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L177HDB44SD1CO3F
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 44 Socket, 0.38um (15u\\) Gold, M3 Front Screwlock, Without Boardlock |
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L77HDB44SOL2C309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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L77HDB44SD1CH4RC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Socket, 0.76m (30 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock |
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L77HDB44SD1CH3R
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Socket, Flash Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock |
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L177HDB44SD1CH3R
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 44 Socket, 0.38um (15u\\) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock |
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