BGA 84 Search Results

MACH4A

Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size

W2639A

Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

N5426A

Abstract: N5451A PC Oscilloscope Probe W3630A W3635A DDR3 pin out quaddie ddr3 B4621A E2677A W3630
Contextual Info: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers and

AS 108-120

Abstract: EPM7128B 144-FI 95 g4
Contextual Info: EPM7128B Dedicated Pin-Outs ver. 1.0 Dedicated Pin 48-Pin VTQFP 49-Pin Ultra FineLine BGA 100-Pin TQFP 100-Pin 144-Pin FineLine BGA TQFP 169-Pin Ultra FineLine BGA INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI 1 TMS (1) TCK (1) TDO (1) VREFA (2)

EP20K100E

Abstract: t25 4 j5
Contextual Info: Pin Information for the APEX EP20K100E Device Version 1.5 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin FineLine BGA FineLine BGA 356-Pin BGA 8 8 8 — 8 — 8 8 8 8 8 — 8 8

XC95216-20PQG160I

Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
Contextual Info: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but

D1065

Abstract: CX486slc D20850-40 Cyrix CX486slc 486DX2 DIMENSIONS pqfp 100 D10650 D10650-40 heat sink D1085
Contextual Info: Integrated Circuit Heat Sinks DELTEM COMPOSITE HEAT SINKS FOR PQFPs, CQFPs, AND BGAs Deltem™ D10650-40 Pin Fin Heat Sink for 100-Lead PQFPs, 169 BGA Standard P/N D10650-40 ̆ 84, 100 PQFP, 169 BGA Base Dimensions in. mm Height in. (mm) Weight lbs. (grams)

T25 4 h5

Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
Contextual Info: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –

PPS-GF30-FR

Abstract: 540-88-084-17-400 MO-047 MO-052 4510 chip
Contextual Info: PRECI-DIP SA - Page 1 of 1 PGA / BGA / PLCC - PLCC SURFACE MOUNT Series 540 PGA / BGA / PLCC - PLCC surface mount PLCC Socket for Plastic Leaded Chip carrier PLCC , Surface mount Ordering information RoHS-compliant parts PP Plating code Terminaison Contact

W2635A-010

Abstract: ddr3 PCB footprint DDR3 jedec JESD79-3C N5426A DDR3 DIMM footprint N5425A JESD79-3C W2636A-010 DDR3 timing diagram N5451A
Contextual Info: W2635A and W2636A DDR3 BGA Probe Adapter for Infiniium Oscilloscopes Data Sheet Superior probing for DDR3 compliance test and debug The Agilent Technologies' W2635A and W2636A DDR3 BGA probe adapters provide signal access to the clock, strobe, data, address

HXC125

Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Contextual Info: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The

AE23

Abstract: EP20K100E
Contextual Info: EP20K100E I/O Pins ver. 1.1 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin 208-Pin 240-Pin 144-Pin TQFP PQFP PQFP FineLine 1 (1) (1) BGA 324-Pin FineLine BGA 356-Pin BGA 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8

N5426A

Abstract: W3630 TP28-TP30 W3635A W2633B TP40 N5451A Oscilloscope Probe to PC B4621A 5990-3179EN
Contextual Info: W2630 Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630 Series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630 Series DDR2

nec 2565

Abstract: tray bga 576 tray datasheet bga
Contextual Info: TRAY CONTAINER HEAT PROOF 7 150°C MAX PPE 40.25 84.6 42.30 A' 25.65 A TBGA 40x40 3×7=21 135.9 Unit : mm 40.25 42.30 253.8 30.60 315.0 322.6 SECTION A – A' 5.82 7.62 (6.35) 40.25 Applied Package 500-pin • Plastic BGA 40×40 576-pin • Plastic BGA 40×40

PC Oscilloscope Probe

Abstract: N5426A Oscilloscope Probe to PC Probe Oscilloscope Connecting Oscilloscope Probe to PC W2631-97000 81204A AGILENT 1134A AGILENT TECHNOLOGIES DDR2 x32
Contextual Info: W2630A Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630A series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630A series DDR2

AE23

Abstract: EP20K100E AF-1
Contextual Info: EP20K100E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – – – – 8 8 8 Pad Number Orientation Pin/Pad Function 144-Pin 208-Pin 240-Pin 144-Pin 324-Pin 356-Pin TQFP 1 PQFP (1) PQFP (1) FineLine BGA FineLine BGA BGA

AA10

Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
Contextual Info: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8

PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array

Contextual Info: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF

74HC595 SMD

Abstract: smd transistor w18 T2D DIODE 46 8 pin SMD ic 2068 smd 1a2 QE r525 QE R519 T04 p6 smd GMC31X7R104K50NT u1g SMD
Contextual Info: LXD9781 BGA Demo Board with FPGAs for RMII-to-MII Conversion Developer Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249044-001 LXD9781 BGA Demo Board with FPGAs for RMII-to-MII Conversion User Guide.

Contextual Info: Package Diagrams Index of Package Diagrams 100-Pin TQFP . 100-Ball BGA . 120-Pin PQFP .

Contextual Info: PRECI-DIP SA - Page 1 of 1 PGA / BGA / PLCC - PLCC SOLDER TAIL Series 540 PGA / BGA / PLCC - PLCC solder tail PLCC Socket for Plastic Leaded Chip Carrier PLCC , Solder tail Ordering information RoHS-compliant parts PP Plating code Sleeve Clip 88 PLCC sockets, solder tail, with precision stamped

PPS-GF30-FR

Abstract: 5408803217400
Contextual Info: PRECI-DIP SA - Page 1 of 2 PGA / BGA / PLCC - PLCC SURFACE MOUNT Series 540 PGA / BGA / PLCC - PLCC surface mount PLCC Socket for Plastic Leaded Chip carrier PLCC , Surface mount PLCC sockets with SMT terminations come with square sizes for IC-packages according to JEDEC MO-047,