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    BGA AND QFP ALTERA PACKAGE MOUNTING Search Results

    BGA AND QFP ALTERA PACKAGE MOUNTING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    BLM15PX330BH1D
    		Murata Manufacturing Co Ltd FB SMD 0402inch 33ohm POWRTRN PDF
    BLM15PX600SH1D
    		Murata Manufacturing Co Ltd FB SMD 0402inch 60ohm POWRTRN PDF
    BLM21HE601SN1L
    		Murata Manufacturing Co Ltd FB SMD 0805inch 600ohm NONAUTO PDF
    BLM21HE472BH1L
    		Murata Manufacturing Co Ltd FB SMD 0805inch 4700ohm POWRTRN PDF
    BLM15PX330SH1D
    		Murata Manufacturing Co Ltd FB SMD 0402inch 33ohm POWRTRN PDF

    BGA AND QFP ALTERA PACKAGE MOUNTING Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


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    Yamaichi IC51-0444-1568

    Abstract: IC51-0444-1568 LCS-68 PQFP ALTERA 160 LCS-68-12 IC51-1444-1354-7 IC51-2084-1052-11 IC51-1004-809 Framatome Connectors IC51
    Contextual Info: Selecting Sockets for Altera Devices January 1999, ver. 3 Introduction Application Note 80 Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board PCB layout, different soldering processes for production


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    EPM7128STC100-15

    Abstract: EPF10K50RI240-4 ALTERA MAX EPM7128SQC100-15 EPF10K10LC84-3 qpsk modulation VHDL CODE 304 QFP amkor ALTERA EPF10K50RI240-4 MAX7000S EPF10K10LC84-4 EPF10K20A
    Contextual Info: Newsletter for Altera Customers ◆ First Quarter ◆ February 1997 FLEX Devices: The Gate Array Alternative Altera’s FLEX 10K and FLEX 8000 devices combine the flexibility of programmable logic devices PLDs with the density and efficiency of gate arrays. As PLD unit


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    IPC-SM-786A

    Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
    Contextual Info: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


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    Yamaichi IC51-0804-808

    Abstract: BGA and QFP Altera Package mounting QILE84P-410T IC51-2084-1052-11 Enplas fpq LCS-68 force fit standoffs BGA and QFP Package mounting IC51-0804-808 AUGAT SOCKET
    Contextual Info: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board


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    LCS-68

    Abstract: IC51-2084-1052-11 FPQ-240-0 821575-1 IC51-1004-809 44 pin TQFP Test Clip plcc socket 84 PLCC 3m bga169
    Contextual Info: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board


    Original     		PDF

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Contextual Info: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


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    LCS-68

    Abstract: 821575-1 LCS-84 1-382320-7 821574-1
    Contextual Info: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board


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    EPF10K50E

    Contextual Info: Designing with FineLine BGA Packages November 1999, ver. 1.03 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the


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    micro fineline BGA

    Abstract: Epoxy, glass laminate EPC16U88
    Contextual Info: Designing With Fineline BGA Packages for APEX, FLEX, ACEX, MAX 7000 & MAX 3000 Devices Application Note 114 October 2005, ver. 3.0 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


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    ic51-1604-845-4

    Abstract: socket Yamaichi ic51 IC51 - 1052 - 13 LCS-68 fpq-240
    Contextual Info: Selecting Sockets for Altera Devices A pplication Note 80 June 1996, ver. 1 Introduction Altera offers a number of surface-mount packages. Surface-mount assem bly places unique dem ands on the developm ent and manufacturing process by requiring different CA D sym bols for printed circuit board


    OCR Scan     		PDF

    EPF10K50E

    Abstract: BGA and QFP Package mounting
    Contextual Info: Designing with FineLine BGA Packages August 2001, ver. 1.1 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the


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    EPC16U88

    Contextual Info: Designing With High-Density BGA Packages for Altera Devices Application Note 114 December 2007, ver. 5.1 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


