ALTERA PART MARKING
Abstract: ADV0217 altera Date Code Formats ALTERA BGA packages PART MARKING altera date code format altera marking
Contextual Info: CUSTOMER ADVISORY ADV0217 FULL LASER MARKING INTRODUCTION Change Description: Beginning January 2003, Altera will introduce a full topside laser mark on all Altera plastic body packages. Currently, the Altera device logo, part number, and date code are ink marked, while the Altera lot number and traceability code
|
Original
|
adv0217altera part markingaltera date code formatsaltera bga packages part marking+2altera date code formataltera marking
|
PDF
|
ADV0607
Abstract: XZ-070 altera Date Code Formats Date Code Formats altera date code format ALTERA PART MARKING EP2C35 EP2C50 date code marking altera top marking
Contextual Info: Revision 0: Initial Release CUSTOMER ADVISORY ADV0607 UFBGA 484 Package Coplanarity Enhancement Change Description Altera will enhance the coplanarity of its Ultra FineLine BGA UFBGA 484 packages as part of the company’s continuous product-quality improvement process. This enhancement
|
Original
|
adv0607ratin2c35ep2c50xz0701t+10jesd46-b21-nov-06xz-070altera date code formatsdate code formatsaltera date code formataltera part markingep2c35date code markingaltera top marking
|
PDF
|
CY7C342B
Abstract: EME-6300H
Contextual Info: Qualification Report August 1996, QTP# 95514, Version 1.1 CY7C342B 128-Macrocell MAX EPLD MAX is a register trademark of Altera Coporation. PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:
|
Original
|
cy7c342b128-macrocell68-lead7c342b+3cy7c342b-hccy7c342b-jceme-6300h
|
PDF
|
ADV0012
Abstract: ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark
Contextual Info: CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Altera will begin marking a one-line internal traceability code on all BGA packages beginning January 2001. The Altera lot number, country of origin, and new internal marking code will be laser marked, or ink marked, on the top of all BGA packages for
|
Original
|
adv0012altera part markingaltera top markingaltera date code format+6bga package top markaltera markinglot code" alteraaltera bga packages part markingaltera lot code formattopmark
|
PDF
|
ADV0201
Abstract: ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark
Contextual Info: CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE TOP MARK ENHANCEMENT Change Description: Altera will begin marking the assembly lot number and a one-line internal traceability code on all non-BGA packages beginning March 2002. Reason For Change: The assembly lot number and new internal traceability marking code will be laser or ink
|
Original
|
adv0201altera part markingaltera top markinglot code" altera+6altera lot code formataltera date code formataltera "date code formattrace codealtera markingaltera pdip top mark
|
PDF
|
ADV0217
Abstract: ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING
Contextual Info: Revision: 1.1.0 CUSTOMER ADVISORY ADV0217 UPDATE FULL LASER MARKING INTRODUCTION Change Description This is an update to ADV0217. See the revision history table for information specific to this update. In January 2003, Altera introduced a full topside laser mark on all Altera plastic body packages.
