ASMCC0096 Search Results

K1 transistor

Contextual Info: ASMCC0096 APPLICATION SPECIFIC MULTI CHIP CIRCUIT ASMCCTM NEW PRODUCT Features • · · Epitaxial Planar Die Construction Ideally Suited for Automated Assembly Processes Lead Free Product SOT-363 A B C Mechanical Data · · · · · · · · Case: SOT-363, Molded Plastic

Contextual Info: ASMCC0096 APPLICATION SPECIFIC MULTI CHIP CIRCUIT NEW PRODUCT Features • · Epitaxial Planar Die Construction Ideally Suited for Automated Assembly Processes SOT-363 A Mechanical Data · · · · · · · · B C Case: SOT-363, Molded Plastic Case material - UL Flammability Rating

marking K1 sot363

Abstract: ASMCC0096 ASMCC0096-13 ASMCC0096-7 J-STD-020A MMBT3904 marking B1 sot363 a96 sot TRANSISTOR K 135 J 50 K1 transistor
Contextual Info: ASMCC0096 APPLICATION SPECIFIC MULTI CHIP CIRCUIT ASMCCTM Features • · · Epitaxial Planar Die Construction Ideally Suited for Automated Assembly Processes Lead Free Product SOT-363 A B C Mechanical Data · · · · · · · · Case: SOT-363, Molded Plastic

ASMCC0096

Abstract: ASMCC0096-7 J-STD-020A MMBT3904 a96 sot ASMCC K1 transistor
Contextual Info: ASMCC0096 APPLICATION SPECIFIC MULTI CHIP CIRCUIT ASMCCTM NEW PRODUCT Features • · Epitaxial Planar Die Construction Ideally Suited for Automated Assembly Processes SOT-363 A Mechanical Data · · · · · · · · B C Case: SOT-363, Molded Plastic Case material - UL Flammability Rating

BAV99-13-01-F

Abstract: ASMCC0110-7 MMBT3904R-01DK-7-F MMBT2222A-7-04-F MMBT3904-7-05-F BAW56-13-01-F MMBT3904R-01DK-7 BAS16-13-01-F 1N4148WT-7-F 1N4148W-7-F
Contextual Info: PRODUCT CHANGE NOTICE DCS/PCN-1065 Rev 5 Contact Date: Implementation Date: Alert Category: Alert Type: PCN #: June 29, 2007 September 27, 2007 Discrete Semiconductor Alternate Die Sources PCN-1065_Rev 5 TITLE Alternate Discrete Die Sources REVISION CHANGE

MMBZ5321

Abstract: DVRN6056
Contextual Info: PRODUCT CHANGE NOTICE Contact Date: May 17, 2004 Implementation Date: July 17, 2004 Alert Category: Discrete Semiconductor Alert Type: Facility Expansion DCS/PCN-1037 PCN #: PCN #: 2004-1037 TITLE NOTICE OF FACILITY EXPANSION IMPACT None DESCRIPTION OF CHANGE

sot363

Abstract: SOT-363 662 BSS84DW-13-F AZ23C20W sot-363 651 sot-363 702 MMBZ5237BTS bzx84c5v1t sot-523 mmdt2227
Contextual Info: PRODUCT CHANGE NOTICE Contact Date: June 29, 2007 Implementation Date: October 1, 2007 Alert Category: Discrete Semiconductor DCS/PCN-1078 Rev 1 Alert Type: PCN #: Encapsulate Change PCN #: 1078, Rev 1 TITLE Conversion of SOT-363, SOT-523, SOT-563, SC59 and SC70 Packages to Green Encapsulate molding compound