ALLOY 42 Search Results

Contextual Info: 5 2 1 4 3 SJ1-42535TS-SMT 2 3 5 1 10.4 0.409 0.5 1.60 0.063 2 PLCS 0.5 0.020 4 4 2 3 7.0 0.276 4.5 0.177 (2 PLCS) 4.50 0.177 9.5 0.374 0.15 HOUSING TERMINAL 1 TERMINAL 2 TERMINAL 3 TERMINAL 4 TERMINAL 5 Copper Alloy Copper Alloy Copper Alloy Copper Alloy

Contextual Info: 2 1 4 3 6 SJ1-42535RS-SMT 2 3 1 6 10.4 0.409 0.5 1.60 0.063 2 PLCS 0.5 0.020 4 4 2 3 7.0 0.276 4.5 0.177 (2 PLCS) 4.50 0.177 9.5 0.374 0.15 HOUSING TERMINAL 1 TERMINAL 2 TERMINAL 3 TERMINAL 4 TERMINAL 6 Copper Alloy Copper Alloy Copper Alloy Copper Alloy

MF202

Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical

Contextual Info: SJ1-42534-SMT PCB LAYOUT TOP VIEW 2 3 2 1 4 3 1 1.8X2.8 10.4 0.409 0.5 1.60 0.063 2 PLCS 0.5 0.020 (2 PLCS) 4 4 4.5 0.177 (2 PLCS) 4.50 0.177 9.5 0.374 0.15 2 3 TERMINAL 1 TERMINAL 2 TERMINAL 3 TERMINAL 4 HOUSING Copper Alloy Copper Alloy Copper Alloy Copper Alloy

Contextual Info: Q F P Alloy 42 Lead Frame 0.50mm * ★ : eecier Oe« BODY SIZE O.fjbmri 28; 160 V :; 0 bornir. 203 0.40mm 256 20BP6Y 32 rch PIN CO 266P6J* 240 H Q F P (Copper Alloy Lead Frame + Copper Heat Spreader) H Q F P (Alloy 42 Lead Frame + Copper Heat Spreader)

Contextual Info: SJ1-42536-SMT 2 3 1 4 3 6 5 2 1 5.00 0.197 5 6 1.8X2.8 3 PLCS 10.4 0.409 0.5 1.60 0.063 (2 PLCS) 4 4 4.5 0.177 (2 PLCS) 4.50 0.177 9.5 0.374 0.15 2 3 HOUSING TERMINAL 1 TERMINAL 2 TERMINAL 3 TERMINAL 4 TERMINAL 5 TERMINAL 6 Copper Alloy Copper Alloy Copper Alloy

EZ00

Abstract: FW00
Contextual Info: DATE CODE AM P LOGO NOTE: 1. MATERAL HOUSING : HIGH TEMPERATURE THERMOPLASTIC, UL 9 4 V —0. COLOR: SEE TABLE. CONTACT : COPPER ALLOY. PIN : COPPER ALLOY SHIELD : COPPER ALLOY. ±0.1 2. FINISH CONTACT : SILVER PLATING. PIN : NICKEL PLATING SHIELD : NICKEL PLATING.

ZN 3055 transistor

Abstract: Transistor w1l 7805 TO-220 V7233 5241E V7331 V5237B V-5240-k mk 5373 V7622
Contextual Info: ASSMANN Technical Data & Abbreviations Electronic C om ponen ts Al Surface nature AI203 Aluminiumoxyd Al Mg Si 0,5 Special aluminium alloy {extruded Al 99,5 Special aluminium alloy band) GD-AI Si 12 Special aluminium alloy (Die-cast) BeO Berylliumoxyd K

Y14SM

Contextual Info: 4 QMmSQN CHWT I «ÜH i 1 i SPECIFICATIONS: m vmmammmmmummm MM MATERIALS; CAS?: THERMOPLASTIC 34V-0. FRAMt: STEEL. TIN PLATED. ACTUATOR: COPPER ALLOY. NICKEL PLATED. MOVING C0MTACT: COPPER ALLOY, BOLD OVER NICKEL PLATE. FIXED CONV!.CT/TERMINAL: COPPER ALLOY, TIN/LEAD PLATE.

Contextual Info: RoHS COMPLIANT £ -,- - .315 2.00 , 079 'r V V V T 1 >-4 r\K ' J .079 1.50 .059 Material: Housing: THERMOPLASTIC,UL 94V-0. USB2.0 Contact:Copper alloy USB3.0 Contact:Copper alloy SHELL:Copper alloy,Tin over Nickel plating. Ordering Information 2077 S A H * * 00

Amphenol MIL CIRCULAR CONNECTORS

Abstract: amphenol MIL-C-5015 DL3102A DS5015 3106A amphenol 2 pin male circular plug socapex 14S-7 25043 amphenol 12 pin male circular plug
Contextual Info: DS 5015 Characteristics • Intermateable and intermountable with other MIL-C-5015 Style connectors. • Several kinds of plating, all cadmium free (olive drab zinc alloy, black zinc alloy, electroless nickel upon request). • Solder contacts, silver plated copper alloy, from AWG 16 to AWG 0.

