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    AN315

    Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
    Contextual Info: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are


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    an315an315rev1an315 audio poweran315 audio+7an315 audio amplifierqfn package thermal resistancethermal viaqfn 9x9qfn package junction to pcb thermal resistancecs4525signal path designer PDF