ALE TO CS Search Results

magnetron panasonic

Abstract: panasonic magnetron lr2655 Microwave Oven Panasonic
Contextual Info: LE ALE VDE 1a 16A power relay for micro wave oven LE RELAYS (ALE) FEATURES TMP type 1. Supports magnetron and heater loads. Capable for switching magnetron and heater loads found in microwave ovens. 2. Excellent heat resistance Ambient temperature: up to 85°C 185°F

Contextual Info: .1101.125 tft — Axial & Closed Back Design To Accept .110/.125 x .020 M ale Tab Quick-Connect Series In-Line a n d Flag Type STYLE AN D D IM E N S IO N S W IRE RANGE -* Q 1 6 ^ ill 4 \ ^ .110 O R .125 M ALE TAB w r INSULATION RANGE U L/CSA QUANTITY P E R REEL

Contextual Info: iBlBULGIN Rio Terminal Blocks and Strips 3.5m m Spacing Pitch 8A , 125V UL 5A , 125VV D E UL94V-0 Housing Stamped Fem ale Contacts With W ire Protection M ates with 224 & 225 Series Headers UL, CSA and SEV Approvals Designed to VDE 0110 • 3.5m m Spacing (Pitch)

Contextual Info: - 187 Quick-Connect Series To Accept .167 x .032 Fem ale Quick-Connect Pre-lnsulated Male In-Line T ype STYLE AND DIMENSIONS WIRE RANGE 0 0 . 0 22-18 MAX. INSUL. DIAMETER "A” UL/CSA 117 -.147 QUANTITY PER REEL 4000 iS RECOMMENDED STRIP LENGTH STOCK

Contextual Info: DS5001FP 128k Soft Microprocessor Chip www.maxim-ic.com FEATURES § § § BA11 P0.5/AD5 PE1 P0.6/AD6 BA10 P0.7/AD7 CE1 NC CE1N BD7 ALE BD6 PSEN BD5 P2.7/A15 BD4 8051-compatible microprocessor adapts to its task – Accesses up to 128 kbytes of nonvolatile

OPCODE SHEET FOR 8051 MICROCONTROLLER

Contextual Info: DS5001FP 128k Soft Microprocessor Chip www.maxim-ic.com FEATURES § § § BA11 P0.5/AD5 PE1 P0.6/AD6 BA10 P0.7/AD7 CE1 NC CE1N BD7 ALE BD6 PSEN BD5 P2.7/A15 BD4 8051-compatible microprocessor adapts to its task – Accesses up to 128 kbytes of nonvolatile

80-MQFP

Abstract: BA10 BA11 BA12 CRC-16 DS5001FP DS5002FP CE172
Contextual Info: DS5001FP 128k Soft Microprocessor Chip www.maxim-ic.com FEATURES § § § PIN ASSIGNMENT Top View BA11 P0.5/AD5 PE1 P0.6/AD6 BA10 P0.7/AD7 CE1 NC CE1N BD7 ALE BD6 PSEN BD5 P2.7/A15 BD4 8051-compatible microprocessor adapts to its task – Accesses up to 128kB of nonvolatile

63E2

Contextual Info: .250 Quick-Connect Series — Closed Back Design — To Accept .250 x .032 M ale Tab WIRE RANGE 20-14 INSULATION RANGE None 16-12 .100.175 UL/CSA v* t* - QUANTITY PER REEL 6000 RECOMMENDED STRIP LENGTH % 2 ± 1/3 2 STOCK THICKNESS .016 3000 %2 ± V32

Contextual Info: and CLKIN Stable to Outputs Valid 29 CLKIN Parlod« Max UC S . L C S . G C S7:0, TOUT. H O O T , T X0 1:0, N CS HLDA, ALE, SIHT1 Figure 17 AD 1 5 : 0 ^ 2 ^ 0 , RD.WR, D T / R , DEN, LOCK Vcc and CLKIN Stabla to Raaat high, approximately 32 CLKIN parted*

Contextual Info: u .187 Quick-Connect Series — Closed Back Design — To Accept .187 x .020 M ale Tab In-Line Type STYLE AND DIMENSIONS WIRE RANGE INSULATION RANGE 22-16 .075-.125 UL/CSA QUANTITY PER REEL 5000 S RECOMMENDED STRIP LENGTH % 2 ± V32 STOCK THICKNESS 014 •230< ^ > y 2^ ' ’560

Contextual Info: Gds A-2 F/FC DIN 41612 • complementary to type F N um ber o f contacts max. 24 Fem ale connectors Identification Number of contacts Part No. Drawing Dimensions in mm - U.4 - Female connector for crimp contacts I Cst il l in | r d r r nn :_ L y

UT69151

Abstract: 32Kx16 80C86 UT22VP10 UT7156
Contextual Info: Shared Memory Interface to UT69151 SµMMITTM VDD 80C86 MN/MX ALE ADDRESS LATCH C OE DATA AD19-AD0 OUT 32Kx16 SRAM 3 Latches required RD HLDA HOLD DT/R UT54ATCS373 ADDRESS DATA CS RD WR M/IO CLK UT7156 CLK 32Kx16 SRAM VDD ADDRESS DATA VDD Sµmmit VDD RRD RWR

71V124SA

Abstract: C8051 code a7 74VHC573 C8051F000 IDT71V124 IDT71V124SA10PH
Contextual Info: Application Note 06 Interfacing an External SRAM to the C8051F000 Cygnal C8051 IDT71V124 128Kx8 SRAM A[16:8] ADDRESS BUS A[16:8] 74VHC573 Octal Latch LE ALE AD[7:0] ADDRESS / DATA BUS D Q A[7:0] I/O[7:0] CS CS /WR WE /RD OE Figure 1. External SRAM Block Diagram.

