ALTERA TQFP 44 PACKAGE Search Results

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

BC 1098

Abstract: EPM7384 ALTERA 68 PLCC t187
Contextual Info: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

TQFP 144 PACKAGE DIMENSION

Abstract: EPM7128A DIMENSIONS pqfp 100 TQFP Package 44 lead 100 PIN PQFP ALTERA DIMENSION altera TQFP 32 PACKAGE 100 PIN tQFP ALTERA DIMENSION
Contextual Info: Saving Board Space with MAX 7000S & MAX 7000A TQFP Packages February 1998, ver. 2 Board Space Savings Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX® 7000S

transistors BC 458

Abstract: BC 458 CQFP 208 datasheet EPM7032-44 EPM5192 44JPLCC TQFP-208 0245 192PGA EPM5128 280PGA
Contextual Info: アルテラ・デバイス パッケージ・インフォメーション Altera Device Package Information Data Sheet 1998年 1 月 ver.7 イントロダク ション Data Sheet このデータシートにはアルテラのすべてのデバイス・パッケージに関する

100 PIN tQFP ALTERA DIMENSION

Abstract: TQFP 144 PACKAGE DIMENSION 100 PIN PQFP ALTERA DIMENSION TQFP 100 PACKAGE TQFP 144 PACKAGE PQFP chip size TQFP 144 PACKAGE altera altera EPM7032S altera TQFP 32 PACKAGE EPM7128S
Contextual Info: Saving Board Space with MAX 7000S & MAX 7000A TQFP Packages February 1998, ver. 2 Board Space Savings Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX® 7000S

Altera EPM7032SLC44

Abstract: EPM7192SQC1607 EPM7192EQI160-20 EPM7128SQC100-10F EPM7128ELC84-12 EPM7128EQC100-7 EPM7064SLI84-7 EPM7064SLC84-10 EPM7192SQC160-10 EPM7032STI44-7
Contextual Info: Devices Altera Homepage SRAM PLDs Mercury APEX 20K FLEX 10K ACEX 1K FLEX 6000 Altera Quicklinks Here are the results of your search. Click on the device name to view the data sheet. Device EPM7032 Package Pins Speed Grade Temp PLCC 44 6 ns C EPM7032LC44-6

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

4572 IC 8PIN

Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Contextual Info: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

Contextual Info: Devices Altera Homepage SRAM PLDs Mercury APEX 20K FLEX 10K ACEX 1K FLEX 6000 Altera Quicklinks Here are the results of your search. Click on the device name to view the data sheet. Device Package Pins Speed Grade Temp Ordering Code Note 1 EPM7032B PLCC

PCN0414

Abstract: EME-G700 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera’s Thin Quad Flat Pack TQFP packages. All

Yamaichi IC51-0804-808

Abstract: BGA and QFP Altera Package mounting QILE84P-410T IC51-2084-1052-11 Enplas fpq LCS-68 force fit standoffs BGA and QFP Package mounting IC51-0804-808 AUGAT SOCKET
Contextual Info: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board

LCS-68

Abstract: IC51-2084-1052-11 FPQ-240-0 821575-1 IC51-1004-809 44 pin TQFP Test Clip plcc socket 84 PLCC 3m bga169
Contextual Info: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

TQFP 100 PACKAGE footprint

Abstract: 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC
Contextual Info: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions FineLine BGA • vertical migration • space efficiency • cost-effectiveness

ipc-sm-786A

Abstract: EPX780 altera TQFP 32 PACKAGE EPF10K20 EPF10K30 EPF10K40 EPF8636 TQFP 144 PACKAGE altera RQFP
Contextual Info: CUSTOMER ADVISORY RQFP & TQFP MOISTURE RECLASSIFICATION In ADV 9505, Altera announced that it had established dry packing requirements for the RQFP package, as well as for other QFP and PLCC packages. Dry packing enhances the shipping process by placing devices in vacuum-sealed moisture-barrier bags with

UBGA49

Abstract: EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
Contextual Info: CPLD Package & I/O Matrix December 15, 2002. This document is revised quarterly. Visit the Altera web site at www.altera.com for the latest version. 36 68 100-Pin TQFP 36 84 84 100 120 120 36 84 100 120 68 68 84 100 212 256-Pin BGA 68 100-Pin FBGA 1.0 mm

EPM7064SLC44-6F

Abstract: EPM7192SQC1607 EPM7192EQI160-20 EPM7128SQC100-10F EPM7128EQC100-20 EPM7128ELC84-12 EPM7128EQC100-12 EPM7128EQC100-7 EPM7128EQC100-15 EPM7064SLI84-7
Contextual Info: Devices Altera Homepage SRAM PLDs Mercury APEX 20K FLEX 10K ACEX 1K FLEX 6000 Altera Quicklinks Here are the results of your search. Click on the device name to view the data sheet. Device EPM7032 Package Pins Speed Grade Temp PLCC 44 -15 C Ordering Code Note 1

ic51-1604-845-4

Abstract: socket Yamaichi ic51 IC51 - 1052 - 13 LCS-68 fpq-240
Contextual Info: Selecting Sockets for Altera Devices A pplication Note 80 June 1996, ver. 1 Introduction Altera offers a number of surface-mount packages. Surface-mount assem bly places unique dem ands on the developm ent and manufacturing process by requiring different CA D sym bols for printed circuit board