ABRACON MULTILAYER CHIP Search Results

Contextual Info: Abracon PTM Introduction to AMCA Series Ceramic Multilayer Chip Antennas Crystals Oscillators Filters Precision Timing Inductors WWW.ABRACON.COM WWW.ABRACON.COM AMCA Series Multilayer Chip Antennas Purpose To introduce AMCA Series, Multilayer Chip Antennas.

Contextual Info: AMCA Series - Multilayer Chip Antenna Application Note AMCA31, AMCA52, AMCA62, AMCA72, AMCA81, & AMCA92 Series Abracon Drawing # 453782 Date of Issue: 10/16/13 Page 1 of (16) Revision #: Initial Release Source Control Drawing AMCA Series – Multilayer Chip Antenna

Contextual Info: Abracon PTM Introduction to AIML, AIAC and AISM Inductor Crystals Oscillators Filters Precision Timing Inductors WWW.ABRACON.COM WWW.ABRACON.COM AIML, AIAC and AISM Inductors Purpose To introduce AIML Multilayer Ferrite , AIAC (Air Coil) and AISM (Molded Ferrite Wire wound) chip Inductors.

Contextual Info: Shielded Beads ABRACON MULTILAYER SURFACE MOUNT C O R P O R A T I O N ACB Series * ♦ € H H—D K- Part Number DIMA DIMB DIM C DIM D ACB0805MB ACB0805MA ACB1206MC ACB1206MD ACB1206ME ACB 1206MB ACB1206MA ACB 1210MB ACB1210MA ACB 1806MB ACB1812MB ACB1812MA

Contextual Info: HIGH-CURRENT MULTILAYER FERRITE CHIP BEAD ACML-0402H RoHS MSL level: 2 This product is packed with dry packaging FEATURES: • Multilayer monolithic structure yields high reliability • Unique terminal electrode structure ensures permissable currents • High impedence over a wide frequency range

Contextual Info: HIGH-CURRENT MULTILAYER FERRITE CHIP BEAD ACML-0402H RoHS Compliant FEATURES: • Multilayer monolithic structure yields high reliability • Unique terminal electrode structure ensures permissable currents • High impedence over a wide frequency range 1.0 x 0.5 x 0.5mm

Contextual Info: MULTILAYER FERRITE CHIP BEAD ACML-0603 Pb RoHS/RoHS II Compliant 1.00 x 0.80 x 0.80mm | | | | | | | | | | | | | | | FEATURES: • Magnetic shielded structure designed to minimize crosstalk • Multilayer monolithic structure yields high reliability • Substantial EMI suppression from dozens of MHz to hundreds of MHz

INDUCTOR CHIP FERRITE BEAD 0805

Abstract: hp4263A ACML-0805-121
Contextual Info: 0805 Multilayer Ferrite Chip Bead ACML-0805 Pb RoHS Compliant FEATURES: 2.00 x 1.25 x 0.85mm | | | | | | | | | | | | | | | APPLICATIONS: • Video equipment, audio equipment • Automotive electrical equipment • Communication equipment • OA equipment and other

ASMPH-0805

Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0805 RoHS/RoHS II Compliant Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance

Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0806 RoHS/RoHS II Compliant Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance

ASMPH-0806

Abstract: HP6632B
Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0806 RoHS/RoHS II Compliant Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance

Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0603 Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance • Magnetically shielded structure to eliminate cross coupling

Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0805 RoHS/RoHS II Compliant Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance

Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-1008 RoHS/RoHS II Compliant Pb 2.5 x 2.0 x 0.9mm APPLICATIONS: FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance

ASMPH-0603

Abstract: 20-15C
Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0603 Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance • Magnetically shielded structure to eliminate cross coupling

ASMPH-1008

Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-1008 RoHS/RoHS II Compliant Pb 2.5 x 2.0 x 0.9mm APPLICATIONS: FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance

Contextual Info: 0805 Multilayer Ferrite Chip Bead ACML-0805 Pb RoHS Compliant 2.00 x 1.25 x 0.85m m | | | | | | | | | | | | | APPLICATIONS: FEATURES: • Video equipment, audio equipment • Automotive electrical equipment • Communication equipment • OA equipment and other

Contextual Info: MULTILAYER FERRITE CHIP BEAD ACML-0402 Pb RoHS Compliant 1.0 x 0.5 x 0.5mm | | | | | | | | | | | | | | | FEATURES: APPLICATIONS: • Multilayer monolithic structure yields high reliability • Substantial EMI suppression over a wide frequency range • Excellent solderability and heat resistance

hp4263A

Contextual Info: MULTILAYER FERRITE CHIP BEAD ACML-0603 Pb RoHS Compliant FEATURES: APPLICATIONS: • Multilayer monolithic structure yields high reliability • Unique terminal electrode structure ensures permissable currents • High impedence over a wide frequency range

Contextual Info: Multilayer Ferrite Chip Bead High Current ACML-0805H Pb FEATURES: • Multilayer monolithic structure yields high reliability • Unique terminal electrode structure ensures permissable currents • High impedence over a wide frequency range RoHS/RoHS II compliant

HP4291

Contextual Info: MULTILAYER FERRITE CHIP BEAD ACML-0402 Pb RoHS Compliant 1.0 x 0.5 x 0.5mm | | | | | | | | | | | | | | | FEATURES: APPLICATIONS: • Multilayer monolithic structure yields high reliability • Substantial EMI suppression over a wide frequency range • Excellent solderability and heat resistance

HP4291

Contextual Info: 1206 Multilayer Ferrite Chip Bead ACML-1206 Pb RoHS Compliant FEATURES: APPLICATIONS: • Multilayer monolithic construction yields high reliability • Nickel barrier terminations provide excellent solder heat resistance • Suitable for flow and RoHS reflow soldering

Contextual Info: MULTILAYER FERRITE CHIP BEAD ACML-0402 Pb RoHS Compliant 1.0 x 0.5 x 0.5mm | | | | | | | | | | | | | | | FEATURES: APPLICATIONS: • Multilayer monolithic structure yields high reliability • Substantial EMI suppression over a wide frequency range • Excellent solderability and heat resistance

Contextual Info: 0805 Multilayer Ferrite Chip Bead ACML-0805 Pb RoHS/RoHS II compliant 2.00 x 1.25 x 0.85m m | | | | | | | | | | | | | FEATURES: • Multilayer monolithic construction yields high reliability • Nickel barrier terminations provide excellent solder heat resistance