BALL MILL Search Results

Contextual Info: 4-Ball Wafer Level Chip Scale Package [WLCSP] CB-4-2 Dimensions shown in millimeters A1 BALL CORNER 0.660 0.600 0.540 0.860 0.820 SQ 0.780 SEATING PLANE 0.40 2 1 A 0.280 0.260 0.240 B BALL PITCH TOP VIEW (BALL SIDE DOWN) 0.230 0.200 0.170 BOTTOM VIEW (BALL SIDE UP)

WLCSP

Abstract: CB91 Ball cb 91
Contextual Info: a 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-1 Dimensions shown in millimeters 0.65 0.59 0.53 BALL 1 IDENTIFIER SEATING PLANE 3 2 A 0.35 0.32 0.29 1.750 1.690 1.630 B C 0.50 BSC BALL PITCH TOP VIEW (BALL SIDE DOWN) 0.28 0.24 0.20 1 BOTTOM VIEW (BALL SIDE UP)

WLCSP

Abstract: Ball CB92
Contextual Info: 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-2 Dimensions shown in millimeters A1 BALL CORNER 0.655 0.600 0.545 1.490 1.460 SQ 1.430 SEATING PLANE 3 2 A 0.350 0.320 0.290 B C 0.50 BALL PITCH TOP VIEW (BALL SIDE DOWN) 0.385 0.360 0.335 0.270 0.240 0.210

Contextual Info: 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-1 Dimensions shown in millimeters 1.34 1.14 0.94 0.44 0.36 0.28 0.67 0.57 0.47 0.50 BALL PITCH BALL 1 IDENTIFIER 2 SEATING PLANE 1 0.32 NOM A 2.38 2.18 1.98 B 0.59 TOP VIEW (BALL SIDE DOWN) 0.24 MAX COPLANARITY

trackball

Abstract: trackball ch DT225 track ball usb trackball trackball ch in
Contextual Info: 5.07in 128.78mm 5.51in (139.95mm) SPECIFICATIONS ELECTRICAL USB INPUT: OUTPUT: MECHANICAL 5V @ 25mA max USB1.1 BALL DIAMETER: BALL ROTATION: TRACKING FORCE: WEIGHT LIFE CYCLE (BALL ROTATIONS): RoHS compliant 2.25” Continuous 12g 460g 5 Million 2.38in (60.45mm)

CB301

Contextual Info: 30-Ball Wafer Level Chip Scale Package [WLCSP] CB-30-1 a Dimensions shown in millimeters 0.65 0.59 0.53 2.56 2.50 2.44 SEATING PLANE 5 4 3 2 1 A BALL A1 CORNER B 0.36 0.32 0.28 3.06 3.00 2.94 C D E 0.50 BALL PITCH TOP VIEW (BALL SIDE DOWN) 0.28 0.24 0.20

trackball ch

Abstract: DT225 trackball trackball dt225 DT225 Gray Desktop trackball ch in 460g DT2253X20V00
Contextual Info: 5.07in 128.78mm 5.51in (139.95mm) SPECIFICATIONS ELECTRICAL PS/2 INPUT: OUTPUT: MECHANICAL BALL DIAMETER: BALL ROTATION: TRACKING FORCE: WEIGHT LIFE CYCLE (BALL ROTATIONS): RoHS compliant 5V @ 25mA max CMOS/TTL 2.25” Continuous 12g 460g 5 Million 2.38in

of push to on switch

Contextual Info: Multi Function Switches/EVQWJN Jog Ball Type: EVQWJN • Features ■ Usage Example ● External dimensions : 10.7 mm҂9.3 mm, Height: 6.0 mm, <Ball rotary operation> Ball : 360 ° endless rotation + Push operation : φ5.5 mm : 1 million operations each direction

es61

Abstract: IC 7801 AN48840B JOG SWITCH ball switch
Contextual Info: Multi Function Switches/EVQWJN Jog Ball Type: EVQWJN • Features ■ Usage Example ● External dimensions : 10.7 mm҂9.3 mm, Height: 6.0 mm, <Ball rotary operation> Ball : 360 ° endless rotation + Push operation : φ5.5 mm : 1 million operations each direction

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing V356.27x27C 356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE HPBGA Rev 1, 6/10 0.20 (4X) 27.00 A1 BALL PAD CORNER 24.00 +0.35 -0.05 4X 10.00 5. A1 BALL PAD INDICATOR, 1.0 DIA., OPTIONAL A

112ball

Abstract: 112-ball 080307-A MO-225 DSA0044716
Contextual Info: a 112-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-112-1 Dimensions shown in millimeters A1 BALL CORNER 8.10 8.00 SQ 7.90 11 10 9 8 7 6 5 4 3 2 1 A BALL A1 PAD CORNER B C D E F G 6.50 BSC SQ H J K L 0.65 BSC BOTTOM VIEW TOP VIEW DETAIL A DETAIL A

V356

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Package PBGA V356.27x27B 0.20 (4X) 27.00 24.00 A1 BALL PAD CORNER A 356 BALL PLASTIC BALL GRID ARRAY PACKAGE (PBGA) +0.35 -0.05 B 4X 10.00 NO. OF LAYERS DIM “A” DIM “B” NOTES 4 2.33±0.21

