D2196 Search Results

Contextual Info: Liqui-Bond SA 2000 Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits TEST METHOD Visual 200,000 200,000 ASTM D2196 2.4 2.4 ASTM D792 6 6 — ASTM D2240 Shelf Life @ 10°C months PROPERTY AS CURED - PHYSICAL Hardness (Shore A)

Contextual Info: Liqui-Bond SA 1800 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits 125,000 125,000 ASTM D2196 2.8 2.8 ASTM D792 6 6 — PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 80 80 ASTM D2240 -76 to 392 -60 to 200 —

LINDNER fuses

Abstract: 500765 lindner IEC 60947-3 ac-22b switch disconnector fuse 250A 690V nh00gg50v125 NT NH LINDNER fuses P218766 1b769 C2237
Contextual Info: 38103-FER NH-fuses A4-engl 22.10.2003 15:50 Uhr Seite 3 NH-Fuse system Low voltage 38103-FER NH-fuses A4-engl 22.10.2003 14:01 Uhr Seite 2 NH-fuses Utilization Categories The utilization category is marked by two letters. The first letter indicates the breaking-capacity range, and the

bergquist

Abstract: D2196
Contextual Info: Gap Filler 2000 Two-Part Thermally Conductive, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 2000 PROPERTY Color / Part A • Thermal conductivity: 2.0 W/m-K • Ultra-conforming, designed for fragile and low-stress applications

Contextual Info: Gap Filler 1100SF Two-Part Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction

gf3500s35

Abstract: GF-3500 D2196 3500S35 GF35 D149 D150 D2240 D257 D792
Contextual Info: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 • Thermal conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

Contextual Info: Gap Filler 1000 Two-Part Thermally Conductive,Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 1000 PROPERTY Color / Part A • Thermal conductivity: 1.0 W/m-K • Ultra-conforming,designed for fragile and low-stress applications

Contextual Info: Liqui-Bond SA 1000 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits • High thermal performance • Eliminates need for mechanical fasteners • Low viscosity for ease of screening or stenciling • Can achieve a very thin bond line

bergquist

Contextual Info: Gap Filler 1000 Two-Part Thermally Conductive, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1000 PROPERTY Color / Part A • Thermal conductivity: 1.0 W/m-K • Ultra-conforming, designed for fragile and low-stress applications

Contextual Info: TG4040-2K Thermally Conductive Liquid Gap Filling Material Description TG4040-2K is a thermally conductive, liquid gap filling material. The product is supplied as two components which can be cured at room temperature or at an elevated temperature to give excellent thermal and mechanical performance.

Contextual Info: Gap Filler 1500 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 1500 • Thermal conductivity:1.8 W/mK PROPERTY Color / Part A IMPERIAL VALUE Yellow • Optimized shear thinning characteristics for

Contextual Info: Gap Filler 2000 Two-Part Thermally Conductive,Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 2000 PROPERTY Color / Part A • Thermal conductivity: 2.0 W/m-K • Ultra-conforming,designed for fragile and low-stress applications

CR200

Contextual Info: TflexTM CR200 Series Gap Filler Material Preliminary TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part, silicone-based thermal gap filler that has low viscosity prior to curing. Tflex™ CR200 is ideal for applications where large gap tolerances are present.

Contextual Info: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage

NH0GG50V63-1

Abstract: 1F651 NH000GG50V50
Contextual Info: General Purpose IEC Fuses General Purpose IEC Fuses NH Fuses Plain Blades gG 400V, 500V, 690V gG 500V Size 000 to 3 - Isolated Lug NH-fuses, 500VAC gG with isolated metal gripping lugs (SGL), double indicator, contact blades, complying with DIN VDE 0636 Part 201

NH1GG50V200

Abstract: NH1GG50V250 nh00gg50v125 NH3GG50V500-1 NH2GG50V315 NH00GG50V160 NH000GG50V63-1 NH3GG50V630 NH000GG50V100-1 NH000GG50V63
Contextual Info: General Purpose IEC Fuses General Purpose IEC Fuses NH Fuses Plain Blades gG 400V, 500V, 690V aM 500V, 690V NH Fuse System DIN 57 636/VDE 0636 Parts 1, 10, 21, 22, 201 IEC 60269-2 DIN 43 620 Parts 1 to 4 (Standard dimensions) The use category is identified by two letters, the first indicating the

NH000GG50V63-1

Abstract: NH1GG50V200 NH3GG50V630 NH000GG50V100-1 IEC 60269-2 NH000GG50V100 V215528 NH000GG50V40 NH000GG50V25 NH000GG50V50
Contextual Info: General Purpose IEC Fuses General Purpose IEC Fuses NH Fuses Plain Blades gG 400V, 500V, 690V aM 500V, 690V NH Fuse System DIN 57 636/VDE 0636 Parts 1, 10, 21, 22, 201 IEC 60269-2 DIN 43 620 Parts 1 to 4 (Standard dimensions) The use category is identified by two letters, the first indicating the

bergquist

Contextual Info: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage