BE MARKING Search Results

DC37 series connectors

Abstract: 80C517A SAB 80C517A
Contextual Info: SIEMENS Microcomputer Components Technical Support Group Munich HL MCB AT1 Errata Sheet August 23, 1995 / Release 1.2 Device : Marking : SAB 80C517A BE These parts of the SAB 80C517A can be identified by the letters "BE" below the part number. The parts are mounted in Plastic Leaded Chip Carrier P-LCC-84

Marking

Abstract: VARIO sign
Contextual Info: Make terminal assemblies look professional while increasing wiring efficiency and facilitating troubleshooting. Marking systems can be used to mark terminal block tags, wire markers, shrink tubing, labels and signs. These universal plotters can be used to print many

Contextual Info: Products for Parts Per Million PPM & Statisitical Process Control (SPC) General : Unless otherwise specified, it should be performed per MIL-STD-105E leve II, normal inspection. (AQL-Acceptable Quality Level B) Mechanical and marking inspection should be performed with

Contextual Info: PI3USB10LP-BE |

Contextual Info: PI3USB10LP-BE |

spansion top marking

Abstract: spansion marking date code Spansion wafer marking RG04 fd1h spansion marking marking 0E marking 1F spansion date code marking S29CD032G
Contextual Info: S29CD-G Electronic Marking Supplement This document includes details of the electronic marking information that will be stored and locked in the S29CD016G and S29CD032G one-time-programmable Secured Silicon Sector. The Secured Silicon Sector will no longer be available as a

Contextual Info: 131-91045 NOTES: 1. MATERIALS AND FINISHES: BODY - Be Cu, GOLD PLATING .000050 MIN THICK OVER SULFAMATE NICKEL (.000050 MIN) BODY - Be Cu, GOLD PLATING (.000030 MIN THICK) OVER NICKEL (.000010 MIN) COUPLING NUT - Be Cu, GOLD PLATING (.000050 MIN THICK) OVER NICKEL

PI3USB10LP-B

Abstract: PI3USB10LP-BE JESD22-A114D ZM10 pericom date code marking UQFN-10 PI3USB10LP
Contextual Info: Data Sheet PI3USB10LP-BE |

KRX105E

Contextual Info: SEMICONDUCTOR KRX105E MARKING SPECIFICATION TESV PACKAGE 1. Marking method Laser Marking BE 1 3 No. 0 1 2. Marking 2 Item Marking Description Device Mark BE KRX105E hFE Grade - - * Lot No. 01 2006. 1st Week [0:1st Character, 1:2nd Character] Pin No. Dot Pin 1 Index.

AP2924

Abstract: C167 instruction set siemens C167 C166 C167 C167CR C167CR-LM SAK-C167CR-LM C166 I2C PEC single byte software
Contextual Info: Microcontroller Components Errata Sheet September 28, 1998 / Release 1.3 Device: SAK-C167CR-LM Stepping Code / Marking: ES-BE, BE Package: MQFP-144 This Errata Sheet describes the deviations from the current user documentation. The classification and numbering system is module oriented in a continual ascending sequence

KRX105U

Contextual Info: SEMICONDUCTOR KRX105U MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking 2. Marking 3 No. 0 1 BE 1 2 Item Marking Description Device Mark BE KRX105U hFE Grade - - * Lot No. 01 2006. 1st Week [0:1st Character, 1:2nd Character] Dot ● Pin 1 Indexs

KRX205U

Contextual Info: SEMICONDUCTOR KRX205U MARKING SPECIFICATION US6 PACKAGE 1. Marking method Laser Marking BE 1 3 No. 0 1 2. Marking 2 Item Marking Description Device Mark BE KRX205U hFE Grade - - * Lot No. 01 2006. 1st Week [0:1st Character, 1:2nd Character] Pin No. Dot Pin 1 Index.