196-BALL

Contextual Info: 196-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-196-2 Dimensions shown in millimeters 15.20 15.00 SQ 14.80 A1 BALL PAD CORNER 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P BALL A1 INDICATOR 13.00 BSC SQ 1.00 BSC TOP VIEW BOTTOM VIEW

Solder Balls

Abstract: V356
Contextual Info: Plastic Packages for Integrated Circuits Heatsink Plastic Ball Grid Array Package HPBGA 27.00 A1 BALL PAD CORNER 0.20 (4X) V356.27x27C A 356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE (HPBGA) 24.00 +0.35 -0.05 4X 10.00 B NO. OF LAYERS DIM “A” DIM “B”

011008-B

Abstract: CB82
Contextual Info: 8-Ball Wafer Level Chip Scale Package [WLCSP] CB-8-2 Dimensions shown in millimeters a 0.650 0.595 0.540 1.460 1.420 SQ 1.380 SEATING PLANE 3 2 1 0.340 0.320 0.300 BALL 1 IDENTIFIER A B 0.50 BALL PITCH 0.380 0.355 0.330 COPLANARITY 0.075 0.270 0.240 0.210

Contextual Info: 196-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-196-3 Dimensions shown in millimeters 15.20 15.00 SQ 14.80 A1 BALL PAD CORNER 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P BALL A1 INDICATOR 13.00 BSC SQ 1.00 BSC TOP VIEW BOTTOM VIEW

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing V356.27x27B 356 BALL PLASTIC BALL GRID ARRAY PACKAGE PBGA Rev 2, 10/10 0.20 (4X) 27.00 A1 BALL PAD CORNER A 24.00 +0.35 -0.05 4X 10.00 5. A1 BALL PAD INDICATOR, 1.0 DIA., OPTIONAL B 20 18 16 14 12 10 8 6 4 2

MO-205

Abstract: TAPE AND REEL BGA 54-BALL
Contextual Info: Revised May 2001 BGA Tape and Reel Specifications Tape and Reel Quantities Package Code GX Package Description Package Drawing Number Tape and Reel Container Quantity 54-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide BGA54A 2500 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

Ball

Abstract: 25-BALL
Contextual Info: 25-Ball Wafer Level Chip Scale Package [WLCSP] CB-25 a Dimensions shown in millimeters 0.650 0.590 0.530 2.825 2.765 2.705 SEATING PLANE 5 4 3 2 1 A BALL 1 IDENTIFIER 2.605 2.545 2.485 0.50 BALL PITCH B 0.360 0.320 0.280 C D E 0.240 0.220 0.200 BOTTOM VIEW

Contextual Info: 5-Ball Wafer Level Chip Scale Package [WLCSP] CB-5-1 Dimensions shown in millimeters 0.94 0.90 0.86 0.37 0.36 0.35 0.50 REF SEATING PLANE 0.87 BALL 1 IDENTIFIER 1.33 1.29 1.25 2 1 A 0.23 0.18 0.14 0.50 0.21 TOP VIEW (BALL SIDE DOWN) 0.17 0.14 0.12 B C 0.50

CB141

Abstract: b 595 transistor CB-14-1
Contextual Info: 14-Ball Wafer Level Chip Scale Package [WLCSP] CB-14-1 Dimensions shown in millimeters a 0.650 0.595 0.540 1.50 1.46 1.42 0.25 BSC 0.25 BSC 3 SEATING PLANE 2 0.25 BSC 0.25 BSC 1 A BALL 1 IDENTIFIER 0.50 BSC B TOP VIEW (BALL SIDE DOWN) 0.340 0.320 0.300 0.380

Contextual Info: a 8-Ball Wafer Level Chip Scale Package [WLCSP] CB-8-1 Dimensions shown in millimeters 0.675 0.595 0.515 1.480 1.430 1.380 BALL 1 IDENTIFIER SEATING PLANE 3 2 1 A 0.340 0.320 0.300 1.825 1.775 1.725 B C 0.50 BALL PITCH 0.380 0.355 0.330 BOTTOM VIEW 0.27

CB253

Contextual Info: 25-Ball Wafer Level Chip Scale Package [WLCSP] CB-25-3 Dimensions shown in millimeters a 0.600 0.555 0.510 2.295 2.245 2.195 SEATING PLANE 5 4 3 2 1 A BALL 1 IDENTIFIER B 0.287 0.267 0.247 0.23 0.20 0.17 C D 0.40 REF TOP VIEW (BALL SIDE DOWN) 1.60 REF E

jedec bottom

Contextual Info: a BALL A1 PAD CORNER 84-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-84-1 Dimensions shown in millimeters A1 CORNER INDEX AREA 6.10 6.00 SQ 5.90 10 9 8 7 6 5 4 3 2 1 A 4.50 BSC SQ 0.50 BSC 0.80 0.75 0.70 TOP VIEW *1.40 1.26 1.11 DETAIL A BOTTOM VIEW