chip BGA Warpage Yuan Li Altera Corporation 101 Innovation Dr, M/S 4202 San Jose, CA 95134 ysli@altera.com, 408 544-7508 Abstract Organic flip chip BGA has been quickly adopted as the mainstream package solution for high speed, high density and	Original		PDF
"0.4mm" bga "ball collapse" height Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320 Contextual Info: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller	Original	TMS320 TMS320C6x TMS320C6201 AN1231. "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231	PDF
PCN0708 Abstract: hysol BGA sumitomo CB0260AT cte table bga marking HB diode CRP-3900 CBO260AT EPF10K100A EPF10K100E Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0708 UPDATE ENCAPSULANT MATERIAL CHANGE FOR BGA Pb-FREE PACKAGES Change Description This is an update to PCN0708, published July 2007. Altera is implementing encapsulant material changes on the ball-grid array BGA Pb-free packages assembled in Amkor Korea and	Original	PCN0708 PCN0708, CRP-3300NH CB0260AT CRP-3900 CB062 PCN0708 hysol BGA sumitomo CB0260AT cte table bga marking HB diode CRP-3900 CBO260AT EPF10K100A EPF10K100E	PDF
PSR4000 AUS308 Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG Contextual Info: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array	Original	HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG	PDF
JEDEC JESD22-B117 Abstract: JESD22-B117 Solder Paste, Indium 5.8 N41 250 y 803 IPC-9504 10k resistor 1/8 watt datasheet hot air bga Solder Paste, Indium 5.1, Type 3 10k resistor 1/4 watt datasheet Contextual Info: RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN & REPORT .4	Original		PDF
106 10k 804 Abstract: 106F 213B Contextual Info: CTS ClearONE Terminator Reliability Test Data RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN &	Original		PDF
BGA PROFILING Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile Contextual Info: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.	Original	20ppm/ AV02-0768EN BGA PROFILING BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile	PDF
ceramic rework Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability	Original	25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles	PDF
BGA 256 PACKAGE power dissipation Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432 Contextual Info: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced	Original	00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432	PDF
IPC-6011 Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222 Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications	Original	1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222	PDF
PCN0515 Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC Contextual Info: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently	Original	PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC	PDF

BGA heatsink compressive force Abstract: BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga Contextual Info: Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards, Hope Chambers, Mukta Farooq, Lewis Goldmann, Amir Salehi* IBM Microelectronics, 2070 Route 52, Hopewell Jct, NY 12533 Apple Computer, 1 Infinite Loop, Cupertino, CA 95014	Original	64-bit BGA heatsink compressive force BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga	PDF
entek Cu-56 Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability Contextual Info: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array	Original	Cu-56 5989-0491EN AV02-0770EN entek Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability	PDF
AUS308 Abstract: PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal Contextual Info: March 21, 2007 CN 032107 Customer Notification CX2751x-12 Material Set Change Dear Valued Customer: This notification is for the CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. Mindspeed’s turnkey supplier has sent notification that all their BGA products will be manufactured using	Original	CX2751x-12 CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. CX2751x-12, CX2751xG-12, 2751x-PCN-001-A AUS308 PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal	PDF
BGA PROFILING Abstract: pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte Contextual Info: Surface Laminar Circuit SLC Ball Grid Array (BGA) Lead-free Surface Mount Assembly Application Note 5363 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-HT surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array	Original	J-STD-020. AV02-0767EN BGA PROFILING pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte	PDF
"0.4mm" bga "ball collapse" height Abstract: TMS320C6x BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch Contextual Info: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of	Original	TMS320C6x SPRA429 AN1231. TMS320C6201 "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch	PDF
underfill Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate Contextual Info: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package	Original	12x10-6 17x10-6 6x10-6 underfill cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate	PDF
HCL G28 CP Abstract: LP141 ufc 101 vc fw 2602 quanta quanta computer cap 220p CRTC 3301 6R165 TA124E Contextual Info: 1 2 3 4 5 6 7 8 OA8 BLOCK DIAGRAM BANIAS / Montara-GME / ICH4-M DOTHAN A CPU BANIAS/DOTHAN CPU THERMAL SENSOR MAX6648MUA PAGE 4 478 Pins CPU VRM micro FC-BGA PAGE 4, 5 B PAGE 31, 32 CLOCK GEN (Dothan / Montara-GM+ / ICH4-M) DDR I/F 2.5V, 266MHz NORTH BRIDGE	Original	MAX6648MUA CY28346 ICS950810 4X100MHZ 266MHz HCL G28 CP LP141 ufc 101 vc fw 2602 quanta quanta computer cap 220p CRTC 3301 6R165 TA124E	PDF
Altera Flip Chip BGA warpage Abstract: with or without underfill DSASW0010612 cte table epoxy substrate you ad electronics Power consumption of FCBGA 53RD Contextual Info: Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package 1 Kuo-Chin Chang, 2Yuan Li, 1Chung-Yi Lin, and 1Mirng-Ji Lii 1 Taiwan Semiconductor Manufacturing Company, Ltd. 6, Creation Rd. 2, HsinChu Science Park, HsinChu 300, TAIWAN Tel: 886-3-5785112 Ext.6274; Fax: 886-3-5641737; E-mail: kcchange@tsmc.com	Original		PDF
Intel reflow soldering profile BGA Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764 Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems	Original		PDF
IPC-6012 Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525 Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel	Original	1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525	PDF

BGA CTE Search Results

BGA CTE Result Highlights (5)

BGA CTE Price and Stock

Microchip Technology Inc SM313BG-ACTEL-2

Microchip Technology Inc SMPA-456BG-ACTEL-2

Microchip Technology Inc SMPA-272BG-ACTEL

Microchip Technology Inc SM329BG-ACTEL

Microchip Technology Inc SMAX-729BG-ACTEL

BGA CTE Datasheets Context Search

12x12 bga thermal resistance

entek Cu-56

PCN0712

Altera Flip Chip BGA warpage

"0.4mm" bga "ball collapse" height

PCN0708

PSR4000 AUS308

JEDEC JESD22-B117

106 10k 804

BGA PROFILING

ceramic rework

BGA 256 PACKAGE power dissipation

IPC-6011

PCN0515

BGA heatsink compressive force

entek Cu-56

AUS308

BGA PROFILING

"0.4mm" bga "ball collapse" height

underfill

HCL G28 CP

Altera Flip Chip BGA warpage

Intel reflow soldering profile BGA

IPC-6012