BGA 48 PACKAGE THERMAL RESISTANCE Search Results

BC 1098

Abstract: EPM7384 ALTERA 68 PLCC t187
Contextual Info: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

48 ball VFBGA

Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Contextual Info: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated

BGA 11x11 junction to board thermal resistance

Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
Contextual Info: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature

202 ball bga

Contextual Info: Thermal Management Introduction to Thermal Management Ways to Reduce Junction Temperature Thermal considerations are rarely an issue with lowdensity PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound

BGA 64 PACKAGE thermal resistance

Abstract: G42-88 G38-87 492-Ball
Contextual Info: Thermal Management Introduction to Thermal Management Ways to Reduce Junction Temperature Thermal considerations are rarely an issue with lowdensity PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound

bt 1696

Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
Contextual Info: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

PCB design for very fine pitch csp package

Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue

fcBGA PACKAGE thermal resistance

Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Contextual Info: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America

smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue

V2 smd transistor

Abstract: B048K060T24 JESD22-A-103A JESD22-A-104B JESD22-A113-B SMD TRANSISTOR MARKING 2.x
Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM V•I Chip – BCM Bus Converter Module TM B048K060T24 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 6 V V•I Chip Converter • Typical efficiency 95% • 240 Watt 360 Watt for 1 ms

JESD22-A-103A

Abstract: JESD22-A-104B JESD22-A113-B JESD22-B-107-A V048K480T006 337 BGA footprint
Contextual Info: PRELIMINARY VTM V048K480T006 V•I Chip – VTM Voltage Transformation Module TM • 48 V to 48 V V•I Chip Converter • 125°C operation • 6.3 A 9.4 A for 1 ms • 1 µs transient response • High density – 1218 W/in3 K indicates BGA configuration. For other

JESD22-A-103A

Abstract: jesd22-a-104B JESD22 A-102 JESD22-A-101 JESD22-B-107-A converter 48 to 24 switching
Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM V•I Chip – BCM Bus Converter Module TM B048K480T30 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 48 V V•I Chip Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms

337 BGA footprint

Abstract: IPC 9701
Contextual Info: PRELIMINARY VTM V048K480T006 V•I Chip – VTM Voltage Transformation Module TM • 48 V to 48 V V•I Chip Converter • 125°C operation • 6.3 A 9.4 A for 1 ms • 1 µs transient response • High density – 1218 W/in3 K indicates BGA configuration. For other

Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM V•I Chip – BCM Bus Converter Module TM B048K160T24 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 16 V V•I Chip Converter • Typical efficiency 96% • 240 Watt 360 Watt for 1 ms

A3G3

Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM V•I Chip – BCM Bus Converter Module TM B048K030T21 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 3 V V•I Chip Converter • 94% efficiency • 210 Watt 315 Watt for 1 ms

IPC-9701

Abstract: F17a
Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM V•I Chip – BCM Bus Converter Module TM B048K160T24 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 16 V V•I Chip Converter • Typical efficiency 96% • 240 Watt 360 Watt for 1 ms

SMD capacitor 106c

Abstract: capacitor SMD 106C JESD22-A-101
Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM V•I Chip – BCM Bus Converter Module TM B048K096T24 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 9.6 V V•I Chip Converter • Typical efficiency 96% • 240 Watt 360 Watt for 1 ms

IPC 9701

Abstract: transistor marking JB
Contextual Info: BCM V•I Chip – BCM Bus Converter Module TM B048K480T30 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 48 V V•I Chip Converter • >97% efficiency • 300 Watt 450 Watt for 1 ms • 125°C operation + +

IPC-9701

Abstract: JESD22-A-101
Contextual Info: PRELIMINARY V•I Chip Voltage Transformation Module BCM V•I Chip – BCM Bus Converter Module TM B048K120T30 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 12 V V•I Chip Converter • 96% efficiency • 300 Watt 450 Watt for 1 ms