AGPD Search Results

NTCS0805E3.....T

Abstract: NTCS0805E4474JXT NTCS0805E3T
Contextual Info: 2381 615 1./NTCS0805E4. Vishay BCcomponents Surface Mount, NTC Thermistors FEATURES • TCR from 6 to 2 %/K even at high temperatures • Tolerance on B25/85 down to 1 % • AgPd terminations • Suitable for wave or reflow soldering • Old part number was 2322 615 1.

MC0603B473M500CT

Abstract: pf 4000 MC0603B683K500CT MC0603B104K500 MC0603F104Z250CT MC0603F104Z500CT
Contextual Info: RoHS Compliant Tape & Reel Dimension Capacitor Dimension L mm W (mm) MB 1.60±0.10 0.80±0.10 0.40±0.15 NO. 1 2 3 4 5 Name NPO/X7R Ceramic material Inner electrode Inner layer Termination Middle layer Outer layer X7R/X5R/Y5V BaTiO3 based AgPd alloy Ni Ag

AgPd

Contextual Info: CRH- Thick Film Chip Resistors High Resistance The content of this specification may change without notification 09/15/08 HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only

2322 615 13103 vishay

Abstract: NTCS0805E3.....T 473JXT NTCS0805E4474JXT NTCS0805E3T
Contextual Info: 2381 615 1./NTCS0805E4. Vishay BCcomponents Surface Mount, NTC Thermistors FEATURES • TCR from 6 to 2 %/K even at high temperatures • Tolerance on B25/85 down to 1 % • AgPd terminations • Suitable for wave or reflow soldering • Old part number was 2322 615 1.

Contextual Info: CRH - Thick Film Chip Resistors High Resistance HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only Tolerance (%) M = +20 P = +50 N = +30 K = +10 FEATURES

D12 vishay

Abstract: SMD resistors 2012 marking code BV SMD Transistor 562R D251206 1608 SMD resistors derating dapd11
Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

AgPd

Abstract: CRH05 CRH16A
Contextual Info: CRH – Thick Film Chip Resistors High Resistance The content of this specification may change without notification 09/15/08 HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only

D1106

Abstract: D120805
Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Glueing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive glueing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive gluing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

Contextual Info: 0805 2012 drahtgewickelt (AgPdPt Metallisierung) 0805 (2012) wire-wound (AgPdPt Metallisation) - 26 - Allgemeine Eigenschaften und technische Informationen zu den drahtgewickelten SMD-Spulen Bauform 0805 / Baureihe 5508 General Characterisitics and Technical Information of wirewound SMD Inductors

KSR-230

Contextual Info: Extract from the online catalog EMG 12-REL/KSR-230/1AU Order No.: 2942616 Relais-Modul, mit fest eingelötetem Kleinschaltrelais, Kontakt AgPd60 5 µm hartvergoldet : mittlere bis große Leistungen, 1 Schließer,

d12 draloric

Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

d12 draloric

Contextual Info: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC

B72540V1140S262

Abstract: CN2220S14BAUTOG VAR9307A K 250 VARISTOR
Contextual Info: Metal Oxide Varistors SMD Multilayer Varistor with AgPd Termination CN2220S14BAUTOG B72540V1140S262 Data Sheet Designation system: CN 2220 S.B 14 AUTO G = Chip Not molded = Dimensions of the device 22x20 length x width in 1/100 inch = Special tolerance B of the varistor voltage

Contextual Info: 2381 573 1. Vishay BCcomponents Surface Mount Multilayer Varistors FEATURES • • • • • • • • QUICK REFERENCE DATA PARAMETER VALUE UNIT DC 3.2 to 31 V AC 2.5 to 25 V Size 0603 1608M multilayer chip varistor with AgPd terminations. Maximum continuous voltage:

NTCS0805E3T

Contextual Info: 2381 615 1./NTCS0805E4. Vishay BCcomponents Surface Mount, NTC Thermistors FEATURES • TCR from 6 %/K to 2 %/K even at high temperatures • Tolerance on B25/85 down to 1 % • AgPd terminations • Suitable for wave or reflow soldering • Old part number was 2322 615 1.

Contextual Info: 2381 573 1. Vishay BCcomponents Surface Mount Multilayer Varistors FEATURES • • • • • • • • QUICK REFERENCE DATA PARAMETER VALUE UNIT DC 3.2 to 31 V AC 2.5 to 25 V Size 0603 1608M multilayer chip varistor with AgPd terminations. Maximum continuous voltage:

JEDEC 2a

Contextual Info: Datasheet CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: •      Chip Resistors in thick film technology AgPd termination for flip chip assembly face-down; for conductive epoxy assembly or Gold termination for wire bonding (US/TC; face-up) as well as flip chip

Contextual Info: THICK FILM CHIP RESISTORS T Y P E R C 7 3 CONSTRUCTION 1. Ceramic Substrate 2. Ru02 Resistor Film 3. Over Coating 4. Termination 1 AgPd 5. Termination 2 (Ni) 6. Termination 3 (Sn) DIMENSIONS Mark 2Y 2Z/2W 2X/2C/2P 2A/2D/2K 2B/2E 2F/2G 2H/2I 3A 3B EIA 0201

Contextual Info: Capacitors I Multi-Layer Ceramic Chip C apacitors.172 • MCH Series Solder plating T y p e .172 • MC Series (AgPd T y p e ).172 • MCS Series (Thin-film terminal electrode ve rs io n ). 173

Contextual Info: 0603 1608 drahtgewickelt (AgPd/Ni/Sn Metallisierung) 0603 (1608) wire-wound (AgPd/Ni/Sn Metallisation) - 18 - Allgemeine Eigenschaften zu den drahtgewickelten SMD-Spulen Bauform 0603 / Baureihe 5406 General Characteristics of Wirewound SMD Inductors Size 0603 / Series 5406

Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive gluing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

Contextual Info: Extract from the online catalog EMG 17-REL/KSR- 24/21AU BK Order No.: 2948416 Relay module, with soldered-in miniature switching relay, contact AgPd60 5 µm hard gold-plated : Medium to large loads, double A2

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Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)