BALL TRACKING Search Results

ON4800

Abstract: ball tracking
Contextual Info: SPECIFICATIONS DESKTOP R55 Weight Ball Tracking force Ball load Ball rotation Ball speed Housing material Transducer Mounting position 2” Marcus MECHANICAL 650gms Thermoset Phenolic, 57mm, 21/4” 15gms Nominal Continuous - No seal IP40/NEMA 1 200N Maximum downward pressure (20kg) @ 20ºc

trackball

Abstract: trackball ch DT225 track ball usb trackball trackball ch in
Contextual Info: 5.07in 128.78mm 5.51in (139.95mm) SPECIFICATIONS ELECTRICAL USB INPUT: OUTPUT: MECHANICAL 5V @ 25mA max USB1.1 BALL DIAMETER: BALL ROTATION: TRACKING FORCE: WEIGHT LIFE CYCLE (BALL ROTATIONS): RoHS compliant 2.25” Continuous 12g 460g 5 Million 2.38in (60.45mm)

trackball ch

Abstract: DT225 trackball trackball dt225 DT225 Gray Desktop trackball ch in 460g DT2253X20V00
Contextual Info: 5.07in 128.78mm 5.51in (139.95mm) SPECIFICATIONS ELECTRICAL PS/2 INPUT: OUTPUT: MECHANICAL BALL DIAMETER: BALL ROTATION: TRACKING FORCE: WEIGHT LIFE CYCLE (BALL ROTATIONS): RoHS compliant 5V @ 25mA max CMOS/TTL 2.25” Continuous 12g 460g 5 Million 2.38in

Contextual Info: Precision Ceramic Resistors Ball Grid Arrays Make Possible Precision Ceramic Precision Ceramic HC-Precision Series Ball Grid Arrays atio tolerances to ±0.05% Ball Grid Arrays bsolute tolerances to ±0.1% CHC-Precision Series oHS compliant terminations available

Contextual Info: Precision Ceramic Precision Ceramic Ball Grid Arrays Ball Grid Arrays Precision CHC-Precision SeriesCeramic HC-Precision Ball Grid Arrays tolerances to ±0.05% • RatioSeries atio tolerances to ±0.05% Absolute tolerances to ±0.1% bsolute tolerances to ±0.1%

lexan ls2

Abstract: KRD Polycarbonate T9902127 lexan 3 way switch diagram T9902128 T9902125 PHR-4 A3900126 4 pin usb connector details
Contextual Info: O50 Series OPTICAL TRACKERBALL • Specifications Mechanical Weight Ball Tracking Force 210 grams Epoxy Resin, 50.8 mm 10 grams Nominal Continuous – Free Running 80 grams Nominal Continuous – Friction / Scraper Ring 10 - 160 grams Nominal Continuous – Variable Friction Ring/Removable Ball

R1507F20V00-B

Abstract: track ball trackball trackball ch usb trackball
Contextual Info: 2.36in 59.94mm 2.11in (53.59mm) 0.90in (22.86mm) 2.08in (52.83mm) Ball Diameter 1.50in (38.10mm) 0.61in (15.49mm) 2.36in (59.94mm) 0.85in (21.59mm) 0.11in (2.79mm) R0.125in (3.18mm) 2.08in (52.83mm) 0.27in (6.86mm) Ø1.54in (39.12mm) 2.11in (53.59mm) 0.38in

track ball

Abstract: trackball trackball ch usb trackball
Contextual Info: 2.36in 59.94mm 2.11in (53.59mm) 0.90in (22.86mm) 2.08in (52.83mm) Ball Diameter 1.50in (38.10mm) 0.61in (15.49mm) 2.36in (59.94mm) 0.85in (21.59mm) 0.11in (2.79mm) R0.125in (3.18mm) 2.08in (52.83mm) 0.27in (6.86mm) Ø1.54in (39.12mm) 2.11in (53.59mm) 0.38in

trackball ch

Abstract: trackball LP100
Contextual Info: 0.69in 17.53mm 0.69in (17.53mm) Ball Diameter 1.00in (25.40mm) R 0.22in (5.59mm) 1.75in (44.45mm) O 0.12in (3.05mm) 1.75in (44.45mm) 1.30in (33.02mm) 0.91in (23.11mm) 0.28in (7.11mm) 0.13in (3.30mm) 1.08in (27.43mm) 0.30in (7.62mm) 0.67in (17.02mm) 0.37in (9.40mm)

