AS-002 AO Search Results

Contextual Info: DATA SHEET PHOTOREFLECTIVE SENSOR LEADFRAME PACKAGE HVS6003-002 FEATURES: VCSEL and phototransistor in industry standard leadframe packaging Optical plastics block visible wavelength for better ambient light rejection The HVS6003-002 is designed as a higher performance alternative to LED

Contextual Info: d DATA SHEET PHOTOREFLECTIVE SENSOR LEADFRAME PACKAGE HVS6003-002 FEATURES: „ VCSEL and phototransistor in industry standard leadframe packaging „ IEC 80625 Class 1 Laser Product The HVS6003-002 is designed as a higher performance alternative to LED based reflective

if6 sensor

Abstract: HVS6003-002 phototransistor spice model
Contextual Info: d DATA SHEET PHOTOREFLECTIVE SENSOR LEADFRAME PACKAGE HVS6003-002 FEATURES: „ VCSEL and phototransistor in industry standard leadframe packaging „ IEC 80625 Class 1 Laser Product The HVS6003-002 is designed as a higher performance alternative to LED based reflective

if6 sensor

Abstract: VCSEL phototransistor HVS6003-002 vcsel spice model 80625 phototransistor spice model VCSEL Reflective Optical Sensor "IR Sensor" with DIP laser based communication
Contextual Info: d DATA SHEET PHOTOREFLECTIVE SENSOR LEADFRAME PACKAGE HVS6003-002 FEATURES: „ VCSEL and phototransistor in industry standard leadframe packaging „ IEC 80625 Class 1 Laser Product The HVS6003-002 is designed as a higher performance alternative to LED based reflective

Contextual Info: £> NO 14-001 002 003 004 005 -006 -007 14-008 DIM. “A " DIM. 'B ‘ 4.060/J60 4350/.191 4.060/J60 4 S 5 0 /J9 I 3380/133 4.450/ J 75 3.380/J33 4.450/J75 SAME A S -001 SAME AS -002 SAME A S -003 SAME AS -004 I DIM. "C* \5.460/215 Ì5A60/.2I5 Ì4750/J87 '4750/187

Contextual Info: d DATA SHEET PHOTOREFLECTIVE SENSOR LEADFRAME PACKAGE HVS6003-002 FEATURES: „ VCSEL and phototransistor in industry standard leadframe packaging „ IEC 80625 Class 1 Laser Product The HVS6003-002 is designed as a higher performance alternative to LED based reflective sensors. This Vertical Cavity

Contextual Info: Intel SM35 Express Chipset Datasheet January 2012 Revision 002 Document Number: 325308-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

Contextual Info: 10 N0TE6 2Tic:501930-* APPLICABLE TERMINAL : 501930-^ 2. & & m - m a te 20ckt. 501931- :*» 5 0 2 0 3 6 -* WITH : 501931- *, 5020A6-* A \ APPLY FOR CKT. SIZE. / 2 = EVEN. 2. 77' ' T - V3 v { ± W .t [ =i 7 7 TIXtMW ] AS-503110-001. AS-503110-002

Contextual Info: ^ 7 2 4 0 TOSHIBA 002Ö3T7 TIT TC51Y18165BFT-70 PRELIMINARY 1,048,576 WORD X 16 BIT EDO DYNAMIC RAM Description The TC51V18165BFT is the Hyper Page Mode (EDO) dynamic RAM organized 1,048,576 w ords by 16 bits. The TC51V18165BFT utilizes Toshiba’s CMOS silicon gate process technology as well as advanced circuit techniques to provide

Contextual Info: Encore! 32TM Series Microcontroller Z32AN High Performance ARM9 SoC Data Sheet DS0200-002 Copyright 2008 by Zilog, Inc. All Rights Reserved www.zilog.com WARNING: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

Contextual Info: • ^0^7 246 002Ô431 *îOÔ ■ - TC51V18325BJ/BFT-60/70 PRELIMINARY 524,288 WORD X 32 BIT EDO DYNAMIC RAM 16M DRAM Description TheTC51V18325BJ/BFT is the Hyper Page Mode (EDO) dynamic RAM organized 524,288 w ords by 32 bits. The TC51V18325BJ/BFT utilizes Toshiba’s CMOS silicon gate process technology as well as advanced circuit techniques to

Contextual Info: M ITEL ISO-CMOS ST-BUS FAM ILY MT8952B HDLC Protocol Controller 9161-002-070-NA Features • ISSUE 4 September 1988 Ordering Information Formats data as per X.25 CCITT level-2 standards Go-Ahead sequence generation and detection Single byte address recognition

