ASTM D149 Search Results

Contextual Info: Liqui-Bond SA 2000 Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits TEST METHOD Visual 200,000 200,000 ASTM D2196 2.4 2.4 ASTM D792 6 6 — ASTM D2240 Shelf Life @ 10°C months PROPERTY AS CURED - PHYSICAL Hardness (Shore A)

Contextual Info: Liqui-Bond SA 1800 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits 125,000 125,000 ASTM D2196 2.8 2.8 ASTM D792 6 6 — PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 80 80 ASTM D2240 -76 to 392 -60 to 200 —

Contextual Info: A Dimensions: [mm] D Properties: Properties Reference Permeability DC Resistance Value Unit 20 - 23 5 x 106 Ω-cm Insulation resistance 0.01 x 1012 Ω Specific gravity 3.0 - 3.2 g/cm3 1.8 - 2.2 kV 40 - 50 % Dielectric strength ASTM D257 ASTM D149 Elongation

Contextual Info: A Dimensions: [mm] D Properties: Properties Reference Permeability DC Resistance Value Unit 20 - 23 5 x 106 Ω-cm Insulation resistance 0.01 x 1012 Ω Specific gravity 3.0 - 3.2 g/cm3 1.8 - 2.2 kV 40 - 50 % Dielectric strength ASTM D257 ASTM D149 Elongation

Contextual Info: A Dimensions: [mm] D Properties: Properties Reference Permeability DC Resistance Value Unit 20 - 23 5 x 106 Ω-cm Insulation resistance 0.01 x 1012 Ω Specific gravity 3.0 - 3.2 g/cm3 1.8 - 2.2 kV 40 - 50 % Dielectric strength ASTM D257 ASTM D149 Elongation

Contextual Info: A Dimensions: [mm] D Properties: Properties Reference Permeability DC Resistance Value Unit 20 - 23 5 x 106 Ω-cm Insulation resistance 0.01 x 1012 Ω Specific gravity 3.0 - 3.2 g/cm3 1.8 - 2.2 kV 40 - 50 % Dielectric strength ASTM D257 ASTM D149 Elongation

TSC209-ZP

Abstract: transistor TSC506-NY WARTH TSC405 TSC607-ZP TSC607-NY TSC506-ZP WARTH thermal kool pads transistor TO220
Contextual Info: THERMAL Warth Thermal Transistor Gull Wing Clips TSC Material Voltage Isolation Plating / finish Thread size on Gull wings Property Steel / delta tone coat From 750V Nylon / Zinc delta tone M4 Test Method ASTM D149 mod Description Transistor gull wing clips:

Contextual Info: Bond-Ply 660P Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape Features and Benefits Configurations Available: Polyimide Film Polyimide Film — Thickness inch / (mm) 0.008 0.203 ASTM D374 Glass Transition (°F) / (°C) TEST METHOD

Contextual Info: DC0037/01/PC99AL-0.10-0.1 Die Cut PCM Rectifier Bridge Features Low thermal resistance Natural tack Applications Rectifier Bridge REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss

Contextual Info: DC0041/01/PC99AL-0.10-0.1 Die Cut PCM Resistor Pad Features Low thermal resistance Natural tack Applications Resistor Pad REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss

Contextual Info: DC0036/01/PC99AL-0.10-0.1 Die Cut PCM Rectifier Bridge Features Low thermal resistance Natural tack Applications Rectifier Bridge REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss

Contextual Info: DC0038/01/PC99AL-0.10-0.1 Die Cut PCM Relay Pad Features Low thermal resistance Natural tack Applications Relay Pad REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss

AN2100

Abstract: D256
Contextual Info: Engineering Properties Ryton R-4 Covers Polyphenylene Sulfide Resins Ryton® R-4 PPS is a 40% fiberglass reinforced polyphenylene sulfide compound that provides outstanding chemical resistance and mechanical properties even at elevated temperatures. Nominal Engineering Properties

D1667

Abstract: FAR 25853 G21-70 NA 36 foam d1056 d 1667 D-3574 D3574 astm d 1056 D-1056
Contextual Info: 3 Single-Coated Foam Tapes 4100 • 4300 • 4500 • 4700 Series Technical Data May, 2008 Product Description 3M Single-Coated Foam Tapes will adhere to a variety of substrates, including latex-painted wood, lacquered wood, enameled steel, glass, aluminum, stainless steel,

Contextual Info: GT20 High Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs

ASTM d792

Abstract: ASTM D570 ASTM D2240, D412 ASTM A 105 D792 D412 ASTM D412 D-792 D149 D257
Contextual Info: RHW Heat-Shrinkable, Heavy Wall, Polyolefin Tubing Table 1: Dimensions Minimum Expanded I.D. D Size 9/3 13/4 20/6 33/8 43/12 51/16 70/21 85/25 105/30 130/36 160/50 180/50 In. .354 .512 .787 1.299 1.693 2008 2.756 3.346 4.134 5.118 6.299 7.087 Maximum Recovered

4116

Abstract: D1667 G21-70 25853 FAR 25853 NA 36 foam E76581 astm D149 D1056
Contextual Info: 3 Single-Coated Foam Tapes 4100 • 4300 • 4500 • 4700 Series Technical Data May, 2008 Product Description 3M Single-Coated Foam Tapes will adhere to a variety of substrates, including latex-painted wood, lacquered wood, enameled steel, glass, aluminum, stainless steel,

Contextual Info: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

MIL-PRF-23699

Abstract: SAE-AMS-1424 MIL-PRF-2104 MIL-PRF-46167 MIL-DTL-83133 ASTM D-412 A MIL-PRF-372 SAE-AMS1424 transistor D1876 s1255
Contextual Info: Tyco Electronics Corporation 300 Constitution Drive Menlo Park, CA 94025 USA Raychem Specification This Issue: Date: Replaces: RT-780_Type-II Issue 4 November 10, 2009 Issue 3 Raychem RT-780 Type II, Molded Components Nuclear, Biological, Chemical Contamination Survivable

Contextual Info: Bergquist Thermal Clad Technical Data HT-04503 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.05°Cin2/W (0.32°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

Contextual Info: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible

Contextual Info: Li-2000 Thermal Tape on rolls Features Good adhesion Low contact thermal impedance High thermal conductivity High bond strength High temp-long term stability Electrically insulating Applications Electronic components: IC / CPU / MOS / LED / M/B / P/S / Heat Sink

comparative tracking index ceramic

Contextual Info: Bergquist Thermal Clad Technical Data HT-07006 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.11°Cin2/W (0.71°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

UL796

Contextual Info: Bergquist Thermal Clad Technical Data HPL-03015 HIGH POWER LIGHTING DIELECTRIC Superior Dielectric Lowers Operating Temperatures Benefits • Very low thermal resistance of 0.02°Cin2/W (0.13°Ccm2/W) • High thermal conductivity of 3.0 W/m-K • High temperature applications