AU WIRE Search Results

8656350065LF

Abstract: 8656350067LF GS-14-920 GS-22-008 0513E
Contextual Info: 1 2 3 A Manufacturers's Code 4 PART NUMBER Plating 8656350067LF 8656350067 8656350065LF 86563050065 8656350064LF 8656350064 0.4µ Au / GXT 0.4µ Au / GXT 0.76µ Au / GXT 0.76µ Au / GXT flash Au flash Au 0,25 max NOTES: 1-Material: Phosphor bronze,thickness 0.20

54602

Contextual Info: 1 2 3 4 15.30 0.25 54602 - X08 LF PRODUCT NO. A A LEAD FREE SHALLOW LATCH SERIES PLATING CODE 17.74 0.20 2 6 7 8 9 9F 12.05 +0.20 0.076µ Au Selective 0.76µ Au Selective Au Flash Selective 1.27µ Au Selective 0.38µ Au Selective 0.38µ Au Throughout SCALE

Contextual Info: 1 2 3 4 15.30 0.25 54602 - X08 LF PRODUCT NO. A A LEAD FREE SHALLOW LATCH SERIES PLATING CODE 17.74 0.20 2 6 7 8 9 9F 12.05 +0.20 0.076µ Au Selective 0.76µ Au Selective Au Flash Selective 1.27µ Au Selective 0.38µ Au Selective 0.38µ Au Throughout SCALE

FCN-363J-AU

Contextual Info: CRIMP FEMALE CONTACT AND TOOLING DIMENSIONS Standard For thick wires Plating Lose Piece Strip Form Standard Thick wire gold over palladium FCN-363J-AU FCN-363J-AU/S silver plating FCN-363J-AG FCN-363J-AG/S gold over palladium FCN-363J-AU/R FCN-363J-AU/T silver plating

of 7404

Contextual Info: Ordering number : ENA1780 LC87F83C8A/AU LC87F8396A/AU LC87F8364A/AU CMOS IC FROM 128K byte, RAM 6K byte on-chip 8-bit ETR Microcontroller Overview The LC87F83C8A/AU/96A/AU/64A/AU is an 8-bit ETR microcomputer that, centered around a CPU running at a minimum bus cycle time of 74.04 ns, integrate on a single chip a number of hardware features such as 128K-bytes of

Contextual Info: 1 2 3 4 15.30 0.25 54602 - X08 LF PRODUCT NO. A A LEAD FREE SHALLOW LATCH SERIES PLATING CODE 17.74 0.20 2 0.076µ Au Selective 6 0.76µ Au Selective 7 Au Flash Selective 8 1.27µ Au Selective 9 0.38µ Au Selective 12.05 +0.20 SCALE 2:1 PCB LAYOUT CAVITY NO.

V42254-B2535-D325

Abstract: D325 V42254-B2435-D325 V42254-B2402-D325 V42254-B2502-D315 V42254-B2563-D325 V42254B2450D325 001901 31X12541 SR-1000
Contextual Info: 8 11 10 12 Version 95 - 0.1 D Connect or 85 -0.2 - 0.1 C o + 2,8 min. Performance level O C 1a s s CI a s s CI a s s >o 1 2 3 + + + PdNi PdNi PdNi Au Au Au or or or 4 5 3 Au Au Au "O £ 5 2.9 ±0.3 01 4.5 ±0.3 02 c "O contact LO °o no CD CNJ 90 o "O 8 35

Contextual Info: FCN-364P*-AD PLUG, VERTICAL MOUNT, SOLDER DIP MOUNTING HOLE LAYOUT o +i PART NUMBERS Number of Contacts 8 16 24 32 40 48 56 64 Note: Dimensions mm Part numbers FCN-364P008-AU FCN-364P008-AG FCN-364P016-AU FCN-364P016-AG FCN-364P024-AU FCN-364P024-AG FCN-364P032-AU

P008A

Abstract: FCN-361 FCN-360 p048a I0006
Contextual Info: FCN-360 FCN-361 P*-AD PLUG, SOLDER EYELET RECOMMENDED PANEL LAYOUT PART NUMBERS Number of Contacts 8 16 24 32 40 48 56 64 Note: Dimensions mm Part numbers FCN-361 P008-AU FCN-361 P008-AG FCN-361 P016-AU FCN-361 P016-AG FCN-361 P024-AU FCN-361 P024-AG FCN-361 P032-AU

Contextual Info: FIRADEC 5 CONDENSATEURS AU TANTALE TANTALUM CAPACITORS GENERALITES GENERAL INFORMATION FIRADEC 6 CONDENSATEURS AU TANTALE TANTALUM CAPACITORS GENERALITES GENERAL INFORMATION FABRICATION MANUFACTURE Anode et isolant Anode and insulator Le condensateur au tantale est le condensateur dont le rapport

CFP64

Contextual Info: FPC Connector EC-05 Series 0.5mm Spacing Easy Flip Lock Type ● CFP64 - 3 Finish Mechanical locking system of FPC 0 : With 5 : Without 52F 51G 70G Contact Soldering Au Au Sn-Pb Au Sn-Pb Sn-Pb FPC / FFC Connectors No. of Pins • Features 1. The wire-fixation lever is of our own easy flip lock

t2d 64

Abstract: lu1414 fdn 156 MB631XXX LU18 mb633
Contextual Info: January 1990 Edition 1.1 FUJITSU PRODUCT PROFILE AU Series CMOS Gate Arrays DESCRIPTION The AU series of 1.2 Jim CMOS gate arrays, available in eight device types with from 10K to 100K gates, achieves the ultra fast speed of 0.6 ns per gate. Thanks to the channel-free structure of the AU gate array, AU basic cells can be used for logic cells,

