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    ALTERA PART MARKING Search Results

    ALTERA PART MARKING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    2910/BQA
    		Rochester Electronics LLC 2910 - Microprogram Controller - Dual marked (7801701QA) PDF Buy
    MQ80C186-12/BYA
    		Rochester Electronics LLC 80C186 - Microprocessor, 16-Bit -Dual marked (5962-8850102YA) PDF Buy
    54L04/BDA
    		Rochester Electronics LLC 54L04 - Hex Inverter - Dual marked (M38510/02005BDA) PDF Buy
    9936/BCA
    		Rochester Electronics LLC 9936 - Hex Inverter - Dual marked (M38510/03003BCA) PDF Buy
    54AC86/SDA-R
    		Rochester Electronics LLC 54AC86/SDA-R - Dual marked (M38510R75202SDA) PDF Buy

    ALTERA PART MARKING Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ALTERA PART MARKING

    Abstract: ADV0217 altera Date Code Formats ALTERA BGA packages PART MARKING altera date code format altera marking
    Contextual Info: CUSTOMER ADVISORY ADV0217 FULL LASER MARKING INTRODUCTION Change Description: Beginning January 2003, Altera will introduce a full topside laser mark on all Altera plastic body packages. Currently, the Altera device logo, part number, and date code are ink marked, while the Altera lot number and traceability code


    Original     		ADV0217 ALTERA PART MARKING ADV0217 altera Date Code Formats ALTERA BGA packages PART MARKING altera date code format altera marking PDF

    ADV0607

    Abstract: XZ-070 altera Date Code Formats Date Code Formats altera date code format ALTERA PART MARKING EP2C35 EP2C50 date code marking altera top marking
    Contextual Info: Revision 0: Initial Release CUSTOMER ADVISORY ADV0607 UFBGA 484 Package Coplanarity Enhancement Change Description Altera will enhance the coplanarity of its Ultra FineLine BGA UFBGA 484 packages as part of the company’s continuous product-quality improvement process. This enhancement


    Original     		ADV0607 ratin2C35 EP2C50 XZ0701T JESD46-B, 21-Nov-06 ADV0607 XZ-070 altera Date Code Formats Date Code Formats altera date code format ALTERA PART MARKING EP2C35 EP2C50 date code marking altera top marking PDF

    ADV0201

    Abstract: ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark
    Contextual Info: CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE TOP MARK ENHANCEMENT Change Description: Altera will begin marking the assembly lot number and a one-line internal traceability code on all non-BGA packages beginning March 2002. Reason For Change: The assembly lot number and new internal traceability marking code will be laser or ink


    Original     		ADV0201 ADV0201 ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark PDF

    ADV0217

    Abstract: ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING
    Contextual Info: Revision: 1.1.0 CUSTOMER ADVISORY ADV0217 UPDATE FULL LASER MARKING INTRODUCTION Change Description This is an update to ADV0217. See the revision history table for information specific to this update. In January 2003, Altera introduced a full topside laser mark on all Altera plastic body packages.


    Original     		ADV0217 ADV0217. ADV0217 JESD46-C, 20X20 ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING PDF

    ADV9707

    Abstract: altera Date Code Formats lot Code Formats altera ALTERA PART MARKING Date Code Formats Date Code Formats Altera altera top marking altera "date code format" Identification Traceability ALTERA die identifier
    Contextual Info: CUSTOMER ADVISORY TOP MARK TRACEABILITY ENHANCEMENTS As Altera adds additional sources of supply and in order for customers to maintain product traceability via device top mark, Altera will enhance its top marking scheme. In order to facilitate die identification, Altera will expand its current six character top mark date code and


    Original     		ADV9707 ADV9707 altera Date Code Formats lot Code Formats altera ALTERA PART MARKING Date Code Formats Date Code Formats Altera altera top marking altera "date code format" Identification Traceability ALTERA die identifier PDF

    ADV9401

    Abstract: RQFP ALTERA PART MARKING EPF81188ARC240-3 on 240 EPF81188RI240-3 marked EPF81188ARC240-2 EPF81188ARC240-4 altera MARKING
    Contextual Info: December 14, 1994 Dear Customer: Effective January 1, 1995, Altera will institute a new marking procedure on 240- and 304-pin Power Quad 2 packages. These changes are only aesthetic in nature and do not affect the functionality of the devices. Figure 1 illustrates the new mark that will appear on 240-pin RQFP and 304-pin RQFP


