AGPD RESISTOR Search Results

Contextual Info: CBR Series High Temperature Bondable Thick Film Chip Resistors • • • • • • • • Resistances from 10Ohms to 1TOhms AgPd Termination for face-down assembly Gold Termination for face-up assembly Power Rating 0.05 to 0.25Watt Resistance Tolerances to ± 5%

Contextual Info: RCA Vishay Automotive Grade Thick Film, Rectangular Chip Resistors FEATURES • Metal glaze on high quality ceramic with protective overglaze • Sulfur resistant • Superior resistance against H2S-atmosphere than standard AgPd contacts • Solder contacts on Ni barrier layer

D12 vishay

Abstract: SMD resistors 2012 marking code BV SMD Transistor 562R D251206 1608 SMD resistors derating dapd11
Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

562R

Abstract: d12 draloric
Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

d12 draloric

Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

d12 draloric

Abstract: draloric d25 d110603 D120805
Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

Contextual Info: CRH - Thick Film Chip Resistors High Resistance HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only Tolerance (%) M = +20 P = +50 N = +30 K = +10 FEATURES

Contextual Info: CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: • • • • • • Chip Resistors in thick film technology AgPd termination for face-down assembly flip chip; for conductive epoxy assembly or Gold termination for face-up assembly (wire bondable US/TC)

AgPd

Contextual Info: CRH- Thick Film Chip Resistors High Resistance The content of this specification may change without notification 09/15/08 HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only

JEDEC 2a

Contextual Info: Datasheet CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: •      Chip Resistors in thick film technology AgPd termination for flip chip assembly face-down; for conductive epoxy assembly or Gold termination for wire bonding (US/TC; face-up) as well as flip chip

Contextual Info: THICK FILM CHIP RESISTORS T Y P E R C 7 3 CONSTRUCTION 1. Ceramic Substrate 2. Ru02 Resistor Film 3. Over Coating 4. Termination 1 AgPd 5. Termination 2 (Ni) 6. Termination 3 (Sn) DIMENSIONS Mark 2Y 2Z/2W 2X/2C/2P 2A/2D/2K 2B/2E 2F/2G 2H/2I 3A 3B EIA 0201

AgPd resistor

Abstract: CAT16-J8LF AgPd
Contextual Info: MATERIAL DECLARATION SHEET Material # CAT16-J8LF Series Product Line Chip Resistor Arrays Date 04/06/05 RoHS Compliant Yes No. Construction Element Material Group Material Weight [g] 1 Ceramic Substrate 0.01788 2 Conductor Terminal Electrode 0.00054 3 Resistive film

"MATERIAL DECLARATION SHEET"

Abstract: CAT16-PC4F12LF
Contextual Info: MATERIAL DECLARATION SHEET Material # CAT16-PC4F12LF Series Product Line Chip Resistor Arrays Date 04/06/05 RoHS Compliant Yes No. Construction Element Material Group Material Weight [g] Materials 1 Ceramic Substrate 0.01788 Al2O3 If Applicable Average Mass

AgPd resistor

Abstract: CAT16-PT2F2LF AgPd
Contextual Info: MATERIAL DECLARATION SHEET Material # CAT16-PT2F2LF Series Product Line Chip Resistor Arrays Date 04/06/05 RoHS Compliant Yes No. Construction Element Material Group Material Weight [g] Materials 1 Ceramic Substrate 0.00894 Al2O3 If Applicable Average Mass

CAT16-LV2F6LF

Abstract: AgPd
Contextual Info: MATERIAL DECLARATION SHEET Material # CAT16-LV2F6LF Series Product Line Chip Resistor Arrays Date 04/06/05 RoHS Compliant Yes No. Construction Element Material Group Material Weight [g] Materials 1 Ceramic Substrate 0.00894 Al2O3 If Applicable Average Mass

CAT16-LV4F12LF

Abstract: AgPd resistor
Contextual Info: MATERIAL DECLARATION SHEET Material # CAT16-LV4F12LF Series Product Line Chip Resistor Arrays Date 04/06/05 RoHS Compliant Yes No. Construction Element Material Group Material Weight [g] Materials 1 Ceramic Substrate 0.01788 Al2O3 If Applicable Average Mass

CAT16-PT4F4LF

Abstract: AgPd
Contextual Info: MATERIAL DECLARATION SHEET Material # CAT16-PT4F4LF Series Product Line Chip Resistor Arrays Date 04/06/05 RoHS Compliant Yes No. Construction Element Material Group Material Weight [g] Materials 1 Ceramic Substrate 0.01788 Al2O3 If Applicable Average Mass

CAT16-PC5F12LF

Abstract: "material declaration sheet" for chip resistor
Contextual Info: MATERIAL DECLARATION SHEET Material # CAT16-PC5F12LF Series Product Line Chip Resistor Arrays Date 02-May-2006 RoHS Compliant Yes No. Construction Element Material Group Material Weight [g] Materials 1 Ceramic Substrate 0.01788 Al2O3 If Applicable Average Mass

Contextual Info: Non-magnetic Thick Film Chip Resistor－NMR Series •Construction L D1 3 W 4 T 7 65 1 D2 2 1 Alumina Substrate 5 Resistor Layer RuO2/Ag 2 Bottom Electrode (Ag) 6 Primary Overcoat (Glass) 3 Top Electrode (Ag-Pd) 7 Secondary Overcoat (Glass) 4 Edge Electrode (Ag-Pd)

Contextual Info: A World of Advanced Resistor Technology www.riedon.com Thick Film Chip Resistors Very High Temperature available High Value Chip Resistors up to 10 TΩ Precision High Value Chip Resistors Power Chip Resistors Trimmable and Standard Chip Resistors Why Select Riedon Chip Resistors?

RC-2609A

Contextual Info: Cal-Chip Electronics, Incorporated RN SERIES Thin Film Chip Resistors FEATURES • Surface Mount Devices SMD • Precision Tolerances of ±0.5% to ±0.1% • Temperature Coefficients of ±50ppm/°C and ±25ppm°C • Precision Performance • Space Saving Construction

VJ HIFREQ

Abstract: VJ Commercial VJ NON-MAGNETIC SERIES FOR EPOXY BONDING VJ....W1BC Ultra Small Series 0201 GA....34G Automotive MLCC VJ....W1BC Basic Commodity
Contextual Info: V ishay I ntertechnolo g y, I nc . I INNOVAT AND TEC O L OGY N HN Multilayer Ceramic Chip Capacitors O 19 62-2012 Capacitors - Focus Products Multilayer Ceramic Chip Capacitors Products: • • • • • • • Basic Commodity BME/NME Technology

RC-2609A

Contextual Info: Cal-Chip Electronics, Incorporated RN SERIES Thin Film Chip Resistors FEATURES • Surface Mount Devices SMD • Precision Tolerances of ±0.5% to ±0.1% • Temperature Coefficients of ±50ppm/°C and ±25ppm°C • Precision Performance • Space Saving Construction

N5595

Abstract: Philips X7R capacitors 0805 Philips X7R capacitors 0805 c g
Contextual Info: Philips Components Product specification Surface mount ceramic multilayer capacitors FEATURES Compact series QUICK REFERENCE DATA • Seven standard sizes • Dense dielectric layers DESCRIPTION Rated voltage U r DC : • Maximum capacitance per unit volume