|
Original
|
adv0217jesd46-c20x20altera part marking+7jesd46caltera date code formataltera bga packages part markingmarking ryaltera markingaltera date code formatsfull laser marking
|
PDF
|
ADV9707
Abstract: altera Date Code Formats lot Code Formats altera ALTERA PART MARKING Date Code Formats Date Code Formats Altera altera top marking altera "date code format" Identification Traceability ALTERA die identifier
Contextual Info: CUSTOMER ADVISORY TOP MARK TRACEABILITY ENHANCEMENTS As Altera adds additional sources of supply and in order for customers to maintain product traceability via device top mark, Altera will enhance its top marking scheme. In order to facilitate die identification, Altera will expand its current six character top mark date code and
|
Original
|
adv9707altera date code formatslot code formats alteraaltera part marking+6date code formatsdate code formats alteraaltera top markingaltera "date code formatidentification traceabilityaltera die identifier
|
PDF
|
ADV9401
Abstract: RQFP ALTERA PART MARKING EPF81188ARC240-3 on 240 EPF81188RI240-3 marked EPF81188ARC240-2 EPF81188ARC240-4 altera MARKING
Contextual Info: December 14, 1994 Dear Customer: Effective January 1, 1995, Altera will institute a new marking procedure on 240- and 304-pin Power Quad 2 packages. These changes are only aesthetic in nature and do not affect the functionality of the devices. Figure 1 illustrates the new mark that will appear on 240-pin RQFP and 304-pin RQFP
|
Original
|
304-pin240-pin208-pinadv9401+11epf81188rc240-3epf81188rc240-2epf81188ri240-3rqfpaltera part markingepf81188arc240-3on 240markedepf81188arc240-2epf81188arc240-4altera marking
|
PDF
|
daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
|
Original
|
an-071-5hand-0444daewon traydaewon t0809050+8daewon tray 1f1-1717-axxstrapack s-669daewon tray 48daewon jedec traydaewon fbgaks-880851f1-1717-axxtray bga
|
PDF
|
MIL-I-8835A
Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Contextual Info: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from
|
Original
|
mil-i-8835acamtex traysnd07071camtex trays qfp+6nd r304e20-02080-00itw camtexceramic qfp package 100 leadexposed qfp 144camtex
|
PDF
|
strapack s-669
Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,
|
Original
|
strapack s-669sivaron s 669strapack d-52strapack+6mil-i-8835acamtexcamtex trayspqfp 176 j-leads-669 strapping machinepeak tray bga
|
PDF
|
PCN0904
Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this
|
Original
|
pcn090465-nm60-nmeu-rep3c16u484i7n+12ep3c10e144c7ep3c10e144c7nep3c10e144c8ep3c16q240c8nep3c10e144c8nep3c16f484c6ep3c40f484c8nep3c40f780i7nep3c16ep3c25f324c8nep3c25e144i7nep3c120f484i7n
|
PDF
|
PLCC 84 PINS
Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
|
Original
|
plcc 84 pinscamtex traysmil-i-8835a |
PDF
|
camtex trays
Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
|
Original
|
camtex traysmil-i-8835atqfp shipping traysexposed qfp 144+6qfp shipping traysnd07071mil-b-81705cdrypacked devicesnd-1414-1camtex
|
PDF
|
|
|
PCN1205
Abstract: EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3
Contextual Info: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION P C N1 2 0 5 ADDITIONAL ASSEMBLY SOURCE ASE AND TRANSITION TO CENTER PIN GATE MOLD FOR FBGA PACKAGES Change Description This is an update to PCN1205; please see the revision history table for information specific to this
|
Original
|
pcn1205reco0hf35i4ep4sgx230hf35i4nep4sgxhf35i3+10ep4sgxkh40i3ep4sgxkh40i3nep4sh40c2nep4sgf45i3ep4sgx290nf45c2ep3c120f780i7nep4ce30f29i8lnep4cgx50cf23c8ep2sgx125gf1508c4ep3c16f484c8n
|
PDF
|
ADV0812
Abstract: ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F
Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0812 ADDITIONAL PACKAGE OPTION FOR SELECTED STRATIX III FPGA DEVICES Description Altera will be introducing the Fine-Line BGA F1152 non-OPD on package decoupling 8-layer substrate design as an additional package option. The Stratix® III FBGA F1152 package is
|
Original
|
adv0812f115210-layerxz0825t+10jesd46-caltera part markingep3se110f1152c4naltera top markingdevice marking code tableep3sl110f1152c4nep3se260f1152c4naltera date code formatxz-082ep3se110f
|
PDF
|
ADV0907
Abstract: ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N
Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0907 ADDITIONAL ASSEMBLY PLANT FOR MBGA PACKAGES Change Description Altera will be introducing Amkor, Philippines as an additional assembly source for Altera Micro FineLine BGA MBGA packages. This change does not affect the form, fit, or function of the
|
Original
|
adv0907altera part markingep3c16m164c7nepm240zm68i8n+6epm570zm100i8nep3c16m164i7naltera epm570 date code formatsep3c16m164c8nepm1270 fpgaep3c10m164i7n
|
PDF
|
PCN0802
Abstract: ALTERA PART MARKING EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 EP3C5 tsmc
Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0802 ADDITIONAL TSMC WAFER FABRICATION SITE FOR CYCLONE III FPGAs Change Description Altera will begin manufacturing and shipping Cyclone III FPGAs out of Taiwan Semiconductor Manufacturing Company TSMC wafer FAB 14, located in Tainan, Taiwan.
