BETTER THAN I Search Results

Contextual Info: MIC5209 500mA Low-Noise LDO Voltage Regulator Preliminary Information General Description Features The MIC5209 is an efficient linear voltage regulator with very low dropout voltage, typically 10mV at light loads and less than 500mV at full load, with better than 1% output voltage

samsung hd501lj

Abstract: Samsung SpinPoint F1 HD103UJ samsung hd103uj SAMSUNG HD321HJ samsung hd322hj Samsung SpinPoint F1 HD753lj HD753LJ HD502ij HD322HJ hd501lj
Contextual Info: Samsung Spinpoint F1 Hard Disk Drive Industry’s First Three-Disk Solution for Terabyte Storage The Samsung Spinpoint F1 drive offers a superior combination of density, recording quality and reliability. Better Reliability, Less Energy Consumption than Other Options

16f873

Abstract: AN-00MX-007
Contextual Info: Low Cost, ±5 g Dual Axis Accelerometer with Digital Outputs MXD2004A/B Sck optional FEATURES Dual axis accelerometer fabricated on a monolithic CMOS IC On-chip mixed mode signal processing Better than 3 milli-g resolution 50,000 g shock survival rating

IC5216

Contextual Info: MIC5216 500mA-Peak Output LDO Regulator Preliminary Information General Description Features The M IC5216 is an efficient linear voltage regulator with high peak output current capability, very low dropout voltage, and better than 1% output voltage accuracy. Dropout is typically

MXD2125GL

Abstract: MXD2125ML best sensor for vehicle counting MXD2125HL MXD2125NL blood pressure circuits using microcontroller blood pressure measurement digital circuit
Contextual Info: Improved, Ultra Low Noise ±2 g Dual Axis Accelerometer with Digital Outputs MXD2125GL/HL MXD2125ML/NL FEATURES Resolution better than 1 milli-g Dual axis accelerometer fabricated on a monolithic CMOS IC On chip mixed mode signal processing No moving parts

d2010a

Abstract: D2010B AN-00MX-007 D2010
Contextual Info: Low Cost, ±2 g Dual Axis Accelerometer with Digital Outputs MXD2010A/B Sck optional FEATURES Dual axis accelerometer fabricated on a monolithic CMOS IC On-chip mixed mode signal processing Resolution better than 2 milli-g 50,000 g shock survival rating

Contextual Info: TRM Professional Multianode Tantalum Ultra Low ESR Capacitor • Improved reliability – 0.5%/1khrs twice better than standard • DCL reduced by 25% to 0.0075 CV • Robust against higher thermo-mechanical stresses during assembly process • Multi-anode construction

Contextual Info: Product Number: 4021 3M Conductive Hinged Container, 4021 2-7/8x1-3/16X1/2 3M Hinged Containers are made from injection-molded plastic, and are noncorrosive and lightweight. The containers feature molded pin hinges that provide better security and reliability than traditional snap hinges.

Contextual Info: Microminiature Connectors Hermetic-MDMH MDMH connectors are ideal for applications requiring a better seal than can be achieved with epoxy resins. The connector utilizes size 24 AWG contacts that are compression glass sealed through a steel shell and into a diallyl pthalate front end

AAB1

Abstract: AT350V LH1056AAB1 DS9014 LH1056AT1 LH105
Contextual Info: AT& T Preliminary Data Sheet November 1993 Microelectronics LH1056AT1/AAB1 High-Voltage Solid-State Relay Description Features • 3750 Vrms input/output isolation ■ High-surge capability ■ Low ON-resistance ■ Clean, bounce-free switching ■ dv/dt typically better than 500 V/jis

LX25

Abstract: MIC5256
Contextual Info: MIC5256 150mA µCap LDO with Error Flag General Description Features The MIC5256 is an efficient, precise CMOS voltage regulator. It offers better than 1% initial accuracy, extremely low-dropout voltage typically 135mV at 150mA and low ground current (typically 90µA) over load. The

Contextual Info: Thin Film Chip Resistor Networks RN 1220 and 1632 Series, Precision 1.0 Description These 1206 chip resistor networks are available with either 2 or 3 resistors, and offer better performance than SIP networks. The surface mount package allows for less parasitic capacitance/inductance and even lower

ESDA8V2-1J

Abstract: 8V2 diode mil std 883G diode marking e8
Contextual Info: ESDA8V2-1J EOS and ESD Transil protection for charger and battery port Features • Breakdown voltage VBR = 8.2 V ■ Unidirectional device ■ High peak power dissipation: 500 W 8/20 µs waveform ■ ESD protection level better than IEC 61000-4-2, level 4:

