APP980 Search Results

Contextual Info: \ _ A_ |_ B_ |_C_ |_ D_ |_ E_ I_ E_ / NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP.,

Contextual Info: B D C E C±0-05 C ircu it 0.5±o.i iiin i C ircu it No.2 C ircu it No.1 Term inal NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP., U L 9 4 V -0 ; COLOR:BU\CK. 1.2 CONTACT: COPPER ALLOY 2. FINISH: 2.1 CONTACT:50~1 OOu” NICKEL UNDERPLATING OVERALL.

Contextual Info: c B D E NOTES: 1. 2. MATERIAL: HOUSING:HIGH TEMP THERMO PLASTIC TERMINAL:COPPER ALLOY PLATING: TERMINAL: Au PLATING P /N LEGEND 8 8 1 4 6 — XX X X No Of CKT- OVER ALL A — WT Plating . 1: Gold Plating over all./Rs - Packing 0 Tape " 1 Tube Tape Tube 8c Reel

Contextual Info: C D E NOTES: C±0.05 1. MATERIAL: HOUSING:HIGH TEMP THERMO PLASTIC TERMINAL:COPPER ALLOY FITTING NAIL:COPPER ALLOY 2. PLATING: TERMINAL: 5 0 u ” NICKEL OVERALL, N: M att Tin. 1: Gold Flash Over all FITTING NAIL: 5 0 u ” NICKEL OVERALL, N: M att Tin. 1: Gold Flash Over all

Contextual Info: B C D 1 E NOTES: 1. MATERIAL 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP., U L9 4 V -0 ; CO LOR: NATURAL. 1.2 LATCH: P P S ;COLOR:BUCK. 1.3 CONTACT: COPPER ALLOY 1.4 FITTING NAILCOPPER ALLOY 2. FINISH: 2.1 CONTACT: L:50u” MIN. NICKEL UNDERPLATING OVERALL 120u” MIN. PURE TIN PLATING OVER ALL

Contextual Info: A B _L _L c D C±0.05 NOTES: 1. MATERIAL: HOUSING:NYLON UL94V-0 TERMINAL:PHOSPHOR BRONZE FITTING NAIL:PHOSPHOR BRONZE 2. PLAHNG: 0O .7 Q iO .O 2 5 0 .8 * 0 .0 5 A P L S .S E E ACES PLATING CODE P/N LEGEND 3. COPLANARITY 0.1 MM MAX. BASE ON DATUM A 4. TRUE POSITION 0.1 MM MAX. BAES ON DATUM B

Contextual Info: C B D E n±o.o5 A±0.05 -H I I 00.8*0.05 - - 1I 1.2*0.i_ i _2±o.i | RECOMMEND PCB LAYOUT •■A WITH OUT BOSS H a s 'V i ■^F- □□c A — : — r □ b □ P ffl ffl — □□c : □ WITH BOSS NOTES: 1.MATERIAL: H0USIN6:HIGH TEMP THERMOPLASTIC,UL94V-0.

Contextual Info: B fm ^ - 0 .2 0 B 2 .5 4 _L NOTES: 1. MATERIAL: 1.1 HOUSING: Halogen Free PLASTIC, HIGH TEMP U L94V-0; COLOR:BLACK. 1.2 CONTACT: COPPER ALLOY 2. FINISH: 1. 5 0 u” MIN. NICKEL UNDERPLATING OVERALL. GOLD FLASH OVERALL. A N: 5 0u”MIN NICKEL, 10Ou” MIN MATT TIN LEAD FREE .

Contextual Info: B C _L 0 .5 N —1 ±o.05 A ± 0 .0 5 PCB PATTERN LAYOUT RECOMMENDED APPLICABLE FPC LAYOUT (THICKNESS:0.3±0.03) _L E D A NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC. HIGH TEMP. U L94V-0; COLOR:NATURAL. 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAILCOPPER ALLOY

Contextual Info: H f D C B _ E_ |_ F_ NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP., U L 9 4 V -0 ; 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL: COPPER ALLOY 1 .4 LATCH: THERMOPLASTIC, HIGH TEMP., U L 9 4 V -0 ; 2. FINISH:

Contextual Info: B D NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC. HIGH TEMP., 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL:COPPER ALLOY 2. FINISH: 2.1 CONTACT: UNDERPLATING: 50u” MIN. NICKEL OVERALL. FINISH:SEE ORDER INFORMATION. 2.2 FITTING NAIL: UNDERPLATING: 50u” MIN. NICKEL OVERALL.

Motorola AN980

Abstract: Application Note AN980 motorola AN980 max6952 APP980 MAX6953 AN980 motorola
Contextual Info: Maxim > App Notes > DISPLAY DRIVERS Keywords: LED display drivers, LED drivers, display drivers, SPI, I2C, serial, blink, 3V Feb 25, 2002 APPLICATION NOTE 980 Experimenting with the MAX6952 and MAX6953 SPI and I²C LED Display Drivers from a PC Abstract: This application note describes a PC program, downloadable free, to assist design, evaluation, font