Contextual Info: PART NO. 20007-001 20007-002 20007-001-H0 20007-002-HQ FINISH Sn Au OVER NI Sn Au OVER Ni hs1.0 0. 4 sH— K i 7/ \4 0. 15 5»- c NOTES. 1. MATERIAL PHOSPHOR BRONZE FINISH P/N 20007-001:Sn P/N 20007-002:Au OVER Ni CONTACT AREA 2. APPLICABLE WIRE SIZE-AWG#26, 28, 30

Contextual Info: FCN-7047705770777447745*-au/* FCN-747*-au/* FCN-744P*-AU/R STRAIGHT BOX PLUG WITH SIMPLE LOCK DIMENSIONS Mini-header straight type «- A -» L. R wl _ n 6.25 (0.246) - 2.54 _ j (0.100) — tp- -a—a—□- - - — B—D- -a—^

Contextual Info: FCN-704*/705770777447745*“-au/* FCN-747*-au/* FCN-744*/-745*-AU/0 BOX PLUG WITHOUT LOCK Main body form depends on the number of contacts 10-contacts G type 10-contacts Q type 50-,60-contacts 14-contacts , . 22.86 0.9 , V J, Li V 9 - -

XMega-AU-Manual

Abstract: XMEGA AU Manual atmel part marking MEGA AVR 8331F XMEGA Application Notes Atmel mega flash MARKING CODE
Contextual Info: 8-bit Atmel XMEGA AU Microcontroller XMEGA AU MANUAL This document contains complete and detailed description of all modules included in the Atmel AVR®XMEGA®AU microcontroller family. The Atmel AVR XMEGA AU is a family of low-power, high-performance, and peripheral-rich CMOS 8/16-bit

Contextual Info: FCN-360 FCN-364J*-AD SOCKET, VERTICAL MOUNT, SOLDER DIP MOUNTING HOLE LAYOUT PART NUMBERS Dimensions mm Number of Contacts 8 16 24 32 40 48 56 64 Note: Part numbers FCN-364J008-AU FCN-364J008-AG FCN-364J016-AU FCN-364J016-AG FCN-364J024-AU FCN-364J024-AG

Contextual Info: 8-bit Atmel XMEGA AU Microcontroller XMEGA AU MANUAL This document contains complete and detailed description of all modules included in the Atmel AVR®XMEGA®AU microcontroller family. The Atmel AVR XMEGA AU is a family of lowpower, high-performance, and peripheral-rich CMOS 8/16-bit microcontrollers based on the

Atmel AVR XMEGA A Manual

Abstract: CHN 449 i2c bootloader XMEGA Application Notes 294D 8331C awex 3635S
Contextual Info: 8-bit Atmel XMEGA AU Microcontroller XMEGA AU MANUAL This document contains complete and detailed description of all modules included in the Atmel AVR®XMEGA®AU microcontroller family. The Atmel AVR XMEGA AU is a family of lowpower, high-performance, and peripheral-rich CMOS 8/16-bit microcontrollers based on the

Integrated Circuit

Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES hssop show the structure of integrated circuit EPOXY RESIN resin
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE STRUCTURE 3. PACKAGE STRUCTURE The following diagrams show the structure of typical IC packages. STRUCTURE OF METAL SEALED DIP LID Au or Ni PLATING CHIP AI WIRE SEALING MATERIAL (Au/Sn or Pb/Sn) CERAMIC BODY

Contextual Info: Inner conductor Innenleiter B Dielectric Isolierung Outer conductor Außenleiter Jacket Außenmantel D C Verpackungseinheit: 100 m, als Ring gebunden. D Material Material bare copper acc. 13602, single core 19 wires Cu-Litze blank gemäß 13602, 19 Einzeldrähte

Contextual Info: Inner conductor Innenleiter B Dielectric Isolierung Outer conductor Außenleiter Jacket Außenmantel D C Germany Verpackungseinheit: 100 m, als Ring gebunden. D Material Material bare copper acc. 13602, single core 19 wires Cu-Litze blank gemäß 13602, 19 Einzeldrähte

A3232

Abstract: bga 7x7 CSP2 BGA thermal resistance 6x8 bga 6x8 Package BGA 48 PACKAGE thermal resistance
Contextual Info: FBGA Chip Scale BGA Encapsulant Au Wire Die Mold Resin Die Au Wire Polyimide Tape Substrate Solder Laminate Substrate Solder Ball Die Attach Super CSP Si Al SON BCC™ Leadless Redistribution Line Cu Leadframe Metal post (Cu/Barrier) Polyimide Layer SiN

CT79E

Contextual Info: FIRADEC 95 CONDENSATEURS AU TANTALE TANTALUM CAPACITORS CONDENSATEURS TANTALE A ELECTROLYTE GELIFIE WET TANTALUM CAPACITORS FIRADEC 96 CONDENSATEURS AU TANTALE TANTALUM CAPACITORS Condensateurs tantale à électrolyte non solide CARACTERISTIQUES GENERALES