KRX205E

Abstract: MARKING BE
Contextual Info: SEMICONDUCTOR KRX205E MARKING SPECIFICATION TES6 PACKAGE 1. Marking method Laser Marking BE 1 3 No. 0 1 2. Marking 2 Item Marking Description Device Mark BE KRX205E hFE Grade - - * Lot No. 01 2006. 1st Week [0:1st Character, 1:2nd Character] Pin No. Dot Pin 1 Index.

tlp290

Abstract: TLP290-4 TLP291 PACKING 210MAX tlp291
Contextual Info: TENTATIVE TLP290-4 TLP290-4 Technical Information This material is technological examination material to aim at the product introduction. The change in the content of the characteristic might be accompanied at the final specification process. The final specification will be able to be gotten in the brokerage

MBM29F160

Abstract: FPT-48P-M19 FPT-48P-M20
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-20879-2E FLASH MEMORY CMOS 16M 2M x 8/1M × 16 BIT MBM29F160TE/BE-55/-70/-90 • GENERAL DESCRIPTION The MBM29F160TE/BE is a 16M-bit, 5.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29F160TE/BE is offered in a 48-pin TSOP (I) package. The device is designed to be

FPT-48P-M19

Abstract: FPT-48P-M20
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-20879-2E FLASH MEMORY CMOS 16M 2M x 8/1M × 16 BIT MBM29F160TE/BE-55/-70/-90 • GENERAL DESCRIPTION The MBM29F160TE/BE is a 16M-bit, 5.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29F160TE/BE is offered in a 48-pin TSOP (I) package. The device is designed to be

Contextual Info: SL POWER ELECTRONICS CORP. 6050 King Drive, Bldg. A Ventura, CA 93003 + 805-486-4565 Internet: www.slpower.com GPC200 SERIES INSTALLATION INSTRUCTIONS MODEL NUMBERS: GPC200A, GPC200B, GPC200D, GPC200E, GPC200F, and Special Models GPC200-XYZ where X may be the letter B, C or D; Y may be the letter A, B, C, Q, R or S; Z may be the letter A, B, C or D. Models may be followed by

Contextual Info: UNCONTROLLED DOCUMENT REV. A B PART NUMBER REV. IR L - L X 1 3 C B E.C.N. NUMBER AND REVISION COMMENTS REDRAWN./ ECN #1114-6 DATE 1.18.95 03.012.07 NOTES 1. MARKINGS MUST BE CAPABLE OF WITHSTANDING SOLVENTS. 2. TERMINALS MUST BE TIN OR TIN PLATED. 3. RATINGS - ELECTRICAL

IR-007

Abstract: QSDL-M121 datecode HSDL-2101
Contextual Info: Hewlett-Packard Company Infrared Component Business Unit 1150 Depot Road Singapore 109673 Customer Change Notice For Hewlett-Packard Infrared Components Notification Date : Jun ’98 IR-007 : Datecode Ink Marking on HSDL-2x00 Family Please be advised that Hewlett-Packard will be making the following product change s on

Contextual Info: 131-91045 NOTES: 1. MATERIALS AND FINISHES: BODY - Be Cu, GOLD PLATING .000050/.000070 THICK OVER ELECTROLESS NICKEL (.000050/.000070) THICK OVER (.000020/.000050) COPPER BODY - Be Cu, GOLD PLATING (.000030 MIN THICK) OVER NICKEL (.000010 MIN) COUPLING NUT - Be Cu, GOLD PLATING (.000050 MIN THICK) OVER NICKEL

Contextual Info: SIEMENS NPN Silicon Double Transistors BCV61 • To be used as a current mirror • Good thermal coupling and V be matching • High current gain • Low emitter-saturation voltage Type Marking Ordering Code tape and reel BCV 61 A BCV61 B BCV 61 C 1Js 1Ks

Contextual Info: REV RoHS COMPLIANT 592-0002F ECN NO REVISIONS A Part Numbers with the "F" suffix ending are RoHS Compliant. Packaging is marked with "RoHS Compliant" label or equivalent markings. These parts can be used with RoHS reflow profile. Parts can be wave soldered, dip soldered or hand soldered

Marking transistor

Abstract: 2301 marking all transistor data book datasheet laser IEC 60384-14 Semiconductor Marking information
Contextual Info: Marking Information Marking Specification For 2301 Mark Name A01 Mode Laser Font ARIAL Font Size See the description from below Marking plate： A01 Production View： Details： 1. The characters should be in the center of print area。 2. All of the characters should be complete, clear。

ssf4606

Abstract: 4606-HF SSF4606-HF Marking transistor semiconductor datasheet laser Diode Marking Marking information
Contextual Info: Marking Information Marking Specification For SSF4606-HF Mark Name SSF4606 Mode Laser Font ARIAL Font Size See the description from below Marking plate： Production View： Details： 1. The characters should be in the center of print area。 2. All of the characters should be complete, clear。