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MD27C64-15/B
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Rochester Electronics LLC
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27C64 - 64K (8K x 8) EPROM |
PDF
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68464-156HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 56 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68016-415HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100) Pitch. |
PDF
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87916-415HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail. |
PDF
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86964-155
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Unshrouded Vertical Header, Through Hole, Double Row, 6 Positions, 2.00mm (0.079in) Pitch.. |
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