ABLEBOND 8380 Search Results

ABLEBOND 8380 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
83808-21000		Amphenol Communications Solutions	Shield (Type II) 1xI/O	PDF
83808-10000S		Amphenol Communications Solutions	Shield (Type I) closed end	PDF
83808-22110S		Amphenol Communications Solutions	Shield (Type II ) 2xI/O, with shield insulator and label recess	PDF
83808-21010		Amphenol Communications Solutions	Shield (Type II) 1xI/O, with shield insulator	PDF
83808-20000S		Amphenol Communications Solutions	Shield (Type II) closed end	PDF

ABLEBOND 8380 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Ablebond 8380 Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716 Contextual Info: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is	Original	ANSI/J-STD-001, Ablebond 8380 X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716	PDF
Ablebond 8380 Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide Contextual Info: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These	Original		PDF
Ablebond 8380 Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping Contextual Info: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that	Original	CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping	PDF
ablebond 8380 Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING Contextual Info: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized	Original	IPC-SM-782A J-STD-001 ablebond 8380 land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING	PDF
Ablebond 8380 Abstract: Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond APN3001 Contextual Info: Application Note Epoxy Die Attachment for GaAs Flip Chip Devices APN3001 A major concern in developing a process using epoxy as the attachment material for assembly is the exposure to temperatures and subsequent cooling during epoxy curing or the ability of the epoxy to withstand temperature cycling.	Original	APN3001 6/99A Ablebond 8380 Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond APN3001	PDF
Die Attach epoxy stamping Abstract: Ablebond 8380 APN3001 Contextual Info: APPLICATION NOTE APN3001: Epoxy Die Attachment for GaAs Flip Chip Devices This application note describes the recommended method for die attachment of GaAs flip chip devices. A major concern in developing a process using epoxy as the attachment material for	Original	APN3001: Die Attach epoxy stamping Ablebond 8380 APN3001	PDF
Ablebond 8380 Abstract: Ablestick 8380 DMK8001-000 Alpha DMK2790 8380 DMK2308-000 DMK2790-000 Contextual Info: •Alpha GaAs Flip Chip Schottky Diodes DMK2790-000, DMK2308-000, DMK8001-000 Features Single - DMK2790-000 tx: ■ Designed for High Volume Designs ■ High Frequency 20-100 GHz m ■ Exceeds Environmental Requirements for MIC & Hybrid Applications fsri	OCR Scan	DMK2790-000, DMK2308-000, DMK8001-000 8/99A Ablebond 8380 Ablestick 8380 DMK8001-000 Alpha DMK2790 8380 DMK2308-000 DMK2790-000	PDF
Ablebond 8380 Abstract: Ablestick 8380 VCT-20 w625c Contextual Info: GaAs Flip Chip Schottky Diodes DMK2790-000, DMK2308-000, DMK8001-000 Features Single - DMK2790-000 • Designed for High Volume Designs ■ High Frequency 20–100 GHz ■ Exceeds Environmental Requirements for MIC & Hybrid Applications Anti-Parallel - DMK2308-000	Original	DMK2790-000, DMK2308-000, DMK8001-000 DMK2308-000 DMK2790-000 8/99A Ablebond 8380 Ablestick 8380 VCT-20 w625c	PDF
Ablebond 8380 Abstract: Ablestick 8380 DMK2308-000 DMK2783-000 DMK2790-000 DMK8001-000 diodes in mil grade Contextual Info: GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 • Designed for High Volume Designs ■ High Frequency 20–100 GHz ■ Exceeds Environmental Requirements for MIC & Hybrid Applications Anti-Parallel - DMK2308-000 ■ Designed for Low Junction Capacitance	Original	DMK2783-000, DMK2790-000 DMK2308-000 DMK8001-000 12/02A Ablebond 8380 Ablestick 8380 DMK2308-000 DMK2783-000 DMK2790-000 DMK8001-000 diodes in mil grade	PDF
Ablebond 8380 Contextual Info: GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 • Designed for High Volume Designs ■ High Frequency 20–100 GHz ■ Exceeds Environmental Requirements for MIC & Hybrid Applications Anti-Parallel - DMK2308-000 ■ Designed for Low Junction Capacitance	Original	DMK8001-000 DMK2308-000 DMK2783-000, DMK2790-000 3/00A Ablebond 8380	PDF
Ablebond 8380 Abstract: Ablestick 8380 DMK2308-000 DMK2783-000 DMK2790-000 DMK8001-000 B183 Contextual Info: GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 • Designed for High Volume Designs ■ High Frequency 20–100 GHz ■ Exceeds Environmental Requirements for MIC & Hybrid Applications Anti-Parallel - DMK2308-000 ■ Designed for Low Junction Capacitance	Original	DMK2783-000, DMK2790-000 DMK2308-000 DMK8001-000 leadle005 3/00A Ablebond 8380 Ablestick 8380 DMK2308-000 DMK2783-000 DMK2790-000 DMK8001-000 B183	PDF
w76l Abstract: 9m50 Contextual Info: Mai nSyst em Opt i on SECCode Loc at i on Name Descr i pt i on Uni t I C0902002197 T7300 2. 0GHz CPU MI CROPROCESSOR; LF80537GG0414M, 2. 0GHz, uFCPGA, 479P, TR, PLASTI C, 1. 05V, 34W, 0t o+10 PC 0C, 4MB, Mer om T7300, FSB800, 4M I CDRAM MODULE; M470T6554,	Original		PDF