2Z802-009

Abstract: C46655-001 82801FB 82801FB ICH6 Intel ICH6 ich6 82801FB intel MOTHERBOARD pcb design in ICH6 ich6 sata Intel 82801fr
Contextual Info: R Intel I/O Controller Hub 6 ICH6 Family Thermal Design Guide For the Intel® 82801FB ICH6 and 82801FR ICH6R I/O Controller Hubs January 2005 Document Number: 302362-002 R THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES,

T45 12H

Abstract: 30064* intel audio power sb 18751 sb 18751
Contextual Info: Intel 6300ESB I/O Controller Hub Datasheet June 2004 Order Number 300641-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

g41 motherboard repair

Abstract: TOM - 2088 - BH AF 82801 IBM TOM 2088 BH gm45 intel intel chipset g33 motherboard repair 2088 rgb matrix 320123 laptop lcd cable 30 pin diagram intel g31 motherboard repair
Contextual Info: Mobile Intel 4 Series Express Chipset Family Datasheet August 2008 Document Number: 320122-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

intel 945 ich7 family motherboard

Abstract: ICH7M intel 945 945 MOTHERBOARD intel 945 gmch intel LPC interface spec 1.0 intel 945 reference intel chipset 945 mobile Thermal Design Guide INTEL fcBGA PACKAGE thermal resistance
Contextual Info: Mobile Intel 945GME Express Chipset Graphics and Memory Controller Hub GMCH for Embedded Applications Thermal Design Guide June 2007 308623-002 Mobile Intel® 945GME Express Chipset GMCH Thermal Design Guide ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS

X5460

Abstract: E5430 E5450 E5410 X5450 E5405 intel X5450 E5440 QX6000 X5482
Contextual Info: Quad-Core Intel Xeon® Processor 5400 Series Specification Update December 2007 Order Number : 318585-002 Notice: The Quad-Core Intel® Xeon® Processor 5400 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are

intel h67 motherboard schematic diagram

Contextual Info: Intel 6 Series Chipset Datasheet February 2011 Document Number: 324645-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS

CG82NM10

Abstract: e210882 motherboard manual CG82NM10 slgxx chipset cg82nm10 E76523-403 slgxx e210882 motherboard manual jumper set E76523-401 e210882 N232 motherboard manual circuit diagram of motherboard intel nm10
Contextual Info: Intel Desktop Board D510MO Technical Product Specification October 2011 Order Number: E74523-002 The Intel® Desktop Board D510MO may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D510MO Specification Update.

DRAM Refresh Control with the 80186 80188

Abstract: intel 80186 external memory intel DMA controller Unit for 80186 interfacing 80186 to RAM 80186 80188 internal control block 80188 programming 80188 programming peripheral Pal programming AB-35
Contextual Info: AB-35 APPLICATION BRIEF DRAM Refresh Control with the 80186 80188 STEVE FARRER APPLICATIONS ENGINEER August 1990 Order Number 270524-002 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in

transistor BC188 npn

Abstract: pin configuration NPN transistor BC147 msi motherboard pentium III diagram bc227 TRANSISTOR BC147 PC MOTHERBOARD intel 815 circuit diagram BC188 pnp transistor TRANSISTOR junctions of bc188 BC170 TRANSISTOR BC227
Contextual Info: R Intel 815E Chipset Platform For Use with Universal Socket 370 Design Guide September 2002 Document Number: 298350-002 R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

thermal design guide -intel

Abstract: 82801CA E7500 E7501 E7505 P64H2 intel package drawings intel celeron 633 flotherm MODEL intel 61 chipset
Contextual Info: Intel E7500 and Intel® E7501 Chipsets MCH Thermal Design Guide for Embedded Applications March 2003 Order Number: 273819-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

275 A 23 200 E

Abstract: MS312002-20PC Z105
Contextual Info: MOSEL MS312002 262,144 X 8 CMOS Mask Programmable ROM 32 Pin DIP FEATURES DESCRIPTION • Access time: 200ns The M S 3 1 2 002 high performance R ead Only Memory is organ­ ized as 2 62 ,14 4 bytes by 8 bits. It is designed to be compatible with all microprocessors and similar applications where high

MIP 0255

Abstract: 290617 440LX 82371SB BT869 CCIR601 MIP 411 3D Accelerator intel pentium mmx 1997 press INTEL 740
Contextual Info: Intel740 Graphics Accelerator Software Developer’s Manual May 1998 Order Number: 290617-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability