ADVANTAGE OF DUAL IN LINE PACKAGE Search Results

clare relay cup

Abstract: CLARE REED RELAY PRMA REED RELAY clare hgsm REED RELAY clare cUP solid state switches hgsm clare hgsm hgrm OptoMOS Surge Arresters
Contextual Info: Table of Contents Contents The Clare Advantage Page 4-5 Electromagnetic Relays CLAREification Chart Electromagnetic Relays DIP-14 (14 Pin Dual-In-Line Packages) MSS2, MSS7,PRMA, DSS7, PRME DIP-16 (16 Pin Dual-ln-Line Packages) HGZM, MSS6, LM, LX SIP (Single-ln-Line Packages) DSS4, MSS4

Contextual Info: 703-85XX Series Machined Pin SIL Socket CAMBION'S 703-85XX Series type single in-line sockets complement the standard low profile socket range with the advantage of allowing the user to choose pin centres according to his dual-in-line package requirements.

3x120-0075X2-SMD

Abstract: GMM 3x180-004x2 IXYS GMM 3x160-0055X2 Measurement of the circuit stray inductance L 3x100-01X1 single phase moulded bridges
Contextual Info: ISSN: 1863-5598 Electronics in Motion and Conversion ZKZ 64717 10-09 October 2009 COVER STORY ISOPLUS-DIL Series Designed for Highest Reliability The GWM series in ISOPLUS-DIL™ package Dual-In-Line has been developed to production standard. It is a transfer moulded module which combines the advantage of a

design of wireless data modem using fsk modulation

Abstract: plc modem using fsk 4 QAM modulator demodulator circuitry QAM FSK demodulator audio FSK modulator and Demodulator cmx869 keypad encoder caller id converter dtmf to fsk PLC modem 3V wireless keyboard circuit board
Contextual Info: CMX850 Communications Controller INNOVATIONS INV/Telecom/850/1 September 2002 - Single-Chip Embedded 80C51 µC with Integral V.22bis Modem - Embedded µController - V.22bis Modem - 3V Low-Power Operation with Advanced Power Management - 100-pin LQFP Package Enhanced 80C51 µC with Internal 8kB XRAM

Contextual Info: PJMBZ15V / PJMBZ27V DUAL TVS ZENER FOR ESD / TRANSIENT PROTECTION This Dual Zener ESD/Transient Protector with a Common Cathode,Configuration has been designed to protect Sensitive Equipment against,ESD and pevent Latch-Up events.The combination of a dual device protects up to two data lines in a single package giving the

MUR840

Abstract: ultrafast recovery dual rectifier RHRP8120 RHRU100120 Hyperfast Diode 1200V RURG8060 smps design 32V MUR1520 MUR820 RURD420
Contextual Info: FO-011.2 5/12/00 12:09 PM Page 1 I N T E R S I L C O R P O R AT I O N B U I L D I N G S I L I C O N A D V A N TA G E S F O R T EC H N O LO GY U LT R A F A S T A N D H Y P E R F A S T RECTIFIERS Intersil Corporation provides the silicon advantage in a burgeoning market

PEX8747

Abstract: PEX8747-AA PEX8747-AA80BC 8747 pcie X8 48-lane PEX 8747-BA RDK
Contextual Info: PEX 8747, PCI Express Gen 3 Switch, 48 Lanes, 5 Ports Highlights ƒ PEX 8747 General Features o 48-lane, 5-port PCIe Gen 3 switch - Integrated 8.0 GT/s SerDes o 27 x 27mm2, 676-pin FCBGA package o Typical Power: 8.0 Watts ƒ The ExpressLane PEX 8747 device offers Multi-Host PCI Express

PCRO

Abstract: HERLEY-CTI HERLEY-CTI PCRO oscillator Oscillators
Contextual Info: Coaxial Resonator Oscillators Features Š Š Š Š Š Š Š Frequencies from 300 MHz to 3 GHz Wide operating temperature Ultra low phase noise Low power consumption Phase lockable to references from 5 to 100 MHz Low loss high Q circuit Compact packages Options

13.56 MHz RFID tag

Abstract: Antenna Coil 13.56 MHz RFID design 13,56 MHz RFID Microchip Technology microID 13,56 passive rfid tags memory IOA2
Contextual Info: High-Performance 13.56 MHZ RFID Read/Write Tagging ICs Packaged in Popular IOA2 Module Microchip unveiled its new chip-on-board COB module package for its most advanced 13.56 MHz Read/Write microID tagging devices. The new MCRF450/7M combines the strengths of

"Microwave Diodes"

Abstract: DIODE SOT-23 PACKAGE APN1001 pin diode microstrip power diode package Design with PIN diode alpha
Contextual Info: Application Note Circuit Models for Plastic Packaged Microwave Diodes APN1001 Abstract This paper reports on the measurement and establishment of circuit models for SOT-23 and SOD-323 packaged diodes. Results indicate that the 1.5 nH estimate for the SOT-23 is a useful result as is 1.2 nH for SOD-323

TSH24

Abstract: TSH24I
Contextual Info: TSH24 HIGH PERFORMANCE QUAD BIPOLAR OPERATIONAL AMPLIFIER • HIGH GAIN BANDWIDTH PRODUCT : 25MHz ■ HIGH SLEW RATE : 15V/µs ■ SINGLE OR DUAL SUPPLY OPERATION : 3V TO 30V ±1.5V to ±15V ■ LOW VOLTAGE NOISE : 14nV/√Hz N DIP14 (Plastic Package) ■ NO PHASE INVERSION

