LTM46XX
Abstract: bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance
Contextual Info: Application Note 114 August 2007 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds
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an114fan114-8ltm46xxbga dye pry+5ltm4600lga voidingan114lga reworklga package thermal resistance
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TAIYO PSR 4000
Abstract: TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600
Contextual Info: Application Note 114 August 2007 Revised March 2009 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds
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an114faan114-8taiyo psr 4000taiyo psr 4000 datasheet+8bga dye prypsr-4000taiyo psr 2000taiyo psr-4000 auslga voidingltm46xxland pattern bga 0,50ltm4600
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