DB9 BACKSHELL

Abstract: DB15F d-sub backshell db9f TO DB15F db15m DB15 MALE TO DB9 FEMALE DB9M TO DB15 DB9 Female D-SUB CONNECTOR connector DB15m d-SUB DB9M
Contextual Info: W aterproof D -S ub B ackshell Kits T hese b ack sh ells in c lu d e so ld er c u p c o n n e c to rs a n d a re also av ailab le in m ale o r fem ale g e n d e rs a n d DB9, DB15, DB25 a n d HD15 sizes. T he c o n n e c to rs will a c c o m m o d a te w ire ran g es from 30 - 20 AWG. B ackshell c o n stru ctio n

Contextual Info: TM S4500A DYNAMIC RAM CONTROLLER D 2 6 7 4 . JA N U A R Y 1982 TM S 4500A Controls Operation of 8K, 16K, 32K , and 64 K Dynam ic RAMs CLK ROY One Package Contains Address M ultiplexer, Refresh Control, and Timing Control • RENI CS ALE Directly Addresses and Drives Up to 2 5 6 K

27LV520

Abstract: AT27LV520-90XC AT27LV520
Contextual Info: Features * 8-Bit Multiplexed Addresses/Outputs * Fast Read Access Time - 90 ns * Dual Voltage Range Operation - Low-Voltage Power Supply Range, 3.0V to 3.6V, or - Standard 5V ± 10% Supply Range * Low Power CMOS Operation - 20 jiA max. Standby for ALE = V!H and Vcc = 3.6V

Contextual Info: 2mm Interconnect TEMPUS C B C 20 M ale Signal M odules — Wide Wall — Pressfit Termination — 5 Row Features Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus + , IEEE P1596 SCI and IEC 917 metric modular order Stackable with other TEMPUS modules, with

Contextual Info: , Gds A-2C DIN 41612 • VG 95 324 • complementary to type C HART1NG Number of contacts 48 32,16 Male connectors Identification Number of contacts Contact arrangement Male connector with angled solder pins Male connector with straight solder pins M ale conn e cto r

WSI eprom Programming algorithm

Contextual Info: ^ALE W AFFR INTEGRATION 99D 0 0 136 DT-Í/6-/3-Z5 WS57C43B ADVANCE INFORMATION WAFER WAFERSCALE INTEGRATION, INC 4K X 8 CMOS PROM SCALE KEY FEATURES Low Power Consumption — 300 mW Active Power 20 MHz — Up to 200 mA Fast Programming • Available in 300 Mil Dip

Contextual Info: .250 Quick-Connect Series — Cross Bridge Design — To Accept .250 x .032 Mate Tab and Fem ale Quick-Connect % W IRE RANGE INSULATION RANGE 22-18 •060-.115 U L/CSA QUANTITY PER REEL 2500 RECOMMENDED ST R IP LENGTH STOCK TH ICKN ESS ± .016 % 2 1/ 3 2 P igg yb ack Flag an d In -Lin e Type

IC P521

Abstract: P521 go AP9A106
Contextual Info: AP9A106 ISEMICONDUCTOR 64K x 18 CMOS Static RAM Features latch , an are latched when ALE is LOW. The address latches and the wide word help to eliminate the need for external address bus buffers and/or latches. • Fast access times: 17*, 20, 25, 35 ns • Wide Word 18-bits) for:

Contextual Info: 2mm Interconnect TEMPUS C B C 20 M ale Pow er Modules — W ide W all - - Solder or Pressfit Term ination — 4 Row "I Features • Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order • Stackable with other TEMPUS modules, with

Contextual Info: ARK-LES CORPORATION DEPT I 2 2 3 4 2 5 6 7 8 9 10 it 12 NC JZ PART NAME: CUSTOMER DRAWING STOUGHTON, MA PART NO: FEM ALE T E R M IN A L CUSTOMER: ELECTRI-CABLE ASSEMBLIES 3000H84A T HIS GRIP IS NOT UL L I S T E D OR CSA CERTIFIED. OIO MAX CUT-OFF NOTES: 1. TO ACCEPT A .250 X .032 MALE TAB.

Contextual Info: _ 4_ REVISIONS This docu m en t is the property of Am phenol C orporation and is delivered on the e xpress condition th at It is not to be disclo sed, rep ro du ced or used, in whole or in part, fo r m a n u fa c tu re or s ale by an yone other than Am phenol