ASTM D150 Search Results

ASTM d1238

Abstract: astm D150 ASTM d792 ASTM D495 D1238 transistor D648 D1525 ASTM d1238 TEST METHOD ASTM D570
Contextual Info: PRODUCT INFORMATION Mineral Reinforced Grade KOCETAL TC704 Kocetal TC704 is Mineral reinforced grade for good dimensional stability. Property Test Method Units Value ASTM D1238 ASTM D792 ASTM D570 g/10min % 17~21 1.55 0.2 ASTM D1525 ASTM D648 ℃ 166 4.6kg/cm2 0.45MPa

Contextual Info: Liqui-Bond SA 2000 Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits TEST METHOD Visual 200,000 200,000 ASTM D2196 2.4 2.4 ASTM D792 6 6 — ASTM D2240 Shelf Life @ 10°C months PROPERTY AS CURED - PHYSICAL Hardness (Shore A)

Contextual Info: Liqui-Bond SA 1800 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits 125,000 125,000 ASTM D2196 2.8 2.8 ASTM D792 6 6 — PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 80 80 ASTM D2240 -76 to 392 -60 to 200 —

electronegativity

Contextual Info: TECHNICAL INFORMATION: TEFLON FLUOROCARBON RESIN Table 1 Typical Properties* of Teflon® Fluorocarbon Resins ASTM Standard Mechanical Properties: Specific Gravity Tensile Strength Elongation Flexural Modulus Folding Endurance Impact Strength Hardness Coefficient of Friction

ASTM d882

Abstract: ASTM A 527 m astm D150 J D882 602-50 ASTM d792 d1922 LEXAN 175 polycarbonate film D882 D882 SPECIFICATION
Contextual Info: GE Advanced Materials Specialty Film & Sheet LEXAN* FR25A Film Product Datasheet Description LEXAN FR25A flam e-retardant film Is an opaque, th ln -gau ge polycarbonate film with a velvet finish on one side and a polish finish on the other, and a UL94 V-0 listing to meet the stringent requirem ents In a wide range of electrical, electronic and transportation applications. LEXAN FR25A

AN2100

Abstract: D256
Contextual Info: Engineering Properties Ryton R-4 Covers Polyphenylene Sulfide Resins Ryton® R-4 PPS is a 40% fiberglass reinforced polyphenylene sulfide compound that provides outstanding chemical resistance and mechanical properties even at elevated temperatures. Nominal Engineering Properties

Contextual Info: GT20 High Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

Contextual Info: Bergquist Thermal Clad Technical Data HT-04503 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.05°Cin2/W (0.32°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

Contextual Info: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible

Contextual Info: GT30 High Thermal Conductivity Glassfiber Reinforcement Features Natural tack Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs

Contextual Info: GT15 Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Electrically isolating Complies with UL standards

bergquist

Abstract: bergquist silpad
Contextual Info: Sil-Pad Tubes Silicone-Based,Thermally Conductive Tubes Features and Benefits TYPICAL PROPERTIES OF SIL-PAD TUBE 400 PROPERTY Color • Thermal conductivity: SPT 400 – 0.9 W/m-K SPT 1000 – 1.2 W/m-K • For clip-mounted plastic power packages IMPERIAL VALUE

comparative tracking index ceramic

Contextual Info: Bergquist Thermal Clad Technical Data HT-07006 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.11°Cin2/W (0.71°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

TRANSISTOR REPLACEMENT GUIDE d882

Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Contextual Info: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,

Contextual Info: GATT Series S i U l FEATURES Chamfered entry prevents pin stubbing High reliability tuning fork contact IR, vapor and wave solder compatible Selective plating options available Mates with PEG, MPEG, DPEG, LPEG, TPEG Series headers INSULATOR BODY Single Row

Contextual Info: PGM Series F E A T U R E S • ■ . . Excellent for high density applications Low profile minimizes "height off board" IR, vapor phase and wave solder compatible Stabilizing fins hold part level on board Mates with Crane's ATM sockets; JNM jumpers DUAL ROW 4 to 60 positions

ASTM D2240, D412

Abstract: ASTM D2240 ASTM D412 MIL-A-46146 loctite 5145 D412 ASTM D412 for rubber D2240 MIL-46106 E1225
Contextual Info: Technical Data Sheet Product 5145 Worldwide Version, October 1995 PRODUCT DESCRIPTION LOCTITE Product 5145 is a non-corrosive, paste consistency, high strength, RTV silicone. When cured the elastomer resists weathering, moisture and ozone, and retains its flexibility up to 200°C. Meets requirements of

Contextual Info: rîïï i T V M ¡ â e h l i n FEATURES For use w ith Small O utline JED EC SO J) packages Socket profile allow s ultra low packaging High tem perature m aterial resists distortion Leads are tin plated after stam ping fo r high reliability Open fram e a llo w s solder join t inspection

Contextual Info: 'I M Ü ilJ i u i U l i s ï Straight FEATURES . • • ■ ■ Excellent for high density applications Minimizes PC Board stacking height IR, vapor phase and wave solder compatible Chamfered entry prevents pin stubbing Mates with Crane's PGM, IPGM, MPGM Series headers

1285b

Abstract: MIL-STD-11898
Contextual Info: FEATURES . • • * ■ SiNGLt ROW 1 to 32 positions Excellent for high density applications Minimizes PC Board stacking height IR, vapor phase and wave solder compatible Insulator standoffs reduce rework due to flux residue Mates with Crane's PGM, DPGM, LPGM, MPGM Series headers

astm D150

Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM
Contextual Info: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™

square pin headers

Abstract: 1285b
Contextual Info: MPEG Series r PU § » H ri/*’ IL ij Right Angle, Dual Insulator FEATURES • ■ • • . Dual insulator design adds mechanical stability MATE-RITE TIP prevents scraping of mating socket Insulator standoffs reduce rework due to flux residue Rounded tails improve solder action

MIL-STD-109

Abstract: MIL-STD-11898 UL746B MIL-STD-45662A D995 MIL-STD-1285B
Contextual Info: £ u ¡ÏMGS a ri XU Straight, Dual Insulator' 1 FEATURES SINGLE ROW (3 to 60 positions MPFH • Excellent for low profile board stacking • Smaller centers allow higher density packaging ■ IR, ■ Custom applications available. call us! • Mates with Crane's