BACC63CC1 Search Results

Contextual Info: CIM1021 Series C48 Family Vibration-Resistant Receptacle Cinch Bayonet Coupling 1 407- CN1021XXXXXXXX BACC63CC1 Dimensions Shell Size 8 10 12 14 16 18 20 22 24 28 A +.0045 (.114) in mm .812 .937 1.031 1.125 1.250 1.343 1.437 1.562 1.703 2.000 B +.005 (.127)

Contextual Info: CN1021 Series C48 Family Vibration-Resistant Receptacle Bayonet Coupling CN1021XXXXXXXX BACC63CC1 1.407* (35.738) Max. 360° LOCKING ACCESSORY TEETH Dimensions Shell Size 8 10 12 14 16 18 20 22 24 28 A +.0045 (.114) in mm .812 20.625 .937 23.800 1.031 26.187

BACC63 Series

Abstract: BACC63 BACC10GH BOEING bacc63 BACC45FT BACC63BP bacc10 BACC10JS BACC45FN BACC45
Contextual Info: CYLINDRICAL C48 Series/MIL-C-26500 Accessories & Application Tooling Boeing: BACC45 / BACC63 Series MIL-C-26500 C48 Series Introduction • Qualified to MIL-C-26500. ■ Styles qualified to Boeing BACC45 Series. FEATURES ■ Styles qualified to Boeing BACC63 Series.

DC-37PTI

Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

DIN 41529

Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

BACC63CB

Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.