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TLP3403SRHA
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Toshiba Electronic Devices & Storage Corporation
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Photorelay (MOSFET output, 1-form-a), 20 V/1.5 A, 500 Vrms, S-VSON4T |
Datasheet
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68023-403HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54mm Pitch, Right Angle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail. |
PDF
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68033-403HLF
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail. |
PDF
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68653-403HLF
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail. |
PDF
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54101-G34-03
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch. |
PDF
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