    Original     		304-pin 240-pin 304-pin 208-pin ADV9401 EPF81188RC240-3 EPF81188RC240-2 EPF81188RI240-3 ADV9401 RQFP ALTERA PART MARKING EPF81188ARC240-3 on 240 EPF81188RI240-3 marked EPF81188ARC240-2 EPF81188ARC240-4 altera MARKING PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    PCN0904

    Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N
    Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this


    Original     		PCN0904 65-nm 60-nm PCN0904, EU-REP3C16U484I7N EP3C10E144C7 EP3C10E144C7N EP3C10E144C8 PCN0904 EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N PDF

    ADV1005

    Abstract: EP2AGX45DF29C6N rh 115-2 EP2AGX95EF35I5N EP2AGX45DF29I5N EP2AGX65DF29I5N EP2AGX125EF29I3N EP2AGX65 EP2AGX45DF25C6N EP2AGX260FF35C4N
    Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV1005 ADDITIONAL ASSEMBLY SITE FOR THE ARRIA A II GX FBGA PACKAGE Change Description Altera will be introducing Amkor, Korea ATK as an additional assembly source for the Arria® II GX FBGA packagess. The Arria II GX family is currently manufactured out of Amkor,


    Original     		ADV1005 ADV1005 EP2AGX45DF29C6N rh 115-2 EP2AGX95EF35I5N EP2AGX45DF29I5N EP2AGX65DF29I5N EP2AGX125EF29I3N EP2AGX65 EP2AGX45DF25C6N EP2AGX260FF35C4N PDF

    PCN1205

    Abstract: EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3
    Contextual Info: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION P C N1 2 0 5 ADDITIONAL ASSEMBLY SOURCE ASE AND TRANSITION TO CENTER PIN GATE MOLD FOR FBGA PACKAGES Change Description This is an update to PCN1205; please see the revision history table for information specific to this


    Original     		PCN1205; Reco0HF35I4 EP4SGX230HF35I4N EP4SGXHF35I3* EP4SGXKH40I3* EP4SGXKH40I3N* EP4SH40C2N* EP4SGF45I3* EP4SGX290NF45C2 PCN1205 EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3 PDF

    ADV0812

    Abstract: ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F
    Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0812 ADDITIONAL PACKAGE OPTION FOR SELECTED STRATIX III FPGA DEVICES Description Altera will be introducing the Fine-Line BGA F1152 non-OPD on package decoupling 8-layer substrate design as an additional package option. The Stratix® III FBGA F1152 package is


    Original     		ADV0812 F1152 10-layer XZ0825T JESD46-C, ADV0812 ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F PDF

    ADV0907

    Abstract: ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N
    Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0907 ADDITIONAL ASSEMBLY PLANT FOR MBGA PACKAGES Change Description Altera will be introducing Amkor, Philippines as an additional assembly source for Altera Micro FineLine BGA MBGA packages. This change does not affect the form, fit, or function of the


    Original     		ADV0907 ADV0907 ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N PDF

    PCN0802

    Abstract: ALTERA PART MARKING EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 EP3C5 tsmc
    Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0802 ADDITIONAL TSMC WAFER FABRICATION SITE FOR CYCLONE III FPGAs Change Description Altera will begin manufacturing and shipping Cyclone III FPGAs out of Taiwan Semiconductor Manufacturing Company TSMC wafer FAB 14, located in Tainan, Taiwan.


    Original     		PCN0802 JESD46-C, PCN0802 ALTERA PART MARKING EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 EP3C5 tsmc PDF

    epcs1n

    Abstract: EPCS16SI8N EPCS64SI16N EPCS4SI8N EPCS16SI8N marking EPCS1SI8 epcs4si8naa EPCS128SI16N SOIC16 EPCS64SI16N equivalent
    Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN1003 ALTERNATIVE ASSEMBLY SITE FOR THE EPC EPCS SERIAL CONFIGURATION DEVICE FAMILY Change Description This is an update to PCN1003, PCN1003 please see revision history table for information specific to this update.


    Original     		PCN1003 PCN1003 PCN1003, EPCS16SI8N EPCS64SI16N EPCS128SI16N epcs1n EPCS16SI8N EPCS64SI16N EPCS4SI8N EPCS16SI8N marking EPCS1SI8 epcs4si8naa EPCS128SI16N SOIC16 EPCS64SI16N equivalent PDF

    PCN0903

    Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type
    Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of


    Original     		PCN0903 PCN0903 Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type PDF

    PCN0902

    Abstract: HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA
    Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0902 ADDITIONAL ASSEMBLY SOURCE AND BILL OF MATERIAL CHANGE FOR ALTERA FLIP CHIP PRODUCTS Change Description This is an update to PCN0902; please see the revision history table for information specific to this


