BGA 31 X 31 TRAY Search Results

tray 20 x 14

Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Contextual Info: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type

SPANSION S29GL128

Abstract: s29gl128 S29GL128* FOOTPRINT GL128N GL256N S29GL128N S29GL256N FAA064 0C700000 SA148
Contextual Info: S29GL128/256N MirrorBit Flash with Alternative BGA Pinout 128 and 256 Megabit, 3.0 Volt-only Page Mode Flash Memory featuring 110 nm MirrorBit Process Technology ADVANCE INFORMATION Data Sheet Supplement Notice to Readers: The Advance Information status indicates that this

spansion part marking

Abstract: Spansion S29GL256N spansion top marking SPANSION s29al016d s29al016 S29AL016D90TAI020 Am29LV256MH113REI S29AL016D70BAI010 S29GL128N10FAI010 S29AL016D70TFI020
Contextual Info: FLASH MEMORY OPN MAP GUIDE November, 2004 Release for: S29AL016D S29AL016M S29JL032H S29GL032M S29GL064M S29GL128N S29GL256N Spansion Order Part Number OPN Mapping Guide Use this tool to map an AMD OPN to its corresponding Spansion OPN. NOTE: This list may not include every available OPN. Please consult the

smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

TB-2082

Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
Contextual Info: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02

BFG95

Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

N04T1630C1BTR

Abstract: N04T1630C2BZ TSOP2-44
Contextual Info: N04T1630C1B N04T1630C2B NanoAmp Solutions, Inc. 1982 Zanker Road, San Jose, CA 95112 ph: 408-573-8878, FAX: 408-573-8877 www.nanoamp.com 4Mb Ultra-Low Power Asynchronous CMOS SRAM 256Kx16 bit Overview Features The N04T1630C2B is an integrated memory device containing a low power 4 Mbit SRAM built

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

MICRON mcp

Abstract: PC28F256P30B P30-65nm PC28F256P PC28F256P30BFF PF48F4400P0VBQEF PC28F256P30BFE JS28F256P30BF Micron 512MB NOR FLASH PF48F
Contextual Info: 256Mb and 512Mb 256Mb/256Mb , P30-65nm Features Micron Parallel NOR Flash Embedded Memory (P30-65nm) JS28F256P30B/TFx, RC28F256P30B/TFx, PC28F256P30B/TFx, RD48F4400P0VBQEx, RC48F4400P0VB0Ex, PC48F4400P0VB0Ex, PF48F4000P0ZB/TQEx Features • Security – One-Time Programmable Register: 64 OTP bits,

RC48F4400P0VB0E

Abstract: PC28F256P30BFF MICRON mcp pf48f4400p0vbqe rc28F256P30TFE
Contextual Info: 256Mb and 512Mb 256Mb/256Mb , P30-65nm Features Micron Parallel NOR Flash Embedded Memory (P30-65nm) JS28F256P30B/TFx, RC28F256P30B/TFx, PC28F256P30B/TFx, RD48F4400P0VBQEx, RC48F4400P0VB0Ex, PC48F4400P0VB0Ex, PF48F4000P0ZB/TQEx Features • Security – One-Time Programmable Register: 64 OTP bits,

pc28f00ap30

Abstract: JS28F512P30 PC28F512P30 PC28F00AP30TF pc28f00ap PC28F512P30BF PC28F00BP30EF pc28f00ap30ef PC28F00AP30BF JS28F512P30BF
Contextual Info: Numonyx Axcell P30-65nm Flash Memory 512-Mbit, 1-Gbit , 2-Gbit Datasheet Product Features „ High performance: Easy BGA: — 100ns initial access time 512-Mbit, 1-Gbit — 105ns initial access time (2-Gbit) — 25ns 16-word asynchronous-page read mode

TUNDRA CA91C042

Abstract: tundra scv64 tundra universe universe VME to PCI Bridge CA91C042 tundra nitrogen reflow VME64 pci to vme csr BGA reflow guide
Contextual Info: The information in this document is subject to change without notice and should not be construed as a commitment by Newbridge Microsystems. While reasonable precautions have been taken, Newbridge Microsystems assumes no responsibility for any errors that may appear in this document.

S29AL008D

Abstract: AL008 spansion part marking AL008D spansion s29al008d VBK048 spansion top marking S29AL008D10BA1010 BGA package tray 40 x 40
Contextual Info: ���� ���� ���� ���� ����� ����� ����� ������ ������ ������ S29AL008D Floating Gate Flash Memory 8 Megabit 512 K x 16-Bit / 1 M x 8-Bit Spansion Overview

Spansion s29al016d

Abstract: al016d S29AL016D spansion top marking am29lv160bt spansion part marking spansion marking VBK048 TS048 TRAY S29AL016D10BA1010
Contextual Info: ���� ���� ���� ���� ����� ����� ����� ������ ������ ������ S29AL016D Floating Gate Flash Memory 16 Megabit 1 M x 16-Bit / 2 M x 8-Bit Spansion Overview Spansion™, the Flash memory subsidiary of AMD and Fujitsu, is the

Contextual Info: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the

Contextual Info: ARM-based Embedded MPU SAM9N12 SAM9CN11 SAM9CN12 SUMMARY DATASHEET Description Based on the ARM926EJ-S processor, the Atmel SAM9N12/CN11/CN12 devices offer the frequently-requested combination of user interface functionality and high data rate connectivity, with LCD Controller, resistive touch-screen, multiple UARTs, SPI,

qfn 3x3 tray dimension

Abstract: PEAK TRAY QFN 4x4 QFN tray qfn 4x4 PEAK TRAY bga QFN tray PEAK TRAY qfn 4 x 4 qfn 4x4 tray dimension QFN tray 3x3 485G NBSG14
Contextual Info: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept

28F128K3C

Abstract: 28f128k3c115 RC28F128K3C115 RC28F256K3C120 28F128K18 28F128K3 28F256K18 Intel SCSP RC28F256K3C120 lead free 28F256K3
Contextual Info: Intel StrataFlash Synchronous Memory K3/K18 28F640K3, 28F640K18, 28F128K3, 28F128K18, 28F256K3, 28F256K18 (x16) Datasheet Product Features • ■ ■ Performance — 110/115/120 ns Initial Access Speed for 64/128/256 Mbit Densities — 25 ns Asynchronous Page-Mode Reads,

spansion top marking

Abstract: spansion part marking spansion marking S29AL032D10FA1010 tsop package S29AL032D AMD top marking TS048 TRAY spansion tape AL032D
Contextual Info: ���� ���� ���� ���� ����� ����� ����� ������ ������ ������ S29AL032D Floating Gate Flash Memory 32 Megabit 2 M x 16-Bit / 4 M x 8-Bit Spansion Overview Spansion™, the Flash memory subsidiary of AMD and Fujitsu, is the

mpc5668g

Abstract: MPC5668X a3700 automotive power transistor PJ15 SPC5668GF1AMMG SPC5668GF1 PJ59 SPC5668 317 MG 707 SPC5668x
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 6, 03/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category

Contextual Info: T E X A S I N S T R U M E N T S - P R O D U C T I ON D ATA Stellaris LM3S1512 Microcontroller DATA SH E E T DS - LM 3S 1512 -1 2 7 4 6 .2 5 1 5 S P M S 018H C opyri ght 2007- 2012 Texas Instruments Incorpor at ed Copyright Copyright © 2007-2012 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare® are registered trademarks of Texas Instruments

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 4, 01/2011 MPC5668x MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category – 32 KB unified cache with line locking and eight-entry