Highlight Optoelectronics

Abstract: HL-110 HL008
Contextual Info: AlInGaP YELLOW GREEN LED CHIPS DEVICE NO. HL-008 UG 1. Scope： This specification applies to AlInGaP/GaAs LED chips. 2. Structure： Emission area：Smooth surface Electrodes： P Anode side：Aluminum alloy (or Gold alloy). N(Cathode)side：Gold alloy. 3. Size：

Contextual Info: \ A B E_ |_ F_ / C_ |_ D NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP.UL94V-0; 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL:COPPER ALLOY 1.4 LATCH: THERMOPLASTIC, HIGH TEMP.UL94V-0; 2. FINISH:

UM 66 in

Abstract: EL-420-21
Contextual Info: LED - Chip ELС-420-21 10.04.2008 rev. 01 Radiation Type Technology Electrodes Violet Special InGaN N cathode up typ. dimensions (±50) µm typ. thickness 145 (±15) µm cathode gold alloy, 2.5 µm anode gold alloy, 1.5 µm Absolute Maximum Ratings at Tamb = 25°C, unless otherwise specified

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SVT Package Weight mg 45000 Product Group Type No. S30VT60 – S30VT160 S50VT60 – S50VT160 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating

m28748

Abstract: 107R1001 m28748 winchester MRAC 107-0903-2A M39029/34-440 Winchester Electronics 100-51020S m39029/35-275 Crimp spec for mil-c-39029 socket 100-1020P
Contextual Info: Removable Contacts Watertown, Connecticut 06795-0500 • Copper Alloy, gold plated. Closed entry type machined from copper alloy, gold plated. Complete line available. Includes automatic pneumatic, pneumatic hand operated, hand operated crimping tools, insertion and

SSOP42-P-450-0

Contextual Info: APPENDIX 3.9 Package outline 3.9 Package outline 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 Weight g 0.63 JEDEC Code – Lead Material Alloy 42/Cu Alloy e b2 22 Caution ! E HE e1 I2 42 F Symbol TBD 21 1 A D Recommended Mount Pad

Contextual Info: 4 5 6 APPROVED: DATE:_TITLE: .528 [13.40] LEDI (LED2) .522 .450 [13.26] [11.43] B SPECIFICATIONS: Material: Insulator PBT, glass reinforced , thermoplastic, rated UL 94V-0 Insulator color: Black Contacts: Copper Alloy Shield: Copper Alloy, Nickel plated

Contextual Info: |_ A_ |_ 3_ |_ 2_ | | 73829 NOTESo K MATERIAL^ HOUSING; I.R. COMPATIBLE POLYMER, GLASS PILLED, UL 94 V 0, BLACK TERMINALS; COPPER ALLOY BOARDLOCK; COPPER ALLOY 2. FINISH; TERMINALS; SELECTIVE GOLD IN CONTACT AREA THICKNESS = 30 MICROINCHES / 0.763 MICROMETERS

Contextual Info: TITLE PART No. REV PAGE 50 Ohm Micro Coax, 42 AWG 50MCX-37 6 1 of 1 Conductor Core 0.32+/-0.013mm 0.0125+/-0.0005" Shield Jacket NOTES Conductor: 42 AWG, 7/50, Silver Plated Copper Alloy Core: PFA, 0.0025" Wall Thickness, 0.008" Diameter Color: Yellow Served Shield: 48 AWG, Silver Plated Copper Alloy

ASTM B633-85

Abstract: d3754 ASTM B633 040THICK
Contextual Info: Pomona Model 3754 Miniature Size Aluminum Box With Cover MATERIALS: Connector: Body: Tarnish Resistant Plating, Center Contact: Gold Plated Beryllium Copper Shielded Housing: Die cast aluminum, Alloy A380 or A384 Cover: .040 thick aluminum alloy 1100-H14

031-0554-161

Abstract: 031-0560-081 330-0351-008 MIL-C-5015 bulkhead 330-0351-012 CBT-600B cbt 600 crimp tool 031-0560-161 MS25251-12 CET-16-4
Contextual Info: MIL-C-5015 Connectors MS-E/F/R/ER Performance and Material Specifications MATERIALS AND FINISHES Shell Material Aluminum alloy O.D. Chromate coating Finish over cadmium plating Insulator Material Polychloroprene resilient Contacts Material Brass or copper alloy

744051

Contextual Info: MATERIAL DECLARATION SHEET Material # 6637S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Contact Spring Palmet Alloy 0.00095 2 C-Ring Stainless Steel Alloy

steel alloy

Abstract: formaldehyde carbon ink
Contextual Info: MATERIAL DECLARATION SHEET Material # 6638S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Hex Nut Stainless Steel Alloy 2 Lock Washer Stainless Steel Alloy