B579 Search Results

FOR Thermistor NTC

Contextual Info: NTC thermistors for temperature sensing and compensation Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57964S Date: February 2009 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

12.696

Contextual Info: NTC thermistors for temperature sensing and compensation Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57964S Date: February 2012 EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

S-981

Abstract: NTC Thermistors EPCOS
Contextual Info: NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57981S Date: March 2013 EPCOS AG 2013. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

Contextual Info: NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57971S Date: March 2013 EPCOS AG 2013. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

b57971s0103

Abstract: B57971S0303 B57971S0202 S971 thermistor ntc smd B57164K0102J000
Contextual Info: NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57971S Date: February 2009 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

B57164K0102J000

Abstract: S964 B57964S0202 B57881S0103F002 thermistor ntc smd s9642 B57964
Contextual Info: NTC thermistors for temperature sensing and compensation Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57964S Date: July 2009 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

Contextual Info: EPCOS NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57971S Date: January 2012 ŒPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

Contextual Info: EPCOS NTC thermistors for temperature sensing and compensation Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: Date: B57964S February 2012 ŒPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

B57164K0102J000

Abstract: B57964 NTC 1008
Contextual Info: NTC thermistors for temperature sensing and compensation Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57964S Date: March 2013 EPCOS AG 2013. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

67804

Abstract: thermistor s962 B57962S0282F001 9698 B57962S0282H001 B57962S0282J001 thermistor ntc 82 r
Contextual Info: NTC thermistors for temperature measurement Miniature sensors, lead spacing 2.5 mm Series/Type: Date: B57962 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

thermistor ntc smd

Abstract: B57164K0102J000 B57881S0103F251 S-981 EPCOS B25 160 B57981S0103
Contextual Info: NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57981S Date: February 2009 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

Contextual Info: NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57971S Date: January 2012 EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

Contextual Info: EPCOS NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: Date: B57981S February 2009 ŒPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

Contextual Info: P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 15x15 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

AMS-QQ-N-290

Contextual Info: Series 652000 and 653000 PLCC-to-DIP Adapter FEATURES • Converts PLCC packaged ICs to DIP footprints. • Ideal for prototyping and testing/evaluation. • Available with PLCC sockets or PLCC pads on top side. • Consult factory for Panelized Form or for mounting of consigned ICs.

ASTM b16

Abstract: Brass 360 AMS-QQ-N-290 C17200
Contextual Info: Program Your Own Correct-A-Chip GENERAL SPECIFICATIONS • FEMALE SOCKET MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp. • PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick • MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM-B16-00

c36000

Abstract: AMS-QQ-N-290
Contextual Info: 24-Pin SOIC-to-22-Pin 0.400" DIP FEATURES • A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS • BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

PGA479M

Abstract: B57900 JTAG xdp CONNECTOR 20-pin lpc debug header used to program fwh eeprom sata female Connector pcb layout Socket pga479m b5792 161ACPI ATI Rage jumper debug codes
Contextual Info: Dual-Core Intel Xeon® Processor LV and Intel® 3100 Chipset Development Kit User’s Manual January 2007 Order Number: 315879-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

AMS-QQ-N-290

Contextual Info: 5-Pin PLCC Motorola MC68HC11E9-to-56-Pin SDIP Adapter FEATURES • Allows placing an PLCC package on a board laid out for a shrink DIP. GENERAL SPECIFICATIONS • BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides • PADS: HASL • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

95-132I25

Abstract: AMS-QQ-N-290
Contextual Info: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

SAE AMS-QQ-N-290

Abstract: AMS-QQ-N-290 C17200
Contextual Info: P/Ns 1106396 and 1107254 Row-to-Row DIP Adapter Socket FEATURES • Adapter Socket allows the use of 0.300 [7.62] center devices when the PCB is drilled on 0.600 [15.24] centers and vice versa, giving the flexibility of using 0.600 [15.24] or 0.300 [7.62] center devices in the same application.

IC 290 8pin

Abstract: C17200
Contextual Info: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.

LEXAN 121r - 21051

Abstract: lexan 121r 21051 u574 Dell 90w-AC adapter B568 B552 ffc B591 12505hs14 BA42-00141A BA41-00497A
Contextual Info: 10. Electrical Partlist Option SEC Code Location Name Spec. Unit , PC -,-,0to+95C,560mA,-, HYS64T64020HDL,PC , DT,KR,CP3,IEC320 C5,250/250V,7/3A,BLK,1830mm,-,H05VV-F