AGPD RESISTOR Search Results

Contextual Info: CBR Series High Temperature Bondable Thick Film Chip Resistors • • • • • • • • Resistances from 10Ohms to 1TOhms AgPd Termination for face-down assembly Gold Termination for face-up assembly Power Rating 0.05 to 0.25Watt Resistance Tolerances to ± 5%

Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive gluing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

Contextual Info: RCA Vishay Automotive Grade Thick Film, Rectangular Chip Resistors FEATURES • Metal glaze on high quality ceramic with protective overglaze • Sulfur resistant • Superior resistance against H2S-atmosphere than standard AgPd contacts • Solder contacts on Ni barrier layer

RCA040

Contextual Info: RCA Vishay Automotive Grade Thick Film, Rectangular Chip Resistors FEATURES • Metal glaze on high quality ceramic with protective overglaze • Sulfur resistant • Superior resistance against H2S-atmosphere than standard AgPd contacts • Solder contacts on Ni barrier layer

D12 vishay

Abstract: SMD resistors 2012 marking code BV SMD Transistor 562R D251206 1608 SMD resistors derating dapd11
Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

D1106

Abstract: D120805
Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Glueing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive glueing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive gluing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

562R

Abstract: d12 draloric
Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive gluing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

bvxxxx

Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

D251206

Abstract: D25 200 P5
Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Glueing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive glueing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Glueing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive glueing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

d12 draloric

Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

D120805

Abstract: D110603 D251206 SMD resistors 2012 D11060 1206 smd 100 ohm resistor d1106 D10 SMD CODE MARKING bvxxxx marking D25
Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with “Restriction of the use of Hazardous Substances” RoHS directive 2002/95/EC (issue 2004)

d12 draloric

Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

d12 draloric

Abstract: draloric d25 d110603 D120805
Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

d12 draloric

Abstract: D25 200 10K CRCW2010 vishay draloric IEC-60286-3 0402
Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

Contextual Info: CRH - Thick Film Chip Resistors High Resistance HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only Tolerance (%) M = +20 P = +50 N = +30 K = +10 FEATURES

Contextual Info: CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: • • • • • • Chip Resistors in thick film technology AgPd termination for face-down assembly flip chip; for conductive epoxy assembly or Gold termination for face-up assembly (wire bondable US/TC)

AgPd

Contextual Info: CRH- Thick Film Chip Resistors High Resistance The content of this specification may change without notification 09/15/08 HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only

JEDEC 2a

Contextual Info: Datasheet CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: •      Chip Resistors in thick film technology AgPd termination for flip chip assembly face-down; for conductive epoxy assembly or Gold termination for wire bonding (US/TC; face-up) as well as flip chip

AgPd

Abstract: CRH05 CRH16A
Contextual Info: CRH – Thick Film Chip Resistors High Resistance The content of this specification may change without notification 09/15/08 HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only

Contextual Info: THICK FILM CHIP RESISTORS T Y P E R C 7 3 CONSTRUCTION 1. Ceramic Substrate 2. Ru02 Resistor Film 3. Over Coating 4. Termination 1 AgPd 5. Termination 2 (Ni) 6. Termination 3 (Sn) DIMENSIONS Mark 2Y 2Z/2W 2X/2C/2P 2A/2D/2K 2B/2E 2F/2G 2H/2I 3A 3B EIA 0201

AgPd resistor

Abstract: CAT16-J8LF AgPd
Contextual Info: MATERIAL DECLARATION SHEET Material # CAT16-J8LF Series Product Line Chip Resistor Arrays Date 04/06/05 RoHS Compliant Yes No. Construction Element Material Group Material Weight [g] 1 Ceramic Substrate 0.01788 2 Conductor Terminal Electrode 0.00054 3 Resistive film