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    BC30S Search Results

    BC30S Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    BC30S04
    Amphenol Communications Solutions Spring Battery Connector,SMT,1.60mm pitch 4 positions, 15u\\ Au LCP Black, Reel PDF
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    BC30S Price and Stock

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    Infineon Technologies AG IRG4IBC30SPBF

    - Bulk (Alt: IRG4IBC30SPBF)
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    Avnet Americas IRG4IBC30SPBF Bulk 2,273
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    RS IRG4IBC30SPBF Bulk 2
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    Rochester Electronics IRG4IBC30SPBF 9,471 1
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    Flip Electronics IRG4IBC30SPBF 715
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    Infineon Technologies AG AUIRG4BC30SSTRL

    Trans IGBT Chip N-CH 600V 34A 3-Pin(2+Tab) D2PAK T/R - Tape and Reel (Alt: AUIRG4BC30SSTRL)
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    Avnet Americas AUIRG4BC30SSTRL Tape & Reel 800
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    Rochester Electronics AUIRG4BC30SSTRL 6,810 1
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    Chip 1 Exchange AUIRG4BC30SSTRL 13,600
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    EBV Elektronik AUIRG4BC30SSTRL 53 Weeks 800
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    Vishay Siliconix SIHFBC30STRL-GE3

    SIHFBC30STRL-GE3 N-CHANNEL MOSFET TRANSISTOR, 3.6 A, 600 V, 3-PIN D2PAK
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    RS SIHFBC30STRL-GE3 Bulk 700 5 Weeks 1
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    Amphenol Commercial BC30S04

    SPRING BATTERY CONNECTOR, SMT,1.60MM PITCH 4 POSI
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    RS BC30S04 Bulk 14 Weeks 19,200
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    Infineon Technologies AG IRG4BC30SPBF

    600V DC-1 KHZ (STANDARD) DISCRETE IGBT IN A TO-220AB PACKAGE
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    RS IRG4BC30SPBF Bulk 5
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    Rochester Electronics IRG4BC30SPBF 5,370 1
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    BC30S Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    F B0347

    Abstract: b0349 BC184LB B0679 35S20 BDX330 B0242c f b0349 B0346 BD370-6
    Contextual Info: Pro Electron Series in o PRO ELECTRON SERIES Bipolar—see page 5-37 for JFET o Type No. BC107 BC107A Can Styl« TO-18 TO-18 VCES* v CBO (VI M in 50 50 v CEO (V) M in 45 45 v EB0 (V) M in 6 6 •c e s * 'CBO a InA) Max 15* 15* V CB IV) 50 50 H rh Ne 1 kH z *


    OCR Scan
    dd3ss11f b0347b0349bc184lb+7b067935s20bdx330b0242cf b0349b0346bd370-6 PDF

    BC30S

    Contextual Info: Amphenol Battery Connector 1. Material: Pin: Beryllium Copper Insulator: Glass filled high temperature Engineering Plastics UL94V0, black 2. Finish: 15 mirco-inch 0.38 micron Min gold plateing at mating area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch (1.27-2.54 micron) nickel under plated.


    Original
    ul94v0bc30s03bc30s PDF