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    JEDEC JESD22-B116 free

    Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
    Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SR-0212-02 DATE: 12/20/2002 Product Affected: TSOP package family (see attachment for affected part #s). Date Effective: 3/20/2003 Contact: George Snell


    Original     		SR-0212-02 EME-G700 JEDEC JESD22-B116 free SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time PDF

    ph44

    Abstract: Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
    Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-04 Product Affected: All Plastic packages Product Mark Back Mark


    Original     		G9911-04 Mil-Std-883, S-7390) S-7383 ph44 Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025 PDF