AMB1608 Search Results

AMB1608C2450Z10

Contextual Info: MD-MDE009-0501 Multi-layer chip balun Features Low loss High balance characteristic Specification Parts Number BW Z（Ω） IL VSWR Phase Balance Amp. balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 0.7 1.5 180±10 1.0 AMB1608C2450Z10

Contextual Info: MD-MDE009-0711 Multilayer Chip Balun: AMB1608 Series Device Features „ „ „ Applications Miniature Size and Low Profile 1.6mm x 0.8mm x 0.6mm Low Insertion Loss (0.6dB typ. /C2450series) RoHS Compliant Wireless LAN, Bluetooth module WiMAX „ „ Shape & Dimensions

AMB1608C2450

Abstract: AMB1608C
Contextual Info: MD-MDE009-0307 Multi-layer chip balun Features Low loss High balance characteristic Specification Amp. BW Z Ω IL VSWR Phase Balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 1.0 1.5 180±10 1.0 AMB1608C2450Z10 2400 - 2500 100

AMB1608C2450

Contextual Info: MD-MDE009-0307 MULTILAYER CHIP BALUN AMB1608 Typ Features • Low loss • High balance characteristic Specification BW Z（Ω） Parts Number IL VSWR Phase Balance Amp. balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 1.0 1.5

Contextual Info: MD-MDE009-0501 Multi-layer chip balun Features Low loss High balance characteristic Specification Parts Number BW Z（Ω） IL VSWR Phase Balance Amp. balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 0.7 1.5 180±10 1.0 AMB1608C2450Z10

AMB1608C3600Z10A

Abstract: AMB1608C2450Z05 AMB1608C3600Z05 AMB1608C2450
Contextual Info: MD-MDJ009-0912 積層チップバラン AMB1608 シリーズ [特長] „ „ „ [用途] 小型低背化 1.6mm x 0.8mm x 0.6mm 低損失化 (0.6dB typ. /C2450series) RoHS 指令対応 „ „ „ 無線 LAN, Bluetooth モジュール WiMAX,WiBro モジュール

Contextual Info: MD-MDE009-0912 Multilayer Chip Balun: AMB1608 Series Device Features „ „ „ Applications Miniature Size and Low Profile 1.6mm x 0.8mm x 0.6mm Low Insertion Loss (0.6dB typ. /C2450series) RoHS Compliant Wireless LAN, Bluetooth module WiMAX , WiBro „ „

SB0061

Abstract: AP239 sick wl 33-01 F11YT1 DIODE E BUG C552 intel dg41 diode BUG C332 04D2R 1R32Z intel dg41 vw
Contextual Info: Twinhead Model : F11YT1 R:0 Intel Yonah ULV+Calistoga 945GM+ICH7-M Revision History A ORIGINAL RELEASE B 2006/01/12 Rev :B release. C 2006/03/17 Rev:C release. 2006/03/31 Rev :0 release. PCB STACK UP LAY1 LAY2 LAY3 LAY4 LAY5 LAY6 LAY7 LAY8 TOP GND IN1 VCC

TC227

Abstract: IR sensor LFN 2N700Z S14800 U53D LS 2027 audio amp a-b osai em 231 rtd aa2c SOT23-5 LM2729
Contextual Info: Model: R15B R:0 Intel Banias+855PM+ICH4 PCB STACK UP LAY1 TOP LAY2 GND LAY3 IN1 LAY4 IN2 LAYS GND1 LAY6 VCC LAY7 IN3 LAY8 IN4 LAY9 GND2 LAY10 BOTTOM Revision History A Page Page Page Page Page Page Page Page Page Page Page ORIGINAL RELEASE 1 2 3 4 5 6 7 8

AMB1608

Contextual Info: MD-MDE008-0307 MULTILAYER CHIP BALUN AMB2012 Typ Features • Low loss • High balance characteristic Specification Center Frequency(fo) 2450.0MHz Frequency Range f0 ± 50MHz Insertion Loss 1.0Db max. (f0 ± 50MHz) Unbalance Lmpedance 50Ω Balance impedance

FS DMO 365 RN

Abstract: mxj A1 connector LS 2027 audio amp MA81C WDA42 lx4 d09 st3pc 13T4 0601N D1661
Contextual Info: Model : F17P R:1 Intel Pentium 4 LGA775 +PT880+VIA8235 C E PCB STACK UP LAY1 LAY 2 LAY 3 LAY 4 LAY 5 LAY 6 LAY 7 LAY 8 LAY 9 LAY10 TOP GND INI IN2 GND1 VCC IN3 IN4 GND2 BOTTOM Revision History A O R IG IN A L RE LEA SE fe . cCL V?, o . ^ •Pff' j L

VT6103l

Abstract: VT8372 PM163003 SMT1-05-A D212A vt8235 SOT23 mark B24 E2 m30 SOT23-5 athlon 64 x2 M38857
Contextual Info: 5 4 3 PG01 PG02 PG03 PG04 PG05 PG06 PG07 PG08 PG09 PG10 PG11 PG12 PG13 PG14 PG15 PG16 PG17 PG18 PG19 PG20 PG21 PG22 PG23 PG24 PG25 PG26 PG27 PG28 PG29 Model : P22 D Mobile AMD Athlon XP + KN266 VT8372+VT8235 PCB STACK UP C LAY1 LAY2 LAY3 LAY4 LAY5 LAY6 LAY7