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    PLCC 84 PINS

    Abstract: camtex trays MIL-I-8835A
    Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


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    camtex trays

    Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
    Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


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    IPC-SM-780

    Contextual Info: Reflow Soldering Guidelines January 1998, ver. 2 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


    Original     		ANSI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 PDF

    IPC-SM-780

    Abstract: IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
    Contextual Info: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		oC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life PDF

    IPC-SM-780

    Abstract: IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
    Contextual Info: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		varyinI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-780 solder paste OVEN RQFP IPC-SM-786 PDF

    ADV9801

    Abstract: MP-8000 MP8000 IPC-SM-786A pdf epf8282
    Contextual Info: CUSTOMER ADVISORY FLEX 10K ADDITIONAL SOURCE OF SUPPLY Altera has improved the thermally enhanced QFP package used for the FLEX 10K products to meet a Level 3 moisture rating as specified in JEDEC STD-020 and IPC-SM-786A. This upgrade will take effect in Q2 1998 for all FLEX 10K devices. The dry-pack label for these


    Original     		STD-020 IPC-SM-786A. MP-8000, EPF8282/A J-STD-020. ADV9801 ADV9801 MP-8000 MP8000 IPC-SM-786A pdf epf8282 PDF

    TD 265 N 600 KOC

    Abstract: core i5 520 Scans-049 camtex trays sii Product Catalog EPM9560 film hot BT 342 project TIL Display 7160S
    Contextual Info: 1996 Data Book Data Book June 1996 A-DB-0696-01 Altera, MAX, M A X+PLUS, FLEX, FLEX 10K, FLEX 8000, FLEX 8000A, MAX 9000, MAX 7000, MAX 7000E, MAX 7000S, FLASHlogic, MAX 5000, Classic, M AX+PLUS II, PL-ASAP2, PLDshell Plus, FastTrack, AHDL, MPLD, Turbo Bit, BitBlaster, PENGN, RIPP 10, PLS-ES, ClockLock, ClockBoost,


    OCR Scan     		-DB-0696-01 7000E, 7000S, EPF10K100, EPF10K70, EPF10K50, EPF10K40, EPF10K30, EPF10K20, EPF10K10, TD 265 N 600 KOC core i5 520 Scans-049 camtex trays sii Product Catalog EPM9560 film hot BT 342 project TIL Display 7160S PDF

    BGA and QFP Altera Package mounting

    Abstract: diode zener ph c5v1 527 MOSFET TRANSISTOR motorola PH C5V1 lt1085 linear SOIC Package 8-Pin Surface Mount 601 "Fast Cycle RAM" mounting pad dimentions PQFP motorola smd transistor code 621 BGA OUTLINE DRAWING
    Contextual Info: Cyclone Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com C5V1-1.0 Copyright 2003 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


    Original     		00-mm BGA and QFP Altera Package mounting diode zener ph c5v1 527 MOSFET TRANSISTOR motorola PH C5V1 lt1085 linear SOIC Package 8-Pin Surface Mount 601 "Fast Cycle RAM" mounting pad dimentions PQFP motorola smd transistor code 621 BGA OUTLINE DRAWING PDF

    Date Code Formats Altera EPF10K

    Abstract: ep22v10 5962-9061102XA 5962-8854901xa 8686401LA 5962-8686401LA lift controller in vhdl ALTERA PART MARKING EPM7160 EPX780 transistor b2020
    Contextual Info: Introduction Contents March 1995 Introduction The PLD Advantages of Altera


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    EP2C5Q208C8

    Abstract: EP2C5T144 EP2C35F672
    Contextual Info: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-1.1 Copyright 2004 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


    Original     		EP2C50F484C6 EP2C50 EP2C50F484C7 EP2C50F484C8 EP2C50F672C6 EP2C50F672C7 EP2C50F672C8 EP2C5Q208C8 EP2C5T144 EP2C35F672 PDF