AE3A Search Results

JESD22-A110-B HIGHLY ACCELERATED TEMPERATURE AND

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K480T30 + + –K – • >97% efficiency • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1165 W/in3 • <1 µs transient response • Small footprint – 280 W/in • >3.5 million hours MTBF

transistor af 126

Abstract: JESD22-B-107-A J-STD-029 mount chip transistor 332
Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T20 Vin = 42 - 53 V Vout = 10.5 - 13.25 V Iout = 17.0 A K = 1/4 Rout = 25 mΩ max • 48V to 12V V•I Chip Converter • >96% efficiency • 200 Watt 300 Watt for 1 mS • 125°C operation • High density – up to 800 W/in3

JESD22-A-103A

Abstract: jesd22-a-104B JESD22 A-102 JESD22-A-101 JESD22-B-107-A converter 48 to 24 switching
Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM V•I Chip – BCM Bus Converter Module TM B048K480T30 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 48 V V•I Chip Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms

48V-to-12V

Abstract: smd TRANSISTOR marking T1
Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T15 Vin = 42 - 53 V Vout = 10.5 - 13.25 V Iout = 12.5 A K = 1/4 Rout = 32 mΩ max • 48V to 12V V•I Chip Converter • >96% efficiency • 150 Watt 225 Watt for 1 ms • 125°C operation • High density – up to 600 W/in3

IPC 9701

Abstract: transistor marking JB
Contextual Info: BCM V•I Chip – BCM Bus Converter Module TM B048K480T30 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 48 V V•I Chip Converter • >97% efficiency • 300 Watt 450 Watt for 1 ms • 125°C operation + +

Contextual Info: 123234567898ABCD426EEEEEEF426EEEEEE 123234567898ABCD426EEEEEEF426EEEEEEF 123456789AB8CDEF E 6  8B8 66 RoHS 1324F 111AA 12342562789AB9 B CCCDE2FE25FDF5 서식번호 : SSC- QP- 7- 07- 12 Rev.00 123234567898ABCD426EEEEEEF426EEEEEE

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 A2 C!"3 A2EC!"38  4C6C#$%&'9 %  % 'C2  36*4F36+6123428654F4

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 A2 C!"3 A2EC!"38  4C6C#$%&'9 %  %

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 A2C 3 A2EC 38 11 4C6C!"#$9C 9E792D364538C%%9A29 69E73D9"C6DC399&7C39 69D388A29 '2" 4C6C!"#$9EC  

C6134

Contextual Info: 9  56BFB5!5  E5BFB "1#33!133$12%"#&8 123456789ABCDEAFBB3A488FD3BDED

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 A2C !3 A2EC !38 1 C2 *36+436,61234286544 (-./606( 1-6234606&56,61-676065 8819365:35*3 " F3D3511;4C3 " 5;D326%*4*6$<=;13*' " ?C93*2932

66c4

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 1 A9C !9E798CB9845F36 3E92D3645A"2 A9EC !39#7598CB8#74576$92D3645A"2 C2 *36+436,6E234286544 (-./606( 1-623460656,61-67606&5 8819365:35*3 % ;C93*2932

n666

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 A2C3 A2EC38 111 4C6C !"#$% 7C3969 D388A29 *2' 4C6C !"#$% 

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 A2 C!"3 A2EC!"38 111 F8#A $9 & F8#A $ &

Contextual Info: 242A4 3F#34AA242#EA4 3F#34 *B3CDE *F3CDE %&' % B1 242!A53CA 1234356789AF3CDEA"A42 EC3AA#4CA1F$34AA1 242!AC3CA 123456789ABCDEAFBB3A488FD3BDED

8E89

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 1111 4C6C !"# ! 4C6C !"# ! 'C2  36*4F36+6,23428654F4

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 11 A9C 9E798CB9845F363E92D3645A!2 A9EC 39"7598CB8"74576#92D3645A!2 C2 *36+436,6E23 4286544 (-./606( 1-623460656,61-676065 8819365:35*3 $ ;C93* 2932

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 11 A 9C!"9E798CB9845F36!3E92D3645 A#2 A 9EC!"39$7598CB 8$74576%92D3645 A#2 C2 *36+436,6E234286544 (-./606( 1-6234606&56,61-67606 5 8819365:35*3 & ;C93*2932

JESD22-A-103A

Abstract: JESD22-A-104B JESD22-A113-B V048K020T080 JESD22-A108B
Contextual Info: VTM V•I Chip – VTM Voltage Transformation Module TM • 48 V to 2 V V•I Chip Converter • 125°C operation • 80 A 120 A for 1 ms • 1 µs transient response V048K020T080 K indicates BGA configuration. For other mounting options see Part Numbering below.

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6  5C4578C73D36389C  57!59768 F39EC 3 D2 *36A436+6,234286544 (-./606&( 1-6234606&56+61-67606&5 B818365935*3 " :314*42373 " B24<D2832 B81465114D

Contextual Info: a Am4701 -45 Bidirectional 512x8 FIFO Am4701 BIFIFO Previously 67C4701 Advanced Micro Devices DISTINCTIVE CHARACTERISTICS • 2-512x6 FIFO buffer, provides asynchronous bidirectional full duplex communication. • Generates and detects framing bit. • Full and Empty Flags

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K480T30 + + –K – • >97% efficiency • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1165 W/in3 • <1 µs transient response • Small footprint – 280 W/in • >3.5 million hours MTBF

Contextual Info: VTM V•I Chip – VTM Voltage Transformation Module TM • 48 V to 1.5 V V•I Chip Converter • 125°C operation • 100 A 150 A for 1 ms • 1 µs transient response V048K015T100 K indicates BGA configuration. For other mounting options see Part Numbering below.

smd RO25

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T20 + + –K – • >96% efficiency • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – up to 800 W/in3 • 1 µs transient response • Small footprint – 200 W/in • >3.5 million hours MTBF