BC 945 DATA SHEET Search Results

Contextual Info: DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] REVISION R DO NOT SCALE FROM THIS PRINT SCP2-17-XX-X-XX.XX-X-XX POSITIONS -32 PLATING -S: SELECTIVE GOLD USE BWL-01-32-24-X-XX.XX-S -F: FLASH SELECTIVE GOLD (USE BWL-01-32-24-X-XX.XX-F) END 1 OPTION * -S: SOCKET (NOT AVAILABLE

Contextual Info: SCP2-17-XX-X-XX.XX-X-XX REVISION M POSITIONS -32 PLATING -S: SELECTIVE GOLD USE BWL-01-32-24-X-XX.XX-S -F: FLASH SELECTIVE GOLD (USE BWL-01-32-24-X-XX.XX-F) DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] FIG. 1 END 1 OPTION -T: TERMINAL CABLE LENGTH * -XX.XX:

Contextual Info: SCP2-17-XX-X-XX.XX-X-XX REVISION L POSITIONS -32 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] PLATING -S: SELECTIVE GOLD USE BWL-01-32-24-X-XX.XX-S -F: FLASH SELECTIVE GOLD (USE BWL-01-32-24-X-XX.XX-F) L FIG. 1 L ASSEMBLED LENGTH: XX.XX + "B" (SEE TABLE 1)

Contextual Info: SCPU-17-X-XX.XX-XXX-XXX REVISION N N PRODUCT MANUFACTURED Pb THIS WITH LEAD-FREE PROCESSING PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTIONS -AMS: SEALED USB A USB A END SEALED ONLY (SEE SHEETS 1-3 & 11) -BMS: SEALED USB B (USB B END SEALED ONLY)

Contextual Info: SCPU-17-X-XX.XX-XXX-XXX REVISION V PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS DO NOT SCALE FROM THIS PRINT END 1 END 2 OPTIONS -AMS: SEALED USB A USB A END SEALED ONLY (SEE SHEETS 1-3 & 11) -BMS: SEALED USB B DESIGNED & DIMENSIONED (USB B END SEALED ONLY)

Contextual Info: SCPU-17-X-XX.XX-XXX-XXX REVISION R PRODUCT MANUFACTURED Pb THIS WITH LEAD-FREE PROCESSING END 1 DO NOT SCALE FROM THIS PRINT PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTIONS -AMS: SEALED USB A USB A END SEALED ONLY (SEE SHEETS 1-3 & 11)

Contextual Info: SCPU-17-X-XX.XX-XXX-XXX REVISION Y PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 1 DO NOT SCALE FROM THIS PRINT END 2 OPTIONS -AMS: SEALED USB A USB A END SEALED ONLY (SEE SHEETS 1-3 & 11) -BMS: SEALED USB B DESIGNED & DIMENSIONED (USB B END SEALED ONLY)

Contextual Info: REVISION K RPCU-X-XX.XX-XXX-XX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] PLATING SPECIFICATION END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1) -BC: BLUNT CUT (SEE SHEET 3, FIG 2) -BM: USB B NOT SEALED (USB B END NOT SEALED ONLY &

transistor BC 945

Abstract: M17/194-00001 M17/113-RG316 M17/133-00001 M17/94-RG179 M17/127 RG393 rg79 M17/75-RG214 67-RG177 MIL-C-17 rg214
Contextual Info: M17/MIL-C-17 Coaxial Cable Database M17 M17 RG M17 TMS Conductor Dielectric Shields Jacket Armor Weight Impedance Velocity of Capacitance Max Oper. Temperature Operating Attenuation Notes and Part Spec Type QPL P/N inches inches inches inches inches lbs/foot

Contextual Info: COVER DATA SHEET 2GB Unbuffered DDR3L SDRAM DIMM EBJ20EF8EDWA 256M words  72 bits, 1 Rank Specifications Features • Density: 2GB • Organization — 256M words  72 bits, 1 rank • Mounting 9 pieces of 2G bits DDR3L SDRAM sealed in FBGA • Package: 240-pin socket type dual in-line memory

Contextual Info: COVER PRELIMINARY DATA SHEET 4GB DDR3L SDRAM SO-DIMM EBJ40EG8EFUA 512M words  72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words  72 bits, 1 rank • Mounting 9 pieces of 4G bits DDR3L SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual in-line

