ASD723 Search Results

CYStech Electronics

Abstract: date sheet for MA part I 2012 ASD723SN marking code 4
Contextual Info: CYStech Electronics Corp. Spec. No. : C343SN Issued Date : 2003.08.19 Revised Date :2003.12.05 Page No. : 1/4 Advanced Schottky Barrier Diodes ASD723SN Features: ● Designed for mounting on small surface ● Low stored charge ● Majority carrier conduction

ASD723

Contextual Info: Formosa MS Advanced Schottky Barrier Diodes ASD723 Surface mount small signal type Extermely thin package 0.087 2.2 0.071 (1.8) Low stored charge 0.012(0.3) Typ. Majority carrier conduction R0.3 (0.012) Typ. 0.055 (1.4) 0.039 (1.0) 0.043 (1.1) 0.028 (0.7)

ASD723-N

Contextual Info: Formosa MS Advanced Schottky Barrier Diodes ASD723-N Surface mount small signal type Extermely thin package 0.106 2.7 0.090 (2.3) Low stored charge 0.012(0.3) Typ. Majority carrier conduction R0.5 (0.02) Typ. 0.053 (1.35) 0.045 (1.15) 0.035 (0.9) 0.028 (0.7)

ASD723

Contextual Info: Formosa MS Advanced Schottky Barrier Diodes ASD723 Surface mount small signal type Extermely thin package 0.087 2.2 0.071 (1.8) Low stored charge 0.012(0.3) Typ. Majority carrier conduction R0.3 (0.012) Typ. 0.055 (1.4) 0.039 (1.0) 0.043 (1.1) 0.028 (0.7)

SOD-323 land pattern

Abstract: ASD723
Contextual Info: ASD723 FRONTIER ELECTRONICS CO., LTD. 300mA Advanced Sckottky Barrier Diode Surface mount small signal type FEATURES ! EXTREMELY LOW VF ! EXTREMELY THIN PACKAGE ! LOW STORED CHARGE ! MAJORITY CARRIER CONDUCTION 2.0±0.2 CATHODE MARK R:0.3 MECHANICAL DATA

ASD723-N

Contextual Info: Formosa MS Advanced Schottky Barrier Diodes ASD723-N Surface mount small signal type Features Extermely low VF 0.106 2.7 0.090 (2.3) 0.012(0.3) Typ. Extermely thin package R0.5 (0.02) Typ. 0.053 (1.35) 0.045 (1.15) Low stored charge Majority carrier conduction

Contextual Info: FormosaMS Advanced Schottky Barrier Diodes ASD series Surface mount small signal type Features Plastic package has Underwriters Laboratory Flamm ability Class ification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.087 2.2 0.071 (1.8) 0.012(0.3) Typ.