    Original     		PCN0902 PCN0902; PCN0902 HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA PDF

    PCN0702

    Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
    Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line


    Original     		PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg PDF

    ADV0804

    Abstract: marking A3 Taiwan semiconductor ALTERA PART MARKING EP3SE50 EP3SL110 MARKed A7 marking a7 altera marking JESD46-C 1/USB/EP3SE110
    Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0804 TSMC WAFER FABRICATION SITES FOR THE STRATIX III FPGA FAMILY Description Altera will begin shipping Stratix III FPGAs out of two Taiwan Semiconductor Manufacturing Company TSMC wafer fabrication sites: FAB 12, located in Hsinchu, Taiwan, and FAB 14,


    Original     		ADV0804 65-nm JESD46-C, ADV0804 marking A3 Taiwan semiconductor ALTERA PART MARKING EP3SE50 EP3SL110 MARKed A7 marking a7 altera marking JESD46-C 1/USB/EP3SE110 PDF

    PCN0513

    Abstract: ALTERA PART MARKING stratix II EP2C15A EP2C20 EP2C35 EP2C50 EP2S15 EP2S60 EP2S90 9y marking
    Contextual Info: Revision: 1.2.1 PROCESS CHANGE NOTIFICATION PCN0513 ADDITIONAL TSMC WAFER FABRICATION SITE Change Description: This is an update to PCN0513; please see the revision history table for information specific to this update. Beginning January 1, 2006, Altera started shipping 90-nm products from TSMC’s Fab 14 fabrication


    Original     		PCN0513 PCN0513; 90-nm JESD46-B, EP2S15, EP2S30 EP2S180 PCN0513 ALTERA PART MARKING stratix II EP2C15A EP2C20 EP2C35 EP2C50 EP2S15 EP2S60 EP2S90 9y marking PDF

    PCN1002

    Abstract: EPF10K100ARI240-3 EPM9560ARI208-10 EPM7256SRI208-10N EPF10K30RI208-4N epm9560ri208-20 EPF10K20RI208-4 EPF10K30RI240-4N EPM7256SRI208-10 EPF10K20RC208-4
    Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION P CN1 0 0 2 Additional Assembly Source and Power Quad Flat Pack RQFP 208 and 240 Package Conversion Change Description Altera is introducing Amkor, Philippines (ATP) as an additional assembly source for the RQFP 208


    Original     		approximatelyEPM9560ARC208-10N EPM9560ARI208-10 EPM9560RC208-15 EPM9560RI208-20 EPF10K70RC240-2 EPF10K70RC240-2N EPF10K70RC240-3 EPF10K70RC240-3N EPF10K70RC240-4 EPF10K70RC240-4N PCN1002 EPF10K100ARI240-3 EPM9560ARI208-10 EPM7256SRI208-10N EPF10K30RI208-4N epm9560ri208-20 EPF10K20RI208-4 EPF10K30RI240-4N EPM7256SRI208-10 EPF10K20RC208-4 PDF

    PCN0716

    Abstract: ALTERA PART MARKING JESD46-C TSMC
    Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0716 ADDITIONAL TSMC WAFER FABRICATION SITE FOR STRATIX GX FPGAs Change Description Altera will begin shipping Stratix® GX FPGAs out of Taiwan Semiconductor Manufacturing Company TSMC wafer FAB 14, located in Tainan, Taiwan. The product currently ships out of


    Original     		PCN0716 JESD46-C, PCN0716 ALTERA PART MARKING JESD46-C TSMC PDF

    14 pin diagram of optrex lcd display 16x2

    Abstract: optrex lcd display 16x2 LCD ASCII table CODE 16x2 LCD ASCII CODE 16x2 NII51010-7 Scatter-Gather direct memory access SG-DMA LCD MODULE optrex 16x2 block diagram images of lcd display 16x2 d4564163-a80 NII51019-7
    Contextual Info: Quartus II Version 7.1 Handbook Volume 5: Embedded Peripherals Preliminary Information 101 Innovation Drive San Jose, CA 95134 www.altera.com QII5V5-7.1 Copyright 2007 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


    Original     		PDF

    PCN0714

    Abstract: EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A
    Contextual Info: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION PCN0714 UPDATE ASSEMBLY PLANT CHANGE FOR PQFP AND TQFP PACKAGES Change Description: This is an update to PCN0714; please see the revision history table for information specific to this update. The plastic quad flat pack PQFP and thin quad flat pack (TQFP) packages currently


    Original     		PCN0714 PCN0714; EP20K100 EP20K60E EP20K100E EP20K160E EP20K200E EP20K300E EPF10K100E EPF10K130E EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A PDF