TSH22

Abstract: TSH22I
Contextual Info: TSH22 HIGH PERFORMANCE DUAL BIPOLAR OPERATINAL AMPLIFIER • HIGH GAIN BANDWIDTH PRODUCT : 25MHz ■ HIGH SLEW RATE : 15V/µs ■ SINGLE OR DUAL SUPPLY OPERATION : 3V TO 30V ±1.5V to ±15V ■ LOW VOLTAGE NOISE : 14nV/√Hz N DIP8 (Plastic Package) ■ NO PHASE INVERSION

Si9405

Abstract: dual mosfet so8 ic AN803 Si9400 Si9410 "leadframe material" DIP
Contextual Info: AN803 Thermal Characteristics of Siliconix’s LITTLE FOOTr Family of Surface-Mount MOSFETs Jim Harnden Although a wide selection of digital and linear ICs have been available in surface-mount packages for some time, circuits that require power devices have, for the most part,

dual mosfet so8 ic

Abstract: AN803 Si9400 Si9405 Si9410
Contextual Info: AN803 Siliconix Thermal Characteristics of Siliconix's LITTLE FOOTr Family of SurfaceĆMount MOSFETs Jim Harnden Although a wide selection of digital and linear ICs have been available in surfaceĆmount packages for some time, circuits that require power devices have,

cd4000 cmos logic series guide

Abstract: harris CD4011BE 16XXX CD74FCT257 CD74FCT2573 ic cd4000 SN 74 ABT H 163 163XXX CD74LPT244 74FCT7623
Contextual Info: FCT Logic Competitive Nomenclature Guide EX: CD74FCT162249ATMT MFG ID TEMP FAMILY PART # SPEED OUTPUT LVL PACKAGE HARRIS CD 74 FCT XXX 16XXX 162XXX 163XXX 2XXX BLANK A B C D E T E = PDIP EN = NARROW PDIP H = CHIP M = 300 MIL SOIC NM = 150 MIL SOIC QM = QSOP

Contextual Info: TSH22 HIGH PERFORMANCE DUAL BIPOLAR OPERATINAL AMPLIFIER • HIGH GAIN BANDWIDTH PRODUCT : 25MHz ■ HIGH SLEW RATE : 15V/µs ■ SINGLE OR DUAL SUPPLY OPERATION : 3V TO 30V ±1.5V to ±15V ■ LOW VOLTAGE NOISE : 14nV/√Hz N DIP8 (Plastic Package) ■ NO PHASE INVERSION

Si9405

Abstract: Si9410 AN803 Si9400 si9420
Contextual Info: AN803 Thermal Characteristics of Siliconix’s LITTLE FOOTr Family of Surface-Mount MOSFETs Jim Harnden Although a wide selection of digital and linear ICs have been available in surface-mount packages for some time, circuits that require power devices have, for the most part,

70593

Abstract: SI9420 Vishay SI9410 SI9400 AN803 Si9405 Si9410 dual mosfet so8 ic
Contextual Info: AN803 Vishay Siliconix Thermal Characteristics of Vishay Siliconix’s LITTLE FOOTR Family of Surface-Mount MOSFETs Although a wide selection of digital and linear ICs have been available in surface-mount packages for some time, circuits that require power devices have, for the most part, required

TSH22

Abstract: STMicroelectronics TSH22I
Contextual Info: TSH22 HIGH PERFORMANCE DUAL BIPOLAR OPERATINAL AMPLIFIER • HIGH GAIN BANDWIDTH PRODUCT : 25MHz ■ HIGH SLEW RATE : 15V/µs ■ SINGLE OR DUAL SUPPLY OPERATION : 3V TO 30V ±1.5V to ±15V ■ LOW VOLTAGE NOISE : 14nV/√Hz N DIP8 (Plastic Package) ■ NO PHASE INVERSION

ElA-485

Abstract: NM485D 300C EIA-422 EIA-485 E1A-485 BA485
Contextual Info: [pT^rbXpTnY^ NM485D Isolated Dual EIA-485 Driver and Receiver □ Single 5 Volt supply DuaJ-In-Line Package top view □ No external components □ Thermal shutdown protection □ EIA-485 and CCITT V.10, V.11 compatible 1B □ 23 1A VC C 3£ □ 22 2A 2B

Contextual Info: Data Sheet 40A Switching Digital DC Power Supply Model 1692 The B&K 1692 Switching Mode DC Power Supply provides high current output in a lightweight and compact package. It is suitable for a variety of uses, especially for powering DC operated mobile radio

stm varistor

Abstract: 510ns sot883 ta0324 varistor STM
Contextual Info: TA0324 TECHNICAL ARTICLE ESD protection improvement in cellular handsets 1 Need for ESD protection As the wireless market continues to evolve, the next mobile phone generation requires increased functionality with new features like cameras, storage memory cards, FM radio, etc…

an216 honeywell

Abstract: HMC1052L AN216 Die Attach epoxy stamping finger print sensor pcb with circuit CERAMIC LEADLESS CHIP CARRIER LCC 24 Soldering guidelines pin in paste CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC honeywell amr
Contextual Info: AN216 SENSOR PRODUCTS APPLICATION NOTE MOUNTING TIPS FOR LCC MAGNETIC SENSORS ABSTRACT LCC PACKAGE HANDLING Some of Honeywell’s Anisotropic Magneto-Resistive AMR sensors are packaged in Leadless Chip Carrier (LCC) components for surface-mount attachment to

Contextual Info: M2R-25-4-1-TL Optical Gigabit Ethernet/Fibre Channel 850nm SFF 2x5 Dual Receivers - 1.25/1.0625GBaud - +3.3V  Features ! 1.25 Gbps Gigabit Ethernet Compliant ! Metalized Plastic Package ! TTL Signal Detect output ! AC coupled PECL level outputs ! Low profile fits Mezzanine Card Applications