Contextual Info: A N A LO G D E V IC E S 3.3 V Supply, Voltage Output Temperature Sensor with Signal Conditioning AD22103* FEATURES 3.3 V, Single Supply Operation Temperature Coefficient of 28 m V/°C 100°C Temperature Span 0°C to +100°C Accuracy Better Than 2.5% of Full Scale

Hitachi DSA0095

Abstract: HD74BC574A
Contextual Info: HD74BC574A Octal D Type Flip Flops With 3 State Outputs ADE-205-042A Z 2nd. Edition Sep. 2000 Description The HD74BC574A provides high drivability and operation equal to or better than high speed bipolar standard logic IC by using Bi-CMOS process. The device features low power dissipation that is about 1/5

Contextual Info: MIC5237 500mA Low-Dropout Voltage Regulator Preliminary Information General Description Features The MIC5237 is a general-purpose low-dropout regulator capable of 500mA output current with better than 3% output v o lta g e a ccuracy. U sing M ic re l’s p ro p rie ta ry S uper

2N2857 DIE

Abstract: 2N2857 MOTOROLA 2N3839 SILICON DICE motorola
Contextual Info: MOTOROLA SC {DIODES/OPTO} 6367255 MOTOROLA 34 SC M T | L ,3 t ,7 5 S S DIODES/OPTO 34-C 0 0 3 f lC m 38049 |~" D T'3i-ir SILICON RF TR A N SISTO R DICE (continued) 2C2857 DIE NO. — NPN LINE SOURCE — RF502.153 This die provides performance equal to or better than that of

Contextual Info: MP8798 CMOS Very Low Power 10-Bit, Analog-to-Digital Converter with 4-Channel Mux M Micro Power Systems BENEFITS FEATURES 10-Bit Resolution Sampling Rates from <1 kHz to 1 MHz DNL better than 1/2 LSB typ up to 1 MHz Very Low Power CMOS - 30 mW (typ) Power Down; Lower Consumption - 3 mW (typ)

2N3960

Abstract: motorola 2N3960
Contextual Info: 34 M O T O R O L A SC -CDIODES/OPTOJ 6 3 6 7 2 5 5 M O T O R O L A SC * DE | b 3 b 7 2 S S DIODES/OPTO 3 ^c 0030052 0 3 8 q 52 T- 3/-Ä3 SILICON RF TRANSISTOR DICE (continued) 2C3960 DIE NO. — NPN LINE SOURCE — RF502.93 This die provides performance equal to or better than that of

millipaq package

Abstract: millipaq 24-Pin Plastic DIP qsop 24 footprint footprint 24PIN DIP TQFP 100 PACKAGE footprint TQFP 100 footprint qfp 25mils
Contextual Info: Q QUALITY SEMICONDUCTOR, INC. QSI Packaging Innovation INTRODUCTION Quality Semiconductor, Inc., was founded in 1988 with the mission of bringing value-added products to the high-performance semiconductor market. One key aspect of our strategy was development of new packaging

LWH1025

Abstract: 10E4
Contextual Info: LWH1025 - CONTENTS - 1. Features 2. Outline dimensions 3. Package material 4. Absolute Maximum Ratings 5. Electrical Optical Characteristics 6. Ranks 7. Taping 8. Packing Struction 9. Characteristic Diagrams 10. Precautions to taken 11. Reliability 12. Precautions in use

1310nm TRANSCEIVER CIRCUIT DIAGRAM

Abstract: 8GHz transceiver specification ZD 410 MF 1310nm photodiode for 10Gbps 1310nm ROSA 10Gbps 1310nm TRANSMITTER CIRCUIT DIAGRAM GR-253-CORE I-64 MF-10KSXA-007ZA SDD11
Contextual Info: Mitsubishi Electric Corp. Datasheet MITSUBISHI OPTICAL DEVICES MF-10KSXA-007ZA 10Gbps 1310nm XFP Optical Transceiver XFP Multirate Optical Transceiver MF-10KSXA-007ZA Features: • • • • • • • Protocol Independent 10Gbps transceiver Hot pluggable

Contextual Info: PM2602 RFIC RF Switch 800 to 2500 MHz Operation DATA SHEET PRELIMINARY Features 1= o 1 dB Insertion Loss 30 dB Isolation 50 dBm Input Third Order Intercept 3 - 5 V Single Positive Supply NEW 10 Pin PM-SOP Package Half the Size of SO-14 Low Profile, PCMCIA Type II Compatible

Contextual Info: RFH RF2402 MICRO DEVICES UHF QUADRATURE MODULATOR Typ ical A p plications • Digital and Spread Spectrum Systems • AM, SSB, DSB Modulation • GMSK, QPSK, DQPSK, QAM Modulation • Image-Reject Upconverters • GSM and D-AMPS Cellular Systems Product D escription