Contextual Info: COVER PRELIMINARY DATA SHEET 4GB Unbuffered DDR3L SDRAM DIMM EBJ40EG8EFWA 512M words  72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words  72 bits, 1 rank • Mounting 9 pieces of 4G bits DDR3L SDRAM sealed in FBGA

Contextual Info: COVER DATA SHEET 4GB Unbuffered DDR3 SDRAM DIMM EBJ40EG8BFWB 512M words x 72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words × 72 bits, 1 rank • Mounting 9 pieces of 4G bits DDR3 SDRAM sealed in FBGA • Package: 240-pin socket type dual in-line memory

Contextual Info: COVER PRELIMINARY DATA SHEET 4GB Unbuffered DDR3 SDRAM DIMM EBJ40EG8BFWA 512M words  72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words  72 bits, 1 rank • Mounting 9 pieces of 4G bits DDR3 SDRAM sealed in FBGA

LM 3919

Contextual Info: LED HIGH POWER CoB Product Series LED HIGH POWER CoB Product Series Data Sheet Created Date: 02 / 06 / 2013 Revision: 2.0, 05 / 21/ 2013 1 BNC-OD-C131/A4 Created Date : 05/26/2007 Revison : 1.01, 05/26/2008 LED HIGH POWER CoB Product Series 1. Description

Contextual Info: REVISION M SCPU-17-X-XX.XX-XXX-XXX PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS DO NOT SCALE FROM THIS PRINT PRODUCT MANUFACTURED Pb THIS WITH LEAD-FREE PROCESSING DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] LENGTH -XX.XX "A", SEE TABLE 1

MT9JSF25672AZ

Contextual Info: 1GB, 2GB x72, ECC, SR 240-Pin DDR3 UDIMM Features DDR3 SDRAM UDIMM MT9JSF12872AZ – 1GB MT9JSF25672AZ – 2GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C D1) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, unbuffered dual in-line memory module

DDR4

Abstract: DDR4 DIMM SPD JEDEC MTA9ASF51272AZ-2G1A1 DDR4 jedec micron ddr4 MO-309 DDR4-2133 MTA9ASF51272AZ MTA9ASF51272AZ-2G4 MT40A512M8
Contextual Info: 4GB x72, ECC, SR 284-Pin DDR4 UDIMM Features DDR4 SDRAM UDIMM MTA9ASF51272AZ – 4GB Features Figure 1: 284-Pin UDIMM (MO-309. R/C D) Module height: 31.25mm (1.23in) • DDR4 functionality and operations supported as defined in the component data sheet • 284-pin, unbuffered dual in-line memory module

"dj ac"

Abstract: EBJ51ED8BAFA-8A-E EDJ5308BASE transistor BC 945
Contextual Info: PRELIMINARY DATA SHEET 512MB Unbuffered DDR3 SDRAM DIMM EBJ51ED8CAFA, EBJ51ED8BAFA 64M words x 72 bits, 1 Rank Specifications Features • Density: 512MB • Organization  64M words × 72 bits, 1 rank • Mounting 9 pieces of 512M bits DDR3 SDRAM sealed in FBGA

Contextual Info: REVISION G DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] RPCU-X-XX.XX-XXX-XX PLATING SPECIFICATION -G: .000030 GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1) -BC: BLUNT CUT (SEE SHEET 3, FIG 2)

Contextual Info: REVISION F DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] RPCU-X-XX.XX-XXX-XX PLATING SPECIFICATION -G: .000030 GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1) -BC: BLUNT CUT (SEE SHEET 3, FIG 2)

td2002c

Contextual Info: bq2002C NiCd/NiMH Fast-Charge Management IC Features General Description ➤ The bq2002C Fast-Charge IC is a lowcost CMOS battery-charge controller providing reliable charge termination for both NiCd and NiMH battery applications. Controlling a current-limited

Contextual Info: REVISION C DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] RPCU-X-XX.XX-XXX-XX PLATING SPECIFICATION -G: .000030 GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1) -BC: BLUNT CUT (SEE SHEET 3, FIG 2)

Contextual Info: REVISION E DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] DO NOT SCALE FROM THIS PRINT RPCU-X-XX.XX-XXX-XX PLATING SPECIFICATION -G: .000030 GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1)