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    AMPHENOL SIM BLOCK Search Results

    AMPHENOL SIM BLOCK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SF-SFPP2EPASS-001
    		Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-001 1m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (3.3 ft) PDF
    SF-SFPP2EPASS-000.5
    		Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-000.5 0.5m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (1.6 ft) PDF
    SF-SFPP2EPASS-003
    		Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-003 3m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (9.8 ft) PDF
    SF-SFPP2EPASS-007
    		Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-007 7m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (23 ft) PDF
    SF-SFPP2EPASS-005
    		Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-005 5m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (16.4 ft) PDF

    AMPHENOL SIM BLOCK Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CAD-0601-302

    Abstract: CAD0601302 amphenol sim block
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		UL94V0, CAD0601302 CAD-0601-302 amphenol sim block PDF

    amphenol sim block

    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		UL94V0, CAD0601402 amphenol sim block PDF

    CAD-0601-262

    Abstract: amphenol sim block
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		UL94V0, CAD0601262 CAD-0601-262 amphenol sim block PDF

    amphenol sim block

    Abstract: SIM BLOCK
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		UL94V0, CAD0601382 amphenol sim block SIM BLOCK PDF

    amphenol sim block

    Abstract: SIM BLOCK
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		UL94V0, CAD0601342 amphenol sim block SIM BLOCK PDF

    amphenol sim block

    Abstract: sim block
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		UL94V0, CAD0601322 amphenol sim block sim block PDF

    SIM BLOCK amphenol

    Abstract: amphenol sim block SIM BLOCK
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		UL94V0, CAD0601362 SIM BLOCK amphenol amphenol sim block SIM BLOCK PDF

    amphenol sim block

    Abstract: SIM BLOCK
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		UL94V0, CAD0601282 amphenol sim block SIM BLOCK PDF

    sim block

    Abstract: amphenol sim block
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		UL94V0, CAD0601222 sim block amphenol sim block PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-132 PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-172 PDF

    CAD-0605-202

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-202 PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-112 PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-182 PDF

    SIM READER amphenol

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-162 SIM READER amphenol PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-192 PDF

    CAD-0605-122

    Abstract: CAD0605122
    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-122 CAD0605122 PDF

    CAD-0605-212

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-212 PDF

    SIM READER amphenol

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-152 SIM READER amphenol PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		UL94V-0, 30Vac CAD-0605-142 PDF

    Optical SAS QSFP

    Abstract: Amphenol QSFP L77SDB25S1ACH4F U65B044010T MD5ML50S10 Amphenol 191-2801-110 Amphenol d 40 - e16a VCSEL array HDMI G38A71214AEU amphenol airbag
    Contextual Info: Amphenol Amphenol Preferred Parts Catalogue Amphenol Corporation Amphenol was founded in 1932. Today the company is one of the largest manufacturers of interconnect products in the world serving towards 8 major markets: Aerospace/Military, Automotive, Broadband


    Original     		M22520/2-01 Optical SAS QSFP Amphenol QSFP L77SDB25S1ACH4F U65B044010T MD5ML50S10 Amphenol 191-2801-110 Amphenol d 40 - e16a VCSEL array HDMI G38A71214AEU amphenol airbag PDF

    12-037

    Abstract: Amphenol PCB terminal blocks IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
    Contextual Info: Amphenol High Performance Line Replaceable Module LRM Interconnects 12-037 For High Speed, Reliable Data Transfer Amphenol solves board mount connector requirements by offering their LRM Line Replaceable Module Interconnects with the widest design flexibility - combinations of module


    Original     		PDF

    simcom sim 300 gsm modem

    Abstract: SIMCOM sim 300 GSM MODEM AT commands simcom 300 simcom 300 gsm modem SIM600 simcom 900 simcom 900 gsm modem SMS transmitting using RF module SIM 900 TE C gsm module sim holder C707
    Contextual Info: SIM600 HARDWARE SPECIFICATION SIMCOM Ltd. SIM600 Hardware Interface Description Confidential Document Name: SIM600 Hardware Interface Description Version: Date: Doc Id: Status: 01.03 2006-01-15 SIM600_HD_V4.04 Compose SIMCOM General Notes Simcom offers this information as a service to its customers, to support application and


    Original     		SIM600 SIM600 simcom sim 300 gsm modem SIMCOM sim 300 GSM MODEM AT commands simcom 300 simcom 300 gsm modem simcom 900 simcom 900 gsm modem SMS transmitting using RF module SIM 900 TE C gsm module sim holder C707 PDF

    ASN-E0052

    Abstract: NASA SSQ21635 nasa ssq 21635 ssq21635 nbc 3101 he804 nas 1748 EN4165 vg96912 Zero-G Amphenol
    Contextual Info: TABLE OF CONTENTS Amphenol Aerospace and Amphenol Industrial Operations Facilities/ Brief Product Overviews . 1-7 Amphenol /Pyle®/Matrix® Quick Product Guides . 8, 9


    Original     		MIL-DTL-38999 MIL-C-27599 ASN-E0052 NASA SSQ21635 nasa ssq 21635 ssq21635 nbc 3101 he804 nas 1748 EN4165 vg96912 Zero-G Amphenol PDF