BAX BOARD Search Results

Contextual Info: AMP Aerospace/R uggedized Printed C ircuit Board Connectors Catalog 296350 issued 9-97 Extended M ini-Bax Pin Header Assem blies Style I H o u sing M a t e r ia l— L iq u ic c ry s ta l p o ly m e r C o n tact M a te r ia l an d F in is h — B ra ss p er Q Q -B -6 2 B p a tari 0 0 0 0 5 0

PDC401B2

Abstract: 78L05 524 PDC401 MXD2125E 16f873 MEMSIC inclinometer operation "Crystal Oscillator" 4mhz MXD2125 16f873 datasheet
Contextual Info: Operating Specification of Inclinometer Demo Box July/29, 03 Note: This Demo can measure the angles in vertical plane only. 1, Real-time Angle Measuring Mode: Snap the switch to “ON", the system is turned on, You can measure the angle now. If you want to freeze the current display, press

Contextual Info: LOOSE PIN INTERCONNECTS Pin receptacles are individual component lead sockets primarily used for the plugging and unplugging of components on pc boards. Pin receptacles are made by press-fitting a pre-tooled “multi-finger” contact into a precision machined shell. These receptacles will accept round pins ranging in diameter

Reduced-Latency-DRAM

Abstract: HYB18RL25616AC HYB18RL25632AC
Contextual Info: HYB18RL25632AC HYB18RL25616AC Graphics & Speciality DRAMs 256 Mbit DDR Reduced Latency DRAM Version 1.60 July 2003 HYB18RL25616/32AC 256 Mbit DDR Reduced Latency DRAM Edition Jun. 2002 This edition was realized using the software system FrameMaker. Published by Infineon Technologies,

HYB18RL25616AC

Abstract: HYB18RL25632AC Boundary Scan JTAG Logic RLDRAM
Contextual Info: HYB18RL25632AC HYB18RL25616AC Graphics & Speciality DRAMs 256 Mbit DDR Reduced Latency DRAM Version 1.42 Nov. 2002 HYB18RL25616/32AC 256 Mbit DDR Reduced Latency DRAM Edition Jun. 2002 This edition was realized using the software system FrameMakerâ. Published by Infineon Technologies,

MT49H16M18C

Contextual Info: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball µBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O

smd dk qk

Abstract: SMD MARKING CODE ACY smd marking codes BA5 smd marking codes BA2 RLDRAM MT49H16M18C
Contextual Info: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O

smd marking codes BA5

Abstract: MT49H16M18C
Contextual Info: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O

SMD d1c

Abstract: SMD MARKING CODE ACY qkx capacitor smd codes marking A21 MT49H16M18C
Contextual Info: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O

MT49H16M18

Contextual Info: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization

marking code a02 SMD Transistor

Abstract: transistor SMD DK MT49H16M18 smd transistor marking d1c Diode A3X transistor smd marking BA RE marking BAX smd cod plastic BA5 marking code A22 SMD MARKING CODE
Contextual Info: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization

MT49H16M18

Contextual Info: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball µBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization

MARKING H1 AMP

Abstract: MT49H16M18
Contextual Info: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization

plastic BA7 marking code

Contextual Info: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball µBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization

Contextual Info: 2,5mm Density, Crimp Type 2~Piece Connectors P52, CPM-A11 Series Connectors !OUTLINE P52 Series is 2-piece, type high density connector with the contact space of 2.5mm, having a clamp and polarization device built in. FEATURES_

K2-dk

Abstract: HYB18RL28809AC HYB18RL28818AC HYB18RL28836AC
Contextual Info: HYB18RL28809AC HYB18RL28818AC HYB18RL28836AC Graphics & Speciality DRAMs 288 Mbit DDR Reduced Latency DRAM Version 1.5 Apr. 2003 HYB18RL28809/18/36AC 288 Mbit DDR Reduced Latency DRAM Edition Apr. 2003 This edition was realized using the software system FrameMakerâ.

Contextual Info: PC Edgecard Connectors Edgecard Connector One Piece An economical one-piece edgecard connector with non-removable contacts. Shell configurations can be ordered with or without an integral mounting flange and the insulator material is of thermo­ plastic, rated UL 94V-0.

Intel megabit flash

Abstract: FFBC0100H SST49LF020
Contextual Info: 2 Megabit LPC Flash SST49LF020 Advance Information SST49LF0202 Mb LPC Flash FEATURES: • Standard LPC Interface – Conforms to Intel LPC Interface Specification 1.0 • Organized as 256K x8 • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 16 KByte overlay blocks

Contextual Info: 2 Mbit LPC Flash SST49LF020 SST49LF0202Mb LPC Flash Advance Information FEATURES: • LPC Interface Flash – SST49LF020: 256K x8 2 Mbit • Conforms to Intel LPC Interface Specification 1.0 • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 16 KByte overlay blocks

FFBC0100H

Abstract: SST49LF020
Contextual Info: 2 Mbit LPC Flash SST49LF020 SST49LF0202Mb LPC Flash Advance Information FEATURES: • Standard LPC Interface – Conforms to Intel LPC Interface Specification 1.0 • Organized as 256K x8 • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 16 KByte overlay blocks

Low Pin Count LPC Interface Specification 1.0

Contextual Info: 2 Mbit LPC Flash SST49LF020 SST49LF0202Mb LPC Flash Advance Information FEATURES: • Standard LPC Interface – Conforms to Intel LPC Interface Specification 1.0 • Organized as 256K x8 • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 16 KByte overlay blocks

27S45

Abstract: AM27S45
Contextual Info: Am27S45/Am27S47 a 16,384-Bit 2048x8 Bipolar Registered PROM with Programmable INITIALIZE Input DISTINCTIVE CHARACTERISTICS "S A " version offers superior performance with 25 ns setup time and 10 ns ciock-to-output delay* Slim, 24-pin, 300-mil lateral center package occupies

555H

Abstract: SST34HF162C SST34HF164C
Contextual Info: 16 Mbit Dual-Bank Flash + 2/4 Mbit SRAM ComboMemory SST34HF162C / SST34HF164C SST34HF162C16Mb Dual-Bank Flash + 2/4 Mb SRAM MCP ComboMemory Preliminary Specifications FEATURES: • Flash Organization: 1M x16 – 16 Mbit: 12 Mbit + 4 Mbit • Concurrent Operation

555H

Abstract: SST34HF162C SST34HF164C
Contextual Info: 16 Mbit Dual-Bank Flash + 2/4 Mbit SRAM ComboMemory SST34HF162C / SST34HF164C SST34HF162C16Mb Dual-Bank Flash + 2/4 Mb SRAM MCP ComboMemory EOL Data Sheet FEATURES: • Flash Organization: 1M x16 – 16 Mbit: 12 Mbit + 4 Mbit • Concurrent Operation – Read from or Write to SRAM while