BGA 84 Search Results

MACH4A

Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

PCT-GF30

Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
Contextual Info: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount

BGA reflow guide

Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
Contextual Info: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to

gk 7031

Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

W2639A

Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

514-PP-NNNMXX-XXX148

Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
Contextual Info: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm

Contextual Info: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers

337 BGA

Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –

N5426A

Abstract: N5451A PC Oscilloscope Probe W3630A W3635A DDR3 pin out quaddie ddr3 B4621A E2677A W3630
Contextual Info: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers and

35x35 bga

Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
Contextual Info: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169

Contextual Info: BGA Socketing and Test Products Solder to BGA Header (Solder to Target PC Board) Connector Products 1700 Hicks Road • Rolling Meadows, IL 60008 USA Telephone: 847.392.3500 • Fax: 847.392.9404 email: mcpsales@methode.com • Web Page: www.methode.com

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

AS 108-120

Abstract: EPM7128B 144-FI 95 g4
Contextual Info: EPM7128B Dedicated Pin-Outs ver. 1.0 Dedicated Pin 48-Pin VTQFP 49-Pin Ultra FineLine BGA 100-Pin TQFP 100-Pin 144-Pin FineLine BGA TQFP 169-Pin Ultra FineLine BGA INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI 1 TMS (1) TCK (1) TDO (1) VREFA (2)

EP20K100E

Abstract: t25 4 j5
Contextual Info: Pin Information for the APEX EP20K100E Device Version 1.5 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin FineLine BGA FineLine BGA 356-Pin BGA 8 8 8 — 8 — 8 8 8 8 8 — 8 8

XC95216-20PQG160I

Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
Contextual Info: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but

DIN 13715

Abstract: 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP
Contextual Info: Ultra-Low Power SRAMs Density Mb Organization Voltage Range Speed (ns) Features Package N08L6182A Part Number 8 512 Kb x 16 1.65 - 2.2 70 Dual CE 48-BGA N08L63W2A 8 512 Kb x 16 2.3 - 3.6 70 Dual CE 48-BGA N04L63W2A 4 256 Kb x 16 2.3 - 3.6 55 Dual CE 44-TSOP2, 48-BGA

TR6878

Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
Contextual Info: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution

D1065

Abstract: CX486slc D20850-40 Cyrix CX486slc 486DX2 DIMENSIONS pqfp 100 D10650 D10650-40 heat sink D1085
Contextual Info: Integrated Circuit Heat Sinks DELTEM COMPOSITE HEAT SINKS FOR PQFPs, CQFPs, AND BGAs Deltem™ D10650-40 Pin Fin Heat Sink for 100-Lead PQFPs, 169 BGA Standard P/N D10650-40 ̆ 84, 100 PQFP, 169 BGA Base Dimensions in. mm Height in. (mm) Weight lbs. (grams)

AE23

Abstract: AF23 EP20K60E
Contextual Info: EP20K60E I/O Pins ver. 1.2 I/O & VREF Bank Pad Pin/Pad Function Number Orientation 144-Pin 208-Pin 240-Pin 144-Pin TQFP 1 PQFP (1) PQFP (1) FineLine BGA 324-Pin FineLine BGA 356-Pin BGA 8 8 8 8 – 8 8 8 8 8 – 8 – – – 8 8 – 8 8 8 8 8 – – 8

T25 4 h5

Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
Contextual Info: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –

E2677A

Contextual Info: W2635A and W2636A DDR3 BGA Probe Adapter for Infiniium Oscilloscopes Data Sheet Superior probing for DDR3 compliance test and debug The Agilent Technologies' W2635A and W2636A DDR3 BGA probe adapters provide signal access to the clock, strobe, data, address