100-133BX

Abstract: trackball ch in trackball trackball ch LP100
Contextual Info: 0.69in 17.53mm 0.69in (17.53mm) Ball Diameter 1.00in (25.40mm) R 0.22in (5.59mm) 1.75in (44.45mm) O 0.12in (3.05mm) 1.75in (44.45mm) 1.30in (33.02mm) 0.91in (23.11mm) 0.28in (7.11mm) 0.13in (3.30mm) 1.08in (27.43mm) 0.30in (7.62mm) 0.67in (17.02mm) SPECIFICATIONS

trackball ch

Abstract: track ball trackball LP100 ball tracking
Contextual Info: 0.69in 17.53mm 0.69in (17.53mm) Ball Diameter 1.00in (25.40mm) R 0.22in (5.59mm) 1.75in (44.45mm) O 0.12in (3.05mm) 1.75in (44.45mm) 1.30in (33.02mm) 0.91in (23.11mm) 0.28in (7.11mm) 0.13in (3.30mm) 1.08in (27.43mm) 0.30in (7.62mm) 0.67in (17.02mm) 0.37in (9.40mm)

trackball

Abstract: trackball ch LP100 LP1003EXXH00-B
Contextual Info: 0.69in 17.53mm 0.69in (17.53mm) Ball Diameter 1.00in (25.40mm) R 0.22in (5.59mm) 1.75in (44.45mm) O 0.12in (3.05mm) 1.75in (44.45mm) 1.30in (33.02mm) 0.91in (23.11mm) 0.28in (7.11mm) 0.13in (3.30mm) 1.08in (27.43mm) 0.30in (7.62mm) 0.67in (17.02mm) 0.37in (9.40mm)

LCU130582

Contextual Info: 1310nm Laser Diode LCU130582E/F •Features Un-cooled Laser diode with MQW structure Wide operation temperature range Dew point below -40oC Both ball lens and flat window cap available ■External dimensions Unit : mm ■Absolute Maximum Ratings(Tc=25℃)

49R9

Abstract: alumina ball
Contextual Info: Precision Ceramic Ball Grid Arrays CHC-Precision Series • Ratio tolerances to ±0.05% • Absolute tolerances to ±0.1% • RoHS compliant terminations available • Superior TaNFilm resistors on ceramic substrate • Same footprint as the industry standard SOIC-N package

smartphone MOTHERBOARD CIRCUIT diagram

Abstract: AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball
Contextual Info: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code

DM270

Abstract: 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash
Contextual Info: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code

PLL VCO MIL-PRF-38535

Contextual Info: PC7410M16 RISC Microprocessor Multichip Package Datasheet - Preliminary Specification Features • • • • • • PC7410 RISC Microprocessor Dedicated 2 MB SSRAM L2 Cache, Configured as 256Kx72 21 mm x 25 mm, 255 Ceramic Ball Grid Array Maximum Core Frequency = 400 MHz

Contextual Info: VFB1012D Ultra-High-Precision Z-Foil Ball Grid Array BGA Surface-Mount Voltage Divider features • Temperature coefficient of resistance (TCR) – Absolute: ± 0.05 ppm/°C typical (0 °C to + 60 °C) – Tracking: 0.1 ppm/°C typical • Power coefficient of resistance (PCR) tracking (“∆R due to self heating”): 5 ppm at

TMS 320 C 6X processor

Contextual Info: PC755BM8 RISC Microprocessor Multichip Package Datasheet - Preliminary Specification Features • • • • • • PC755BM8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz

BA185

Abstract: Philips BA102 TRUEFFS BA109 HITACHI calypso freescale BA231 BA260 Diskonchip toshiba mcp Micron 512MB NOR FLASH
Contextual Info: DiskOnChip-Based MCP Including DiskOnChip G3, NOR, and PSRAM Data Sheet, August 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code

BGA 64 PACKAGE thermal resistance

Contextual Info: VFB1515N Ultra-High-Precision Z-Foil Ball Grid Array BGA Surface-Mount 3R Resistor Network features • Temperature coefficient of resistance (TCR) – Absolute: ± 0.05 ppm/°C typical (0 °C to + 60 °C) – Tracking: 0.1 ppm/°C typical • Power coefficient of resistance (PCR) tracking (“∆R due to self heating”): 5 ppm at

Contextual Info: VFB2028N Ultra-High-Precision Z-Foil Ball Grid Array BGA Surface-Mount Resistor 4R Network features • Temperature coefficient of resistance (TCR) – Absolute: ± 0.05 ppm/°C typical (0 °C to + 60 °C) – Tracking: 0.1 ppm/°C typical • Power coefficient of resistance (PCR) tracking (“∆R due to self heating”): 5 ppm at

1838-3502

Abstract: 1832.3312 HP 306 1832.3311 1833.3402 5E4 Switch 1835.3118 T-10555 d 1833 hp 250
Contextual Info: SERIES 1830 - SINGLE POLE AND DOUBLE POLE ROCKER SWITCHES UP TO 20 4 A 250 V~ PRODUCT ADVANTAGES ◆ Switching principle with long life endurance due to a low friction contact system (ball), proven a 100 million times over ◆ Attractive rocker switches with

ELPIDA 512MB NOR FLASH

Abstract: nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100
Contextual Info: DiskOnChip-Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, August 2004 • Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code