|
Original
|
pcn0802jesd46-caltera part markingep3c10+7ep3c120ep3c16ep3c25ep3c40ep3c55ep3c5tsmc
|
PDF
|
PCN0901
Abstract: ALTERA PART MARKING EP1C12F256C8EC EP1C6F256C8N EP1C12F256C8N altera top marking DEVICE MARKING CODE table EP1C12F324I7N EP1C12F256C8 EP1C12F324C8N
Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0901 SUBSTRATE CHANGE FOR SELECTED FBGA PACKAGES Change Description This is an update to PCN0901; please see the revision history table for information specific to this update. Altera is implementing a substrate change on selected product lines assembled in the Fine-Line
|
Original
|
pcn0901altera part markingep1c12f256c8ecep1c6f256c8n+6ep1c12f256c8naltera top markingdevice marking code tableep1c12f324i7nep1c12f256c8ep1c12f324c8n
|
PDF
|
epcs1n
Abstract: EPCS16SI8N EPCS64SI16N EPCS4SI8N EPCS16SI8N marking EPCS1SI8 epcs4si8naa EPCS128SI16N SOIC16 EPCS64SI16N equivalent
Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN1003 ALTERNATIVE ASSEMBLY SITE FOR THE EPC EPCS SERIAL CONFIGURATION DEVICE FAMILY Change Description This is an update to PCN1003, PCN1003 please see revision history table for information specific to this update.
|
Original
|
pcn1003epcs16si8nepcs64si16nepcs128si16n+7epcs1nepcs4si8nepcs16si8n markingepcs1si8epcs4si8naasoic16epcs64si16n equivalent
|
PDF
|
PCN0903
Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of
|
Original
|
pcn0903hitachi datecodesumitomo g700nitto ge100lfcs+6ge100lfcshitachi fh920ablestik 2025dablestik 2288aepc16ui88aasumitomo g700 type
|
PDF
|
PCN0902
Abstract: HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA
Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0902 ADDITIONAL ASSEMBLY SOURCE AND BILL OF MATERIAL CHANGE FOR ALTERA FLIP CHIP PRODUCTS Change Description This is an update to PCN0902; please see the revision history table for information specific to this
|
Original
|
pcn0902hc220f780nakhc220f672nanhc210f484nac+6xz-092hc230f1020bnhc240f1020nbchc230f1020awep2s60f1020c4nep2sgxf1152aa
|
PDF
|
PCN0702
Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line
|
Original
|
pcn07026300hjg700mmp8000ch4+1148hrsx10-5ul-94sumitomo g700sumitomo g600sumitomo eme g700sumitomo 6300h mold compoundsumitomo eme g600eme g600material properties g600 mold compoundsumitomo g700 tg
|
PDF
|
ADV0804
Abstract: marking A3 Taiwan semiconductor ALTERA PART MARKING EP3SE50 EP3SL110 MARKed A7 marking a7 altera marking JESD46-C 1/USB/EP3SE110
Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0804 TSMC WAFER FABRICATION SITES FOR THE STRATIX III FPGA FAMILY Description Altera will begin shipping Stratix III FPGAs out of two Taiwan Semiconductor Manufacturing Company TSMC wafer fabrication sites: FAB 12, located in Hsinchu, Taiwan, and FAB 14,
|
Original
|
adv080465-nmjesd46-cmarking a3 taiwan semiconductor+7altera part markingep3se50ep3sl110marked a7marking a7altera marking1/usb/